Abstract: The present disclosure relates to a boron compound useful in an organic light-emitting diode and an organic light-emitting diode comprising same and, more particularly, to a boron compound represented by any one of [Chemical Formula A], wherein [Chemical Formula A] is as defined in the description.

Abstract: A display apparatus can include a flexible substrate including a penetrating hole, a first thin film transistor including a first semiconductor layer, a second thin film transistor including a second semiconductor layer, and a first planarization layer on the first and second thin film transistors. The display apparatus can include a connection electrode on the first planarization layer electrically connected to the first or second thin film transistor, a second planarization layer on the first planarization layer, a first electrode on the second planarization layer electrically connected to the connection electrode, and a bank layer on the second planarization layer exposing a portion of the first electrode. The display apparatus includes a light-emitting layer on the portion of the first electrode exposed by the bank layer, the light-emitting layer including an emission material layer between first and second organic layers, and a second electrode on the light-emitting layer.

Abstract: A display apparatus can include a buffer layer on a flexible substrate; a first thin film transistor on the buffer layer including a first semiconductor pattern, a first gate electrode, a first source electrode and a first drain electrode, a second thin film transistor including a second semiconductor pattern, a second gate electrode, a second source electrode and a second drain electrode, and a passivation layer on the first and the second thin film transistors. Also, the display apparatus includes a planarization layer, a light-emitting device including a first electrode, a light-emitting layer and a second electrode on the planarization layer, and an encapsulating element on the light-emitting device. Also, the light-emitting device is electrically connected to the first thin film transistor, the first semiconductor pattern includes silicon, and the second semiconductor pattern includes an oxide semiconductor pattern, and the second gate electrode includes lower and upper electrodes.

Abstract: Disclosed is a polycyclic aromatic compound that can be employed in an organic layer of an organic electroluminescent device. Also disclosed is a highly efficient organic electroluminescent device including the polycyclic aromatic compound. The use of the polycyclic aromatic compound significantly improves the luminous efficiency of the device.

Abstract: Disclosed are an apparatus and a method for Internet of Things (IoT) device security. The method includes unifying a port in a first IoT device for communication, receiving, by the first IoT device, a packet from a second IoT device through the port, identifying whether the packet in the first IoT device is in a preset packet form, verifying content of the packet in the first IoT device when the packet is in the preset packet form, and opening the port for providing a service in the first IoT device when the verifying of the packet content is successful.

Abstract: An electronic device includes a substrate having a conductive structure with a substrate outward terminal at a second side of the substrate. A dielectric structure with an opening is adjacent to the second side. An electronic component is coupled to the substrate and an encapsulant encapsulates the electronic component. The substrate outward terminal comprises a multi-via terminal or a multi-stage via. The multi-via terminal includes pad conductive vias in the opening, a pad dielectric via interposed between the pad conductive vias, and a conductor comprising a conductor top side with micro dimples over the pad conductive vias and the pad dielectric via. The multi-stage terminal includes a pad base within the opening having a top side recessed below an upper surface the dielectric and a pad head coupled to the pad base within the opening, the pad head having a top side with a micro dimple.

Abstract: In one example, an electronic device includes a substrate having a conductive structure. The conductive structure includes a substrate inward terminal at a first side of the substrate and a substrate outward terminal at a second side of the substrate. The substrate includes a dielectric structure with a first opening is at the second side. An electronic component is at the first side of the substrate and is electrically coupled to the substrate inward terminal, and an encapsulant encapsulates the electronic component. The substrate outward terminal comprises one of a multi-via terminal or a multi-stage via. The multi-via terminal includes pad conductive vias in the first opening a pad dielectric via interposed between the pad conductive vias in the first opening and a conductor comprising a conductor top side with micro dimples over the pad conductive vias and the pad dielectric via.

Abstract: Provided are an apparatus and method for performing remote attestation by taking into account mobility. The method includes obtaining, by each node constituting a network, a remote attestation result value by performing self-remote attestation, obtaining, by each of the nodes, remote attestation result values from the other nodes by broadcasting the obtained remote attestation result value to at least one neighboring node, and monitoring, by each of the nodes, remote attestation of each of the nodes on the basis of the obtained remote attestation result values of the nodes.

Abstract: In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.

Abstract: Disclosed herein are an apparatus for determining a device group to be isolated using similarity of features between devices and a method using the apparatus. The method includes generating device groups in consideration of respective features of all devices, generating a security threat device group based on devices in which a security threat has occurred, among all of the devices, calculating the cosine similarity between the security threat device group and all of the device groups, and determining at least one device group to be isolated, among all of the device groups, in consideration of the cosine similarity.

Abstract: In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.

Abstract: Disclosed are an apparatus and a method for Internet of Things (IoT) device security. The method includes unifying a port in a first IoT device for communication, receiving, by the first IoT device, a packet from a second IoT device through the port, identifying whether the packet in the first IoT device is in a preset packet form, verifying content of the packet in the first IoT device when the packet is in the preset packet form, and opening the port for providing a service in the first IoT device when the verifying of the packet content is successful.

Abstract: Disclosed herein are an apparatus and method for managing remote attestation. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program may request a gateway to verify the integrity of devices connected with the gateway, receive a verification result about whether the integrity of the devices is damaged from the gateway, identify a device, the integrity of which is damaged, using the verification result, perform detailed integrity verification on the device, the integrity of which is damaged, in order to identify an object, the integrity of which is damaged, and perform an operation for responding to the object, the integrity of which is damaged.

Abstract: In one example, an electronic device includes a substrate having a conductive structure. The conductive structure includes a substrate inward terminal at a first side of the substrate and a substrate outward terminal at a second side of the substrate. The substrate includes a dielectric structure with a first opening is at the second side. An electronic component is at the first side of the substrate and is electrically coupled to the substrate inward terminal, and an encapsulant encapsulates the electronic component. The substrate outward terminal comprises one of a multi-via terminal or a multi-stage via. The multi-via terminal includes pad conductive vias in the first opening a pad dielectric via interposed between the pad conductive vias in the first opening and a conductor comprising a conductor top side with micro dimples over the pad conductive vias and the pad dielectric via.

Abstract: Disclosed herein are a dynamic segmentation apparatus and method for preventing a spread of a security threat. The dynamic segmentation apparatus includes one or more processors and execution memory for storing at least one program executed by the processors, wherein the program is configured to register feature information of a first device, which is a target for which a security threat is to be managed, generate a first segment from the feature information of the first device, receive security threat information from an external system, extract feature information of a second device, in which a security threat has occurred, from the security threat information, perform clustering on the feature information of the second device using at least one clustering algorithm, generate at least one segment set by identifying segments from clustering results, and determine a security threat segment based on an inclusion relationship between segments in the segment set.

Abstract: Disclosed herein are an apparatus and method for providing sensor data in a sensor device based on a blockchain. A method for providing sensor data in a sensor device based on a blockchain may include creating a device record using encrypted device identification information, registering the device record in the blockchain, creating an event record using event information collected from a sensor, registering the header of the event record, including information about a link to the device record, in the blockchain, and distributing the body of the event record, the body being linked to the header of the event record.

Abstract: In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.