Patents by Inventor Kyle Damborsky
Kyle Damborsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11894499Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and lens arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips on a submount with a lens positioned on the submount to form a cavity. The one or more LED chips may reside in the cavity without direct encapsulation materials that would otherwise contact the one or more LED chips and any corresponding wirebonds. In this manner, the one or more LED chips may be driven with higher drive currents while reducing degradation and mechanical strain effects related to differences in coefficients of thermal expansion with typical encapsulant materials. LED packages may also be configured with one or more apertures that allow air flow between an interior volume of a cavity and an ambient environment outside the LED package to promote heat dissipation at higher drive currents.Type: GrantFiled: July 1, 2020Date of Patent: February 6, 2024Assignee: CreeLED, Inc.Inventors: Robert Wilcox, Derek Miller, Kyle Damborsky, Aaron Francis, Colin Blakely
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Publication number: 20230106479Abstract: Multiple-junction light-emitting diodes (LEDs), and more particularly lumiphoric material arrangements for multiple-junction LEDs are disclosed. LEDs may refer to multiple-junction LED chips and/or LED packages that include multiple-junction LED chips. Individual lumiphoric material regions may be arranged in positions that are registered with individual junctions of a multiple-junction LED chip. The lumiphoric material regions may be formed at the LED chip level and/or at the LED package level. Different ones of the lumiphoric material regions may be configured to provide different wavelengths in response to recipient light emitted by junctions of the LED chip. In this manner, a single multiple-junction LED chip according to the present disclosure may be capable of providing a plurality of different emission colors and/or wavelengths.Type: ApplicationFiled: October 5, 2021Publication date: April 6, 2023Inventors: Morgan Meadows Davis, Colin Blakely, Kyle Damborsky, Michael Check
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Patent number: 11552229Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.Type: GrantFiled: September 14, 2020Date of Patent: January 10, 2023Assignee: CreeLED, Inc.Inventors: Kyle Damborsky, Ayush Tripathi, Robert Wilcox, Sarah Trinkle, Colin Blakely
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Patent number: 11510294Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.Type: GrantFiled: July 1, 2021Date of Patent: November 22, 2022Assignee: CreeLED, Inc.Inventors: Aaron Francis, Kyle Damborsky, Robert Wilcox, Jasper Cabalu, Colin Blakely
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Patent number: 11411148Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: GrantFiled: September 10, 2020Date of Patent: August 9, 2022Assignee: CreeLED, Inc.Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Publication number: 20220085258Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.Type: ApplicationFiled: September 14, 2020Publication date: March 17, 2022Inventors: Kyle Damborsky, Ayush Tripathi, Robert Wilcox, Sarah Trinkle, Colin Blakely
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Publication number: 20220045253Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and LED packages are disclosed. LED packages are provided with improved thermal and/or electrical coupling between LED chips and submounts or lead frames. Various configurations of submounts with via arrangements are disclosed to provide improved coupling between LED chips and submounts. LED chip contacts are disclosed with one or more openings that are registered with vias to provide more uniform mounting. Multiple LED chips may be arranged around a thermally conductive element on a submount, and a via in the submount may be registered with the thermally conductive element. Subassemblies are provided between LED chips and lead frames to improve electrical and thermal coupling. Underfill materials may be arranged between LED chips and lead frames to provide improved mechanical support.Type: ApplicationFiled: October 21, 2021Publication date: February 10, 2022Inventors: Arthur F. Pun, Colin Blakely, Kyle Damborsky, Jae-Hyung Jeremiah Park
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Publication number: 20220005987Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and lens arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips on a submount with a lens positioned on the submount to form a cavity. The one or more LED chips may reside in the cavity without direct encapsulation materials that would otherwise contact the one or more LED chips and any corresponding wirebonds. In this manner, the one or more LED chips may be driven with higher drive currents while reducing degradation and mechanical strain effects related to differences in coefficients of thermal expansion with typical encapsulant materials. LED packages may also be configured with one or more apertures that allow air flow between an interior volume of a cavity and an ambient environment outside the LED package to promote heat dissipation at higher drive currents.Type: ApplicationFiled: July 1, 2020Publication date: January 6, 2022Inventors: Robert Wilcox, Derek Miller, Kyle Damborsky, Aaron Francis, Colin Blakely
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Patent number: 11189766Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and LED packages are disclosed. LED packages are provided with improved thermal and/or electrical coupling between LED chips and submounts or lead frames. Various configurations of submounts with via arrangements are disclosed to provide improved coupling between LED chips and submounts. LED chip contacts are disclosed with one or more openings that are registered with vias to provide more uniform mounting. Multiple LED chips may be arranged around a thermally conductive element on a submount, and a via in the submount may be registered with the thermally conductive element. Subassemblies are provided between LED chips and lead frames to improve electrical and thermal coupling. Underfill materials may be arranged between LED chips and lead frames to provide improved mechanical support.Type: GrantFiled: January 16, 2019Date of Patent: November 30, 2021Assignee: CreeLED, Inc.Inventors: Arthur F. Pun, Colin Blakely, Kyle Damborsky, Jae-Hyung Jeremiah Park
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Publication number: 20210329758Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.Type: ApplicationFiled: July 1, 2021Publication date: October 21, 2021Inventors: Aaron Francis, Kyle Damborsky, Robert Wilcox, Jasper Cabalu, Colin Blakely
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Patent number: 11107857Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. A least a portion of the plurality of walls of the retention material can comprise a translucent material, a reflective material, and/or a light-absorbing material. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.Type: GrantFiled: March 5, 2018Date of Patent: August 31, 2021Assignee: CreeLED, Inc.Inventors: Colin Kelly Blakely, Jasper Sicat Cabalu, Kyle Damborsky
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Patent number: 11101248Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.Type: GrantFiled: August 18, 2017Date of Patent: August 24, 2021Assignee: CreeLED, Inc.Inventors: Colin Kelly Blakely, Jasper Sicat Cabalu, Kyle Damborsky
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Patent number: 11083059Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.Type: GrantFiled: October 3, 2019Date of Patent: August 3, 2021Assignee: CreeLED, Inc.Inventors: Aaron Francis, Kyle Damborsky, Robert Wilcox, Jasper Cabalu, Colin Blakely
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Publication number: 20210105873Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.Type: ApplicationFiled: October 3, 2019Publication date: April 8, 2021Inventors: Aaron Francis, Kyle Damborsky, Robert Wilcox, Jasper Cabalu, Colin Blakely
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Publication number: 20210005793Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: ApplicationFiled: September 10, 2020Publication date: January 7, 2021Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Patent number: 10811573Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: GrantFiled: November 18, 2019Date of Patent: October 20, 2020Assignee: Cree, Inc.Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Publication number: 20200227603Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and LED packages are disclosed. LED packages are provided with improved thermal and/or electrical coupling between LED chips and submounts or lead frames. Various configurations of submounts with via arrangements are disclosed to provide improved coupling between LED chips and submounts. LED chip contacts are disclosed with one or more openings that are registered with vias to provide more uniform mounting. Multiple LED chips may be arranged around a thermally conductive element on a submount, and a via in the submount may be registered with the thermally conductive element. Subassemblies are provided between LED chips and lead frames to improve electrical and thermal coupling. Underfill materials may be arranged between LED chips and lead frames to provide improved mechanical support.Type: ApplicationFiled: January 16, 2019Publication date: July 16, 2020Inventors: Arthur F. Pun, Colin Blakely, Kyle Damborsky, Jae-Hyung Jeremiah Park
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Publication number: 20200105984Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: ApplicationFiled: November 18, 2019Publication date: April 2, 2020Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Patent number: 10522722Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.Type: GrantFiled: April 19, 2018Date of Patent: December 31, 2019Assignee: Cree, Inc.Inventors: Kyle Damborsky, Derek Miller, Jack Vu, Peter Scott Andrews, Jasper Cabalu, Colin Blakely, Jesse Reiherzer
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Patent number: D1000400Type: GrantFiled: April 16, 2021Date of Patent: October 3, 2023Assignee: CreeLED, Inc.Inventors: Robert Wilcox, Sarah Trinkle, Kyle Damborsky, Colin Blakely, Ayush Tripathi