Abstract: Particular embodiments described herein provide for a base, a plurality of fiducials on the base, and a fluid in one or more of each of the plurality of fiducials to increase recognition of each of the one or more fiducials that includes the fluid by one or more pattern recognition devices. In an example, the fluid is an epoxy and the fiducials are used to determine a placement of components in a component space.

Abstract: Particular embodiments described herein provide for a base, a plurality of fiducials on the base, and a fluid in one or more of each of the plurality of fiducials to increase recognition of each of the one or more fiducials that includes the fluid by one or more pattern recognition devices. In an example, the fluid is an epoxy and the fiducials are used to determine a placement of components in a component space.

Abstract: A thermal heat for integrated circuit die processing is described that includes a thermal barrier. In one example, the thermal head has a ceramic heater configured to carry an integrated circuit die, a metal base, and a thermal barrier between the heater and the base.

Abstract: A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for vacuum lamination of a depth-sensing camera module PCB to a stiffener using built-in vacuum channels.