Abstract: A semiconductor device includes a substrate having a first region and a second region, first active fins that extend in a first direction in the first region, second active fins that extend in the first direction in the second region, a first field insulating layer between the first active fins and that extend in a second direction, a second field insulating layer between the second active fins and extending in the second direction, a gate line that extends in the second direction on the second field insulating layer, the gate line linearly along with the first field insulating layer, a gate isolation layer between the first field insulating layer and the gate line, and gate spacers that extend in the second direction, the gate spacers in contact with both sidewalls of each of the first field insulating layer, the gate line, and the gate isolation layer.

Abstract: A photocurable composition includes (A) a photocurable monomer and (B) a silicon-containing monomer or oligomer thereof, the silicon-containing monomer being represented by Formula 1

Abstract: The present invention relates to: a photocurable composition containing (A) a photocurable monomer and (B) a monomer containing phosphorus and an amide group; and a device including a barrier layer formed of the composition.

Abstract: A solar cell includes a silicon substrate and an electrode on the silicon substrate. The silicon substrate includes at least 5 raised portions having a cross-sectional height (h) of about 50 nm or more per 5 ?m length. The electrode is formed from a composition for solar cell electrodes having a water contact angle of about 15° to about 60°.

Abstract: A composition for encapsulation of an organic light emitting diode and an organic light emitting diode display manufactured using the same. The composition for encapsulation includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate; about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate; about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate; and about 1 wt % to about 10 wt % of (D) an initiator, wherein the (B) silicon-based di(meth)acrylate is represented by Formula 1.

Abstract: The present invention relates to a photocurable composition including (A) a photocurable monomer, (B) a monomer of chemical formula 1 or an oligomer thereof and (C) an initiator, a barrier layer including the same and an enveloped device including the same.

Abstract: A composition for encapsulating an organic light emitting diode device and an organic light emitting diode display, the composition including a di(meth)acrylate including an unsubstituted alkylene group, a tri(meth)acrylate including a substituted or unsubstituted alkylene group or a substituted or unsubstituted alkyl group, and a photo-initiator, wherein the composition for encapsulating the organic light emitting diode device has a chloride content of about 200 ppm or less.

Abstract: A composition for encapsulation and an encapsulated apparatus, the composition including a (meth)acrylic alkoxysilane monomer including a moiety represented by Formula 1 or 2, below, or an oligomer thereof; a multifunctional (meth)acrylate monomer or an oligomer thereof; and an initiator, wherein * and ** represent a binding site between elements.

Abstract: A composition for encapsulation of an organic light emitting diode comprising a photocurable monomer, a silicon-containing monomer, and an initiator, wherein the silicon-containing monomer is represented by Formula 1, and an organic light emitting diode display are disclosed.

Abstract: A photocurable composition includes (A) a photocurable monomer and (B) a silicon-containing monomer or oligomer thereof, the silicon-containing monomer being represented by Formula 1

Abstract: A composition for encapsulation of an organic light emitting diode and an organic light emitting diode display manufactured using the same. The composition for encapsulation includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate; about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate; about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate; and about 1 wt % to about 10 wt % of (D) an initiator, wherein the (B) silicon-based di(meth)acrylate is represented by Formula 1.

Abstract: The present invention relates to an encapsulating composition, a barrier layer including the same, and an encapsulated apparatus including the same, and the composition comprises (A) a photocurable monomer and (B) a photocurable monomer containing a carboxylic acid group, wherein (B) the photocurable monomer containing the carboxylic acid group has an amide bond.

Abstract: Disclosed are a photocurable composition which includes (A) a photocurable monomer and (B) a monomer represented by Formula 1, and an apparatus including a protective layers formed of the composition;

Abstract: The present invention relates to a photocurable composition, to a barrier layer including same, and to an encapsulated device including same, wherein the composition comprises a photocurable monomer(A) and a silicon containing monomer(B), wherein the silicon containing monomers(B) has a structure according to Formula 1.

Abstract: An adhesive composition includes an acrylic copolymer having at least one alkyl group, at least one hydroxyl group, and at least one furyl based group; and a curing agent.

Abstract: A photocurable composition, a composition for encapsulation of an organic light emitting diode, and an encapsulated apparatus, wherein, in the photocurable composition, when A represents a glass-metal alloy die shear strength in kgf between a glass substrate and a Ni/Fe alloy after curing, and B represents curing shrinkage in % as determined by Equation 1, below, and the photocurable composition has a value for A/B of about 0.7 kgf/% or more and the glass-metal alloy die shear strength of about 2.5 kgf or more, Curing shrinkage=|(Specific gravity of solid photocurable composition after curing)?(Specific gravity of liquid photocurable composition before curing)|/(Specific gravity of liquid photocurable composition before curing)×100.

Abstract: The present invention relates to a photo-curing composition comprising (A) a photo-curable monomer, (B) a light-emitting substance, and (C) an initiator, wherein the light-emitting substance has a maximum light-emitting wavelength of about 400 to 500 nm during irradiation at a wavelength of 300-480 nm, and an encapsulated device comprising the same.

Abstract: The present invention relates to a photocurable composition including (A) a photocurable monomer, (B) a monomer of chemical formula 1 or an oligomer thereof and (C) an initiator, a barrier layer including the same and an enveloped device including the same.

Abstract: A composition for encapsulating an organic light emitting diode device and an organic light emitting diode display, the composition including a di(meth)acrylate including an unsubstituted alkylene group, a tri(meth)acrylate including a substituted or unsubstituted alkylene group or a substituted or unsubstituted alkyl group, and a photo-initiator, wherein the composition for encapsulating the organic light emitting diode device has a chloride content of about 200 ppm or less.

Abstract: The present invention relates to an encapsulating composition, a barrier layer including the same, and an encapsulated apparatus including the same, and the composition comprises (A) a photocurable monomer and (B) a photocurable monomer containing a carboxylic acid group, wherein (B) the photocurable monomer containing the carboxylic acid group has an amide bond.