Patents by Inventor Kyoung Jin Ha

Kyoung Jin Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OPTICAL ADHESIVE COMPOSITION FOR DISPLAYS, OPTICAL ADHESIVE FILM PREPARED FROM THE SAME, AND DISPLAY PANEL INCLUDING THE SAME
    Publication number: 20120172484
    Abstract: An optical adhesive film prepared from an optical adhesive composition, an optical adhesive composition, and a display panel, the optical adhesive film having an elongation of about 200 to about 800% and a tensile strength of about 10 gf/mm2 or less, and the optical adhesive composition including a urethane (meth)acrylate copolymer, a reactive monomer, and an initiator.
    Type: Application
    Filed: December 27, 2011
    Publication date: July 5, 2012
    Inventors: Lee June KIM, Ji Hye KWON, Kyoung Jin HA, Kil Sung LEE
  • LIQUID CRYSTAL DISPLAY MODULE AND METHOD OF FORMING THE SAME
    Publication number: 20120169961
    Abstract: A liquid crystal display module includes a backlight unit, a liquid crystal display panel on a top surface of the backlight unit, and a thermoplastic layer on at least one lateral surface of the backlight unit and at least one lateral surface of the liquid crystal display panel, the thermoplastic layer including a solidified thermoplastic resin exhibiting viscosity of about 300 cps to about 1,000 cps at a temperature of about 120° C. to about 130° C.
    Type: Application
    Filed: December 21, 2011
    Publication date: July 5, 2012
    Inventors: Kyoung Jin HA, Ji Hye Kwon, Lee June Kim, Kil Sung Lee
  • OPTICALLY CLEAR ADHESIVE FOR DICING DIE BONDING FILM
    Publication number: 20120171481
    Abstract: An optically clear adhesive, a dicing die bonding film, and a semiconductor device, the optically clear adhesive including a curing agent; and an acrylic copolymer, the acrylic copolymer including an alkyl group, a hydroxyl group, and at least one of a phosphate group and a silane group.
    Type: Application
    Filed: October 24, 2011
    Publication date: July 5, 2012
    Inventors: Kyoung Jin Ha, Baek Soung Park, Ji Ho Kim, Min Kyu Hwang, Kil Sung Lee
  • PHOTOCURABLE ADHESIVE COMPOSITION, MODULE APPARATUS USING THE SAME, AND METHOD OF ASSEMBLING A MODULE
    Publication number: 20120172481
    Abstract: A photocurable adhesive composition, a module apparatus, and a method of assembling a module, the composition including a urethane (meth)acrylate binder, the composition having a viscosity of about 3,000 to about 6,000 cps at 25° C., and providing an adhesive film having an adhesive strength of about 30 N/cm2 or more.
    Type: Application
    Filed: December 23, 2011
    Publication date: July 5, 2012
    Inventors: Kyoung Jin HA, Ji Hye Kwon, Kil Sung Lee, Irina Nam, Lee June Kim
  • OPTICAL ADHESIVE FILM, APPARATUS INCLUDING THE SAME, AND OPTICAL ADHESIVE COMPOSITION
    Publication number: 20120165465
    Abstract: An optical adhesive film prepared from an optical adhesive composition, an optical adhesive composition, and an apparatus, the optical adhesive composition including a urethane (meth)acrylate copolymer, a reactive monomer, and an initiator, wherein the optical adhesive film has a tensile strength of about 1 to about 70 gf/mm2 at a thickness of 500 ?m after curing.
    Type: Application
    Filed: December 19, 2011
    Publication date: June 28, 2012
    Inventors: Lee June KIM, Ji Hye KWON, Kyoung Jin HA, Kil sung LEE
  • UV-curable pressure-sensitive adhesive composition with a fluorinated acrylic binder resin and pressure-sensitive adhesive film using the same
    Patent number: 8193259
    Abstract: A photocurable pressure-sensitive adhesive (PSA) composition includes an acrylic PSA binder, the acrylic PSA binder including at least one fluoro group in an amount of about 6 mol % to about 30 mol % based on a total amount of the acrylic PSA binder, a thermal curing agent, and a photoinitiator.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: June 5, 2012
    Assignee: Cheil Industries, Inc.
    Inventors: Seung Jib Choi, Kyoung Jin Ha, Jun Suk Kim, Kyung Ju Lee, Chang Beom Chung
  • ACRYLIC ADHESIVE COMPOSITION AND POLARIZER FILM USING THE SAME
    Publication number: 20120059127
    Abstract: An adhesive composition includes an acrylic copolymer having at least one alkyl group, at least one hydroxyl group, and at least one furyl based group; and a curing agent.
    Type: Application
    Filed: February 15, 2011
    Publication date: March 8, 2012
    Inventors: Kyoung Jin HA, Irina Nam, Lee Jun Kim, Kil Sung Lee, Eun Hwan Jeong, Woo Jin Jeong
  • ADHESIVE BINDER, ADHESIVE COMPOSITION INCLUDING THE SAME, OPTICAL MEMBER, AND ASSOCIATED METHODS
    Publication number: 20110159283
    Abstract: An adhesive binder, an adhesive composition including the same, an optical member, and associated methods, the adhesive binder including a (meth)acrylic copolymer having urethane, hydroxyl, aromatic, and vinyl groups in side chains thereof.
    Type: Application
    Filed: December 28, 2010
    Publication date: June 30, 2011
    Inventors: Kyoung Jin HA, Kil Sung Lee, Mi Sun Kim, Irina Nam, Chang Min Lee
  • Adhesive film composition, associated dicing die bonding film, and die package
    Patent number: 7863758
    Abstract: An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: January 4, 2011
    Assignee: Cheil Industries, Inc.
    Inventors: Ki Sung Jung, Wan Jung Kim, Yong Woo Hong, Chang Bum Chung, Chul Jeong, Ah Ram Pyun, Su Mi Im, Kyoung Jin Ha
  • UV-curable pressure-sensitive adhesive composition with a fluorinated acrylic binder resin and pressure-sensitive adhesive film using the same
    Publication number: 20090143497
    Abstract: A photocurable pressure-sensitive adhesive (PSA) composition includes an acrylic PSA binder, the acrylic PSA binder including at least one fluoro group in an amount of about 6 mol % to about 30 mol % based on a total amount of the acrylic PSA binder, a thermal curing agent, and a photoinitiator.
    Type: Application
    Filed: October 2, 2008
    Publication date: June 4, 2009
    Inventors: Seung Jib Choi, Kyoung Jin Ha, Jun Suk Kim, Kyung Ju Lee, Chang Beom Chung
  • Photocurable composition for the formation of pressure-sensitive adhesive layer and dicing tape produced using the same
    Publication number: 20090075008
    Abstract: A photocurable composition for a pressure-sensitive adhesive layer includes a pressure-sensitive adhesive binder, a reactive acrylate having a silicone backbone, a thermal curing agent, and a photoinitiator. The pressure-sensitive adhesive binder includes a copolymer of acrylic monomers, and a low molecular weight acrylate bonded to the copolymer, the low molecular weight acrylate having at least one pendent carbon-carbon double bond.
    Type: Application
    Filed: August 28, 2008
    Publication date: March 19, 2009
    Inventors: Yong Ha Hwang, Chang Bum Chung, Gyu Seok Song, Baek Soung Park, Seung Jip Choi, Kyoung Jin Ha
  • Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
    Publication number: 20080160300
    Abstract: A composition, including a polymer binder resin A, a UV-curing acrylate B, a heat curing agent C, and a photopolymerization initiator D. The composition includes about 20 to about 150 parts by weight of the UV-curing acrylate B per 100 parts by weight of the polymer binder resin A, and the UV-curing acrylate B is a solid or near-solid at room temperature and has a viscosity of about 10,000 cps or more at 40° C.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 3, 2008
    Inventors: Yong Ha Hwang, Gyu Seok Song, Hee Yeon Ki, Kyoung Jin Ha, Jae Hyun Cho, Jun Suk Kim, Chang Beom Chung
  • Adhesive film composition, associated dicing die bonding film, and die package
    Publication number: 20080145668
    Abstract: An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
    Type: Application
    Filed: December 7, 2007
    Publication date: June 19, 2008
    Inventors: Ki Sung Jung, Wan Jung Kim, Yong Woo Hong, Chang Bum Chung, Chul Jeong, Ah Ram Pyun, Su Mi Im, Kyoung Jin Ha