Patents by Inventor Kyoung-Min An

Kyoung-Min An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210366910
    Abstract: A semiconductor device includes channel layers on a substrate, the channel layers being spaced apart from each other, and having first side surfaces and second side surfaces opposing each other in a first direction, a gate electrode surrounding the channel layers and having a first end portion and a second end portion, opposing each other in the first direction, and a source/drain layer on a first side of the gate electrode and in contact with the channel layers, a portion of the source/drain layer protruding further than the first end portion of the gate electrode in the first direction, wherein a first distance from the first end portion of the gate electrode to the first side surfaces of the channel layers is shorter than a second distance from the second end portion of the gate electrode to the second side surfaces of the channel layers.
    Type: Application
    Filed: August 6, 2021
    Publication date: November 25, 2021
    Inventors: Krishna Kumar BHUWALKA, Kyoung Min CHOI, Takeshi OKAGAKI, Dong Won KIM, Jong Chol KIM
  • Publication number: 20210352118
    Abstract: Disclosed is a reaction display method performed by a computer apparatus including processing circuitry, the reaction display method including displaying, by the processing circuitry, a content sharing screen with a voice over Internet protocol (VoIP) call screen during a VoIP call, the content sharing screen including shared media content, and a user of the computer apparatus participating in the VoIP call, receiving, by the processing circuitry, a position at which a reaction is input from the user during the VoIP call, sending reaction information and the position to at least one other user participating in the VoIP call, the reaction information corresponding to the reaction, and displaying an indication of the reaction on the VoIP call screen or the content sharing screen based on the position.
    Type: Application
    Filed: May 4, 2021
    Publication date: November 11, 2021
    Applicant: LINE Plus Corporation
    Inventors: DeokYong AHN, Hwan KIM, Min Jeong KIM, Jaehyun LEE, Seongsu KIM, Kyoung Min KIM, Sanghyuk SUH, Jeongrok KIM, Tae Jeong LEE, Jeong Hyeon KWON, Keumryong KIM, Na Young KIM, Inah KIM, Jungjun PARK
  • Patent number: 11171128
    Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: November 9, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Hyeok Im, Hee Seok Lee, Tae Woo Kang, Yeong Seok Kim, Kyoung-Min Lee
  • Publication number: 20210336912
    Abstract: A method for sharing content on an instant messaging application operating in a user terminal including determining whether content-to-be-shared for a chat room associated with a user account of the instant messaging application exists, outputting a share recommendation message for the user account through the chat room in response to a result of the determining indicating that the content-to-be-shared exists, receiving a response to the share recommendation message from the user account, and outputting the content-to-be-shared for the chat room based on the received response to the share recommendation message may be provided.
    Type: Application
    Filed: April 21, 2021
    Publication date: October 28, 2021
    Applicant: LINE Plus Corporation
    Inventors: Deokyong AHN, Hwan KIM, Min Jeong KIM, Jaehyun LEE, Seongsu KIM, Kyoung Min KIM, Sanghyuk SUH, Jeongrok KIM, Tae Jeong LEE, Jeong Hyeon KWON, Keumryong KIM, Inah KIM, Na Young KIM, Jungjun PARK
  • Publication number: 20210336998
    Abstract: A content sharing method performed by a computer apparatus including processing circuitry, the method including providing, by the processing circuitry, an interface in response to a user input during a voice over Internet protocol (VoIP) call, a user of the computer apparatus participating in the VoIP call, generating, by the processing circuitry, metadata of a VoIP call packet in response to a share request for content specified through the interface, the metadata including data corresponding to the share request, sending, by the processing circuitry, the metadata to another user participating in the VoIP call, and displaying, by the processing circuitry, a playback screen of the content with a call screen of the VoIP call, the content being shared during the VoIP call between the computer apparatus and another computer apparatus of the other user using the metadata.
    Type: Application
    Filed: April 20, 2021
    Publication date: October 28, 2021
    Applicant: LINE Plus Corporation
    Inventors: DeokYong AHN, Hwan KIM, Min Jeong KIM, Jaehyun LEE, Seongsu KIM, Kyoung Min KIM, Sanghyuk SUH, Jeongrok KIM, Tae Jeong LEE, Jeong Hyeon KWON, Keumryong KIM, Na Young KIM, Inah KIM, Jungjun PARK
  • Patent number: 11149120
    Abstract: Provided is a method for manufacturing thermoplastic polymer particles, the method comprising the steps of: supplying a thermoplastic polymer resin to an extruder and extruding the same; supplying the extruded thermoplastic polymer resin and air to a nozzle, bringing the thermoplastic polymer resin into contact with the air to granulate the thermoplastic polymer resin, and then discharging the granulated thermoplastic polymer resin; and supplying discharged thermoplastic polymer particles to a cooling unit to cool the thermoplastic polymer particles, and then collecting the cooled thermoplastic polymer particles.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: October 19, 2021
    Inventors: Hee-Jung Lee, Sung Yong Kang, Kyoung Min Kang, Min Gyung Kim, Chang-Young Park, Jae Ho Lim, Jun Ho Choi, Jae Han Song, Yu Jin Go
  • Patent number: 11133311
    Abstract: A semiconductor device includes channel layers on a substrate, the channel layers being spaced apart from each other, and having first side surfaces and second side surfaces opposing each other in a first direction, a gate electrode surrounding the channel layers and having a first end portion and a second end portion, opposing each other in the first direction, and a source/drain layer on a first side of the gate electrode and in contact with the channel layers, a portion of the source/drain layer protruding further than the first end portion of the gate electrode in the first direction, wherein a first distance from the first end portion of the gate electrode to the first side surfaces of the channel layers is shorter than a second distance from the second end portion of the gate electrode to the second side surfaces of the channel layers.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: September 28, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Krishna Kumar Bhuwalka, Kyoung Min Choi, Takeshi Okagaki, Dong Won Kim, Jong Chol Kim
  • Patent number: 11118019
    Abstract: The present invention provides thermoplastic polyurethane particles, which are formed in a continuous matrix phase from a thermoplastic polyurethane resin and have a particle diameter of 200-500 ?m. In a differential scanning calorimetry (DSC) curve of the thermoplastic polyurethane particles, derived from the analysis of a temperature rise of 10° C./min by DSC, a peak of the cold crystallization temperature (Tcc) is shown at a temperature between the glass transition temperature (Tg) and the melting point (Tm). The thermoplastic polyurethane particles have a compression degree of 10-20%.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: September 14, 2021
    Inventors: Min Gyung Kim, Sung Yong Kang, Kyoung Min Kang, Hee-Jung Lee, Chang-Young Park, Jae Ho Lim, Jun Ho Choi, Jae Han Song, Yu Jin Go
  • Patent number: 11119517
    Abstract: To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: September 14, 2021
    Inventors: Yun-Hyeok Im, Myung-Kyoon Yim, Wook Kim, Kyoung-Min Lee, Kyung-Soo Lee
  • Publication number: 20210265539
    Abstract: Disclosed is a semiconductor light emitting device comprising: an external substrate; a first semiconductor light emitting device chip provided on the external substrate, comprising a first plurality of semiconductor layers including a first active layer for generating ultraviolet light by recombination of electrons and holes, and a first electrode electrically connected to the first plurality of semiconductor layers; a lens configured to surround the first semiconductor light emitting device chip, the lens serving to refract the ultraviolet light from the first semiconductor light emitting device chip and forming an orientation angle within a predefined range; and, a second semiconductor light emitting device chip provided on the external substrate, the second semiconductor light emitting device comprising a second plurality of semiconductor layers including a second active layer for generating visible light by recombination of electrons and holes, and a second electrode electrically connected to the second
    Type: Application
    Filed: August 4, 2020
    Publication date: August 26, 2021
    Inventors: Eun Hyun PARK, Kyoung Min KIM, Bong Hwan KIM
  • Publication number: 20210253802
    Abstract: Provided are thermoplastic polymer particles having an aspect ratio of 1.00 or more and less than 1.05, and a roundness of 0.95 to 1.00. The thermoplastic polymer particles are formed from a thermoplastic polymer resin in a continuous matrix phase. The thermoplastic polymer particles show a peak cold crystallization temperature (Tcc) at a temperature between a glass transition temperature (Tg) and the melting point (Tm) in a differential scanning calorimetry (DSC) curve which is derived from temperature rise analysis at 10° C./min by differential scanning calorimetry.
    Type: Application
    Filed: March 25, 2021
    Publication date: August 19, 2021
    Applicant: LG Hausys, Ltd.
    Inventors: Jae Ho Lim, Sung Yong Kang, Kyoung Min Kang, Hee-Jung Lee, Min Gyung Kim, Chang-Young Park, Jun Ho Choi, Jae Han Song, Yu Jin Go
  • Patent number: 11084135
    Abstract: There is provided a clamping mechanism, including: a housing which is movable to clamp or unclamp an object having clamping blocks; a clamping plate disposed in front of the housing; and a first elastic member applying a clamping force to the clamping plate by movement of the housing, wherein the clamping blocks have receiving grooves in which edges of the clamping plate are received.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: August 10, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Kyoung Min Park, Kwang Jin Kim, Dong Sich Lim, Jong Chan Jang
  • Patent number: 11071686
    Abstract: An automatic cardiopulmonary resuscitation device includes a movable chest compressor for repeatedly pressing a patient's chest at a preset depth and cycle, a cardiac output measurement unit for measuring a cardiac output of the patient in accordance with the pressurization of the chest compressor and a processor for changing pressing locations by performing control such that the chest compressor moves according to a preset method.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: July 27, 2021
    Assignee: Seoul National University R&DB Foundation
    Inventors: Gil Joon Suh, Woon Yong Kwon, Kyung Su Kim, Sang Hoon Na, Jaeheung Park, Jung Chan Lee, Yoon Sun Jung, Kyoung Min You, Min Ji Park, Taegyun Kim, Jung-In Ko, Jeeseop Kim, Jaesug Jung, Sanghyun Kim, Byeong Wook Yoo, Byeongtak Lee, Woo Sang Cho, Jin Woo Choi
  • Patent number: 11068749
    Abstract: The present disclosure discloses a system and a method for translating, e.g., mapping, a Red-Clear-Clear-Clear (RCCC) image to a Red-Green-Blue (RGB) image. In an example implementation, the system and the method can receive, at a deep neural network, an image having a Red-Clear-Clear-Clear (RCCC) image pattern, wherein the deep neural network includes a generator and a discriminator; generate, at the generator, a Red-Green-Blue (RGB) image based on the image having the RCCC image pattern; determine, at the discriminator, whether the RGB image is machine-generated or is sourced from the real data distribution; and update at least one weight of the generator when the discriminator determines the RGB image is machine-generated.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: July 20, 2021
    Assignee: Ford Global Technologies, LLC
    Inventors: Akhil Perincherry, Kyoung Min Lee, Ishan Patel
  • Patent number: 11066527
    Abstract: The present invention provides polylactic acid particles, which are formed in a continuous matrix phase from a polylactic acid resin and have a particle diameter of 1 to 100 ?m. In a differential scanning calorimetry (DSC) curve of the polylactic acid particles, derived from the analysis by DSC using a temperature rise of 10° C./min, a peak of the cold crystallization temperature (Tcc) is shown at a temperature between the glass transition temperature (Tg) and the melting point (Tm). The polylactic acid particles have an aspect ratio of more than or equal to 1.00 and less than 1.05 and a roundness of 0.95 to 1.00. The polylactic acid particles have a flow time of 20 to 30 seconds.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: July 20, 2021
    Inventors: Kyoung Min Kang, Sung Yong Kang, Hee-Jung Lee, Min Gyung Kim, Chang-Young Park, Jae Ho Lim, Jun Ho Choi, Jae Han Song, Yu Jin Go
  • Patent number: 11053525
    Abstract: The present invention relates to a recombinant microorganism for producing putrescine or ornithine, and a method for producing putrescine or ornithine using the same. Specifically, the present invention relates to a microorganism of the genus Corynebacterium capable of producing putrescine or ornithine, in which an activity of the transcriptional regulator of sugar metabolism (SugR) is weakened, an activity of the citrate synthase (GltA) is enhanced, or both are applied; and a method for producing putrescine or ornithine using the same.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: July 6, 2021
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Hee Kyoung Jung, Hye Won Um, Hong Xian Li, Su Jin Park, Young Lyeol Yang, Kyoung Min Lee, Hyo Hyoung Lee
  • Patent number: 11053524
    Abstract: The present invention relates to a recombinant microorganism capable of producing putrescine, in which the microorganism is modified to have enhanced NCgl2522 activity, thereby producing putrescine in a high yield, and a method for producing putrescine using the microorganism.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: July 6, 2021
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Kyoung Min Lee, Hee Kyoung Jung, Young Lyeol Yang, Hye Won Um, Chang Gyeom Kim, Hong Xian Li, Su Jin Park, Jong Hyun Yoon, Baek Seok Lee, Sun Young Lee
  • Patent number: 11041092
    Abstract: Disclosed are a surface coating material, a film formed from the surface coating material, a stacked structure the film, and a display device including the film and/or stacked structure. The surface coating material may include a plurality of fluorine-containing silicon compounds, wherein each of fluorine-containing silicon compounds may include a fluorine-containing (poly)ether moiety, a hydrolysable silane moiety, and a linking group between the fluorine-containing (poly)ether moiety and the hydrolysable silane moiety. The linking group may be configured to form a non-covalent interaction between adjacent molecules.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: June 22, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung Im Han, Kyoung Min Min, Byung Ha Park, Dmitry Androsov, Won Cheol Jung, Eun Seog Cho, Fedosya Kalinina
  • Patent number: 11038086
    Abstract: Disclosed is a semiconductor light emitting device including: a body with a bottom part having at least one hole formed therein; a semiconductor light emitting device chip to be placed in each of the at least one hole, with the semiconductor light emitting device chip being comprised of a plurality of semiconductor layers including an active layer for generating light by electron-hole recombination, and an electrode electrically connected to the plurality of semiconductor layers; and an encapsulating member for covering the semiconductor light emitting device chip, wherein a hole—defining inner face of the bottom part has a plurality of angles of inclination.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: June 15, 2021
    Assignee: SEMICON LIGHT CO., LTD.
    Inventors: Soo Kun Jeon, Kyoung Min Kim, Eun Hyun Park, Young Kwan Cho, Gye Oul Jeong, Dong So Jung, Seung Ho Baek, Eung Suk Park, Hye Ji Rhee
  • Patent number: 11037913
    Abstract: A semiconductor package includes a bottom package having a lower substrate and a lower semiconductor chip mounted on the lower substrate, an interposer substrate on the bottom package, a first top package and a second top package that are mounted on the interposer substrate, and a heat spreader that is interposed between the first top package and the second top package and separates the first and second top packages from each other. The heat spreader is adhered to the interposer substrate through a plurality of first connection terminals.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: June 15, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yunhyeok Im, Kyoung-Min Lee, Kyungsoo Lee, Horang Jang