Patents by Inventor Kyoung-Min Lee

Kyoung-Min Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200367747
    Abstract: The present disclosure relates to a retina imaging method in which a light from a light source into two lights is dispersed, at least one eyeground image of the eyeball at a first magnification is obtained by adjusting the paths of the two lights incident on the eyeball, and a plurality of DIC images are obtained at a second magnification higher than the first magnification with respect to the retina of the entirety of the obtained at least one eyeground image by adjusting the paths of the two lights incident on the eyeball.
    Type: Application
    Filed: February 26, 2020
    Publication date: November 26, 2020
    Inventors: Jae Hun Kim, Dae Yu Kim, Seok Hwan Kim, Youngho Cho, Byeongho Park, Hyo-suk Kim, Subeen Park, Kyoung Min Lee
  • Patent number: 10815464
    Abstract: Disclosed is a modified microorganism producing putrescine or ornithine, and a method for producing putrescine or ornithine using the same.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: October 27, 2020
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Su Jin Park, Young Lyeol Yang, Hye Won Um, Hong Xian Li, Kyoung Min Lee, Baek Seok Lee, Hyo Hyoung Lee, Hee Kyoung Jung
  • Patent number: 10801047
    Abstract: The present disclosure relates to a putrescine-producing microorganism of the genus Corynebacterium, and a method of producing putrescine using the same.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: October 13, 2020
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Kyoung Min Lee, Sung Gun Lee, Seon Hye Kim, Kyungsu Na, Hong Xian Li, Hyun-jung Bae, Young Lyeol Yang, Hye Won Um, Hyo Hyoung Lee
  • Publication number: 20200251455
    Abstract: A semiconductor package includes a bottom package having a lower substrate and a lower semiconductor chip mounted on the lower substrate, an interposer substrate on the bottom package, a first top package and a second top package that are mounted on the interposer substrate, and a heat spreader that is interposed between the first top package and the second top package and separates the first and second top packages from each other. The heat spreader is adhered to the interposer substrate through a plurality of first connection terminals.
    Type: Application
    Filed: April 22, 2020
    Publication date: August 6, 2020
    Inventors: YUNHYEOK IM, KYOUNG-MIN LEE, KYUNGSOO LEE, HORANG JANG
  • Patent number: 10727565
    Abstract: An apparatus of an antenna is provided. The apparatus includes a first conductor plate disposed on an upper side of a single plate and comprising an aperture, a plurality of vias inserted to vertically penetrate through the single plate, a second conductor plate disposed on a lower side of the single plate, and a feed line for applying a signal to radiate to a dielectric resonator embedded as a cavity which is formed by the first conductor plate, the second conductor plate, and the vias. The aperture is in a size which produces multiple-resonance at an operating frequency.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: July 28, 2020
    Assignees: Samsung Electronics Co., Ltd., Korea University Research and Business Foundation
    Inventors: Moonil Kim, Kyoung Min Lee, Seung Ho Choi
  • Publication number: 20200224227
    Abstract: The present disclosure relates to a putrescine-producing microorganism of the genus Corynebacterium, and a method of producing putrescine using the same.
    Type: Application
    Filed: July 19, 2018
    Publication date: July 16, 2020
    Inventors: Kyoung Min LEE, Sung Gun LEE, Seon Hye KIM, Kyungsu NA, Hong Xian LI, Hyun-jung BAE, Young Lyeol YANG, Hye Won UM, Hyo Hyoung LEE
  • Publication number: 20200219860
    Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.
    Type: Application
    Filed: March 24, 2020
    Publication date: July 9, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Hyeok Im, Hee Seok Lee, Tae Woo Kang, Yeong Seok Kim, Kyoung-Min Lee
  • Publication number: 20200219123
    Abstract: The present disclosure proposes a server for customer management. The server according to the present disclosure may include a processor and/or a memory. The processor may process a payment by a first user based on payment information, generate evaluation tag information including an evaluation tag to be displayed at a first terminal, deliver the evaluation tag information to the first terminal, acquire information indicating a third evaluation tag selected by the first user from the first terminal, deliver statistical information including the number of users who have selected the evaluation tag to a shop terminal, acquire information indicating a customer management message and a coupon to be sent to a user who has selected a predetermined evaluation tag from the shop terminal, and deliver the information indicating the customer management message and the coupon to the corresponding terminal.
    Type: Application
    Filed: January 3, 2020
    Publication date: July 9, 2020
    Inventors: Jun Won KO, Ji Won OH, Dong Jo KOH, Yeon Joo PARK, Yu Kyung CHOI, Dong Hyuk SHIN, Eun Sun JANG, Kyoung Min LEE, Ye Jin LEE
  • Publication number: 20200208182
    Abstract: The present disclosure relates to a novel polypeptide having an ability to export an ornithine-based product, and a method for producing an ornithine-based product using the same.
    Type: Application
    Filed: June 14, 2018
    Publication date: July 2, 2020
    Inventors: Seon Hye KIM, Su Jin PARK, Kyoung Min LEE, Kyungsu NA, Hong Xian LI, Hyun-jung BAE, Jihyun SHIM, Young Lyeol YANG, Hye Won UM, Hyo Hyoung LEE, Min Gyeong KANG, Hye Won KIM, Byeong Cheol SONG, Haena OH, Han Hyoung LEE
  • Publication number: 20200190486
    Abstract: Disclosed is a modified microorganism producing putrescine or ornithine, and a method for producing putrescine or ornithine using the same.
    Type: Application
    Filed: February 28, 2020
    Publication date: June 18, 2020
    Inventors: Su Jin PARK, Young Lyeol YANG, Hye Won UM, Hong Xian LI, Kyoung Min LEE, Baek Seok LEE, Hyo Hyoung LEE, Hee Kyoung JUNG
  • Publication number: 20200182119
    Abstract: A system for purifying exhaust gas includes a controller to predict a possibility of ammonia (NH3) slip occurring at the rear end of a selective catalytic reduction on a diesel particulate filter (SDPF) by comparing a convective heat transfer value (h) with a first predetermined value. The controller determines whether an engine is rapidly accelerated, and performs a control to prevent introduction of ammonia downstream of the SDPF when the ammonia slip is predicted to occur.
    Type: Application
    Filed: October 21, 2019
    Publication date: June 11, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Hyo-Sang CHO, Kyoung-Min LEE, Jun-Yong LEE, Kyoung-Chan HAN
  • Publication number: 20200181661
    Abstract: The present disclosure relates to a novel polypeptide having an ability to export an ornithine-based product, and a method for producing an ornithine-based product using the same.
    Type: Application
    Filed: June 14, 2018
    Publication date: June 11, 2020
    Inventors: Seon Hye KIM, Su Jin PARK, Kyoung Min LEE, Kyungsu NA, Hong Xian LI, Hyun-jung BAE, Jihyun SHIM, Young Lyeol YANG, Hye Won UM, Hyo Hyoung LEE, Min Gyeong KANG, Hye Won KIM, Byeong Cheol SONG, Haena OH, Han Hyoung LEE
  • Patent number: 10665574
    Abstract: A semiconductor package includes a bottom package having a lower substrate and a lower semiconductor chip mounted on the lower substrate, an interposer substrate on the bottom package, a first top package and a second top package that are mounted on the interposer substrate, and a heat spreader that is interposed between the first top package and the second top package and separates the first and second top packages from each other. The heat spreader is adhered to the interposer substrate through a plurality of first connection terminals.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: May 26, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yunhyeok Im, Kyoung-Min Lee, Kyungsoo Lee, Horang Jang
  • Patent number: 10640797
    Abstract: The present invention relates to a microorganism for producing diamine, in which activity of a protein having an amino acid sequence of SEQ ID NO: 6 or an amine acid sequence having 42% or higher sequence homology with SEQ ID NO: 6 is introduced or enhanced, and a method of producing diamine using the same.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: May 5, 2020
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Kyoung Min Lee, Su Jin Park, Hee Kyoung Jung, Young Lyeol Yang, Hong Xian Li, Hye Won Um
  • Patent number: 10640798
    Abstract: The present invention relates to a microorganism for producing diamine, in which activity of a protein having an amino acid sequence of SEQ ID NO: 6 or an amino acid sequence having 42% or higher sequence homology with SEQ ID NO: 6 is introduced or enhanced, and a method of producing diamine using the same.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: May 5, 2020
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Kyoung Min Lee, Su Jin Park, Hee Kyoung Jung, Young Lyeol Yang, Hong Xian Li, Hye Won Um
  • Patent number: 10640753
    Abstract: Disclosed is a modified microorganism producing putrescine or ornithine, and a method for producing putrescine or ornithine using the same.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: May 5, 2020
    Assignee: CJ Cheiljedang Corporation
    Inventors: Su Jin Park, Young Lyeol Yang, Hye Won Um, Hong Xian Li, Kyoung Min Lee, Baek Seok Lee, Hyo Hyoung Lee, Hee Kyoung Jung
  • Patent number: 10633679
    Abstract: The present invention relates to a microorganism for producing diamine, in which activity of a protein having an amino acid sequence of SEQ ID NO: 6 or an amino acid sequence having 55% or higher sequence homology with SEQ ID NO: 6 is introduced or enhanced, and a method of producing diamine using the same.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: April 28, 2020
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Kyoung Min Lee, Su Jin Park, Hee Kyoung Jung, Young Lyeol Yang, Hong Xian Li, Hye Won Um
  • Patent number: 10626425
    Abstract: The present invention relates to a microorganism for producing diamine, in which activity of a protein having an amino acid sequence of SEQ ID NO: 6 or an amino acid sequence having 55% or higher sequence homology with SEQ ID NO: 6 is introduced or enhanced, and a method of producing diamine using the same.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: April 21, 2020
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Kyoung Min Lee, Su Jin Park, Hee Kyoung Jung, Young Lyeol Yang, Hong Xian Li, Hye Won Um
  • Patent number: 10607971
    Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Hyeok Im, Hee Seok Lee, Tae Woo Kang, Yeong Seok Kim, Kyoung-Min Lee
  • Patent number: D888356
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: June 23, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-Ju Shin, Kyoung-Min Lee