Abstract: A vibration type tilting device, according to an embodiment of the invention, which comprises a mirror holder, supporting a mirror on one side, which tilts together with the mirror such that the mirror periodically tilts light on a light path in a minute angle; a holder support part supporting the mirror holder; a driving part, which supplies driving power to the mirror holder; and a damping part positioned between the mirror holder and the holder support part to reduce overshoot of the mirror holder, can improve the vibration performance of the tilting device to provide a smoother and clearer picture quality.

Abstract: The present invention is related to a case module and a method for controlling the cover rotation of the case module, comprising a case, the case comprising a motor, the motor enabling a cover to rotate, said cover opening when a forward rotation switch is turned on, said cover closing when a reverse rotation switch is turned on; a buffer, the buffer generating a forward rotation signal or a reverse rotation signal, the forward rotation signal and the reverse rotation signal corresponding to the turn-on state of said forward rotation switch or said reverse rotation switch, respectively; and a driving unit, the driving unit rotating said motor, said motor using a signal from said buffer as an input.

Abstract: A tilting device and an operation method thereof are disclosed. The tilting device according to the invention comprises a mirror positioned on a light path which periodically tilts light, a mirror holder joined to the mirror which vibrates with the mirror, a holder support part supporting the mirror holder to allow vibration, and a driving part which provides driving power to the mirror holder, wherein the driving part forms a predetermined angle with the mirror holder and causes vibration about the intersecting first axis and second axis. Thus, the tilting device may not only provide a smooth and natural display but also reduce the number of digital micro-mirror pixels.

Abstract: A vibration type tilting device, according to an embodiment of the invention, which comprises a mirror holder, supporting a mirror on one side, which tilts together with the mirror such that the mirror periodically tilts light on a light path in a minute angle; a holder support part supporting the mirror holder; a driving part, which supplies driving power to the mirror holder; and a damping part comprising a gap adjustment member capable of changing the gap between a portion of the mirror holder and a portion of the holder support part, provides superior vibration characteristics, as the viscous fluid is not heated by the driving part.

Abstract: A method for removing defects due to edge chips of a semiconductor wafer is disclosed. This method includes forming a molding layer over a semiconductor wafer. The molding layer is patterned to form a plurality of storage node holes, where the plurality of storage node holes include at least one first storage node hole formed on an effective chip area and at least one second storage node hole formed on an edge chip area. First storage nodes and second storage nodes are formed in the first and second storage node holes, respectively. A photoresist pattern is formed on the wafer having the storage nodes. The photoresist pattern is preferably formed to expose the effective chip areas and to cover the edge chip areas. The molding layer is etched, using the photoresist pattern as an etching mask, to expose portions of the first storage nodes.

Abstract: The aligning of a wafer with a reticle in photolithographic equipment is carried out using a feed forward method. In the method, a wafer is loaded onto an exposure apparatus, the wafer is aligned with a reticle, the state of alignment is measured, alignment data representative of the state of alignment is produced, and a database is searched for an alignment data type under which the alignment data falls. The database may also be searched for overlay data related to the alignment data. A correction value matched to the alignment data type is obtained. The correction value maybe calculated from the overlay data. The alignment of the wafer is corrected by applying the correction value to the alignment data. Finally, the aligned wafer is exposed.

Abstract: A method for removing defects due to edge chips of a semiconductor wafer is disclosed. This method includes forming a molding layer over a semiconductor wafer. The molding layer is patterned to form a plurality of storage node holes, where the plurality of storage node holes include at least one first storage node hole formed on an effective chip area and at least one second storage node hole formed on an edge chip area. First storage nodes and second storage nodes are formed in the first and second storage node holes, respectively. A photoresist pattern is formed on the wafer having the storage nodes. The photoresist pattern is preferably formed to expose the effective chip areas and to cover the edge chip areas. The molding layer is etched, using the photoresist pattern as an etching mask, to expose portions of the first storage nodes.

Abstract: A method for removing defects due to edge chips of a semiconductor wafer is disclosed. This method includes forming a molding layer over a semiconductor wafer. The molding layer is patterned to form a plurality of storage node holes, where the plurality of storage node holes include at least one first storage node hole formed on an effective chip area and at least one second storage node hole formed on an edge chip area. First storage nodes and second storage nodes are formed in the first and second storage node holes, respectively. A photoresist pattern is formed on the wafer having the storage nodes. The photoresist pattern is preferably formed to expose the effective chip areas and to cover the edge chip areas. The molding layer is etched, using the photoresist pattern as an etching mask, to expose portions of the first storage nodes.

Abstract: Coarse frequency offset estimation method and device in an orthogonal frequency division multiplexing (OFDM) receiver are provided.

Abstract: A method and an apparatus for marking an identification mark on a wafer. After the wafer is aligned, a laser beam is radiated onto a predetermined portion on the wafer so that the identification mark is engraved on the wafer. While the laser beam is being radiated, a gas blows towards the predetermined portion on the wafer so as to remove the particles which are created on the surface on the wafer caused by the radiation of the laser beam. A collecting and exhausting section is provided to collect and exhaust the gas that is mixed with the particles.

Abstract: A method and an apparatus for marking an identification mark on a wafer. After the wafer is aligned, a laser beam is radiated onto a predetermined portion on the wafer so that the identification mark is engraved on the wafer. While the laser beam is being radiated, a gas blows towards the predetermined portion on the wafer so as to remove the particles which are created on the surface on the wafer caused by the radiation of the laser beam. A collecting and exhausting section is provided to collect and exhaust the gas that is mixed with the particles.

Abstract: An advanced exposure apparatus combines a quadrupole illumination system and an annular illumination system, and includes a light source, an adjusting portion comprising a filter to limit the light emitted from the light source, a refractive/diffractive portion for refracting and diffracting the light emitted from the adjusting portion and a focussing portion for focussing the light emitted from the refractive/diffractive portion onto a wafer, wherein the filter is provided with first group holes and second group holes comprising four holes, respectively. In an exposure method using such an apparatus, uniform light intensity distribution can be formed on an image formation plane (or wafer) while improved resolution is maintained. Since image formation information (i.e, light passing through a mask pattern) becomes uniform, a very nearly circular contact hole pattern can be formed, to reduce the proximity effect.