Abstract: A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.

Abstract: An antenna device that uses an exterior metal frame is provided. The antenna includes a Printed Circuit Board (PCB); a plurality of segment-type exterior metal frames spaced apart from the PCB; a feeding portion connected to one metal frame of the plurality of segment-type exterior metal frames; and a slit located between the PCB and the one metal frame, wherein the one metal frame fed through the feeding portion operates with radiation, or the slit operates with radiator, or another exterior metal frame fed through the feeding portion operates with radiation.

Abstract: A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.

Abstract: An electronic device including a plurality of antennas is provided. The electronic device includes a first radiator including at least one matching block that is connected with a ground area and at least one side of the first radiator. The first radiator is configured to transmit and receive a first frequency signal through a first antenna resonance length corresponding to a first area of the first radiator, and to transmit and receive a second frequency signal through a second antenna resonance length corresponding to a second area opposite to the first area. A second radiator is connected with the ground area and is configured to transmit and receive a third frequency signal through a third antenna resonance length corresponding to a third area adjacent to the first radiator.

Abstract: A storage device test system includes: a storage device mounting unit configured to mount a storage device therein; a test control unit configured to transmit and/or receive test signals to and/or from the storage device; an interface plug that is electrically connected to the test control unit and coupled to the storage device mounted in the storage device mounting unit; and a plugging driving unit that controls a relative location between the interface plug and the storage device mounting unit. By using the storage device test system, the causes of defects that may occur while using a storage device may be easily detected.

Abstract: An interface connector includes a connection terminal unit configured to be connected with an external connector, and a metallic shell configured to enclose the connection terminal unit. The metallic shell includes a first shell unit, in which the connection terminal unit is mounted, and which is grounded with a printed circuit board, and a second shell unit mounted to be separated and spaced from the first shell unit. An electronic device comprises a connection terminal unit configured to be connected with an external connector and a metallic shell configured to enclose the connection terminal unit, wherein the metallic shell comprises a first shell unit in which the connection terminal unit is mounted, and a second shell unit mounted to be separated and spaced from the first shell unit.

Abstract: A communication terminal and an antenna apparatus of the communication terminal are provided. The communication terminal includes a body having a circuit board, an antenna element which is mounted inside the body and connected electrically to the circuit board and, when electric current is supplied via a main plate, resonant in a resonant frequency band for transmitting and receiving signals, and a metal case having an antenna pattern which is coupled to an edge of the body to be resonant and, when the antenna element is resonant, in the resonant frequency band for supporting operation of the antenna element.

Abstract: An antenna device that uses an exterior metal frame is provided. The antenna includes a Printed Circuit Board (PCB); a plurality of segment-type exterior metal frames spaced apart from the PCB; a feeding portion connected to one metal frame of the plurality of segment-type exterior metal frames; and a slit located between the PCB and the one metal frame, wherein the one metal frame fed through the feeding portion operates with radiation, or the slit operates with radiator, or another exterior metal frame fed through the feeding portion operates with radiation.

Abstract: A multi-band antenna is provided. The multi-band antenna includes a plurality of radiator patterns that are configured to operate according to different frequency bands, a plurality of feeding units that are respectively connected to different contact points of the antenna radiator for connecting feeding units of the plurality of feeding units to at least one radiator pattern included in the plurality of radiator patterns, and a switching unit configured to switch between feeding units of the plurality of feeding units for connecting at least one radiator pattern included in the plurality of radiator patterns to the switched feeding unit.

Abstract: There are provided a wafer holder cleaning apparatus and a film deposition system including the same, the wafer holder cleaning apparatus including a housing part including an entrance into and out of which a wafer holder is carried, a door part selectively opening and closing the entrance, a support part provided within the housing part and having the wafer holder disposed thereon, the wafer holder being carried into the housing part through the entrance, and a cleaning part cleaning a surface of the wafer holder.

Abstract: An antenna device for an electronic device for wireless communication is provided. The antenna device includes an antenna area connected to a feeding line and a ground line, such that the antenna area is configured to transmit/receive a signal of a first frequency band; and a branching feeding pattern branching from the feeding line and connected to one side of the antenna area, such that the branching feeding pattern is configured to enable the antenna area to transmit/receive a signal of a second frequency band.

Abstract: Discussed is a display device. The display device can include an optical frame, which provides light up to an edge of a display panel, thereby enlarging an active area of the display device.

Abstract: A built-in antenna apparatus of a mobile terminal includes a main board having at least one feeding portion for feeding RF power and at least one grounding portion at ground potential. The antenna apparatus includes first and second thin metal plates configured to be stacked on the main board and spaced from one another. The second metal plate is electrically connected to the feeding portion and has a length sufficient to resonate within a communication frequency band of the mobile terminal. The first metal plate is electrically connected to the grounding portion and electromagnetically coupled with the second metal plate to resonate.

Abstract: There is provided a slit valve unit including: a body disposed on an outer side of a process chamber and having an entrance connected to an opening of the process chamber; a slit valve provided in an internal space of the body and selectively opening and closing the entrance; a plurality of packing members provided along the circumference of the entrance on an inner side of the body and tightly attached to the slit valve when the slit valve shields the entrance; and a connection pipe having one end exposed between the plurality of packing members on the inner side of the body so as to be connected to an airtight space formed among the plurality of packing members, the body, and the slit valve, and the other end exposed to the outer side of the body, the connection pipe penetrating the body.

Abstract: Methods of forming through-silicon vias by using laser ablation. A method includes, laser drilling to form a plurality of grooves by irradiating a laser beam onto an upper surface of a silicon wafer, and grinding a lower surface of the silicon wafer to form a plurality of through-silicon vias by exposing the grooves on the lower surface of the silicon wafer.

Abstract: A built-in antenna of a portable terminal and a method of forming the same are provided. The built-in antenna includes a first conductor having a specific length and used for a ground, a second conductor disposed with a specific distance in parallel to the first conductor to couple with the first conductor and used for power feeding, and a separating element disposed between the first conductor and the second conductor to separate the first and second conductors. Accordingly, the built-in antenna may exhibit a smooth radiation property even if a metal construction is used in a device and thus may implement robustness improvement of the device and make the device slim and have an attractive outer appearance. In addition, a method of improving antenna efficiency may prevent deterioration of the radiation property of the antenna radiator of the related art by using simple processing, and the metal construction may be used as a radiator.

Abstract: There is provided a vapor phase deposition apparatus including: a reaction chamber having a susceptor with a wafer mounted thereon and depositing and growing an epitaxial thin film on the wafer; a housing having the reaction chamber disposed therein and having a window opened and closed to allow the wafer to be loaded into or unloaded from the wafer reaction chamber; and an exhaust unit discharging gas from within the housing to the outside to adjust internal pressure of the housing.

Abstract: Provided are a cleaning device that may be applied to a manufacturing equipment without stopping operations of the equipment, a cleaning method, and a method of manufacturing a device. The cleaning device includes: a frame substrate configured to frame the cleaning device; a first functional membrane on a first surface of the frame substrate; and a second functional membrane on a second surface of the frame substrate, which is opposite to the first surface. The cleaning method includes: positioning a cleaning device including a frame substrate and functional membranes formed on opposite surfaces of the frame substrate on a support configured to support a substrate, during a semiconductor manufacturing process or a display manufacturing process on the substrate; maintaining the positioning of the cleaning device on the support for a predetermined time period; and removing the cleaning device from the support.

Abstract: There are provided a wafer holder cleaning apparatus and a film deposition system including the same, the wafer holder cleaning apparatus including a housing part including an entrance into and out of which a wafer holder is carried, a door part selectively opening and closing the entrance, a support part provided within the housing part and having the wafer holder disposed thereon, the wafer holder being carried into the housing part through the entrance, and a cleaning part cleaning a surface of the wafer holder.

Abstract: An interface connector includes a connection terminal unit configured to be connected with an external connector, and a metallic shell configured to enclose the connection terminal unit. The metallic shell includes a first shell unit, in which the connection terminal unit is mounted, and which is grounded with a printed circuit board, and a second shell unit mounted to be separated and spaced from the first shell unit. An electronic device comprises a connection terminal unit configured to be connected with an external connector and a metallic shell configured to enclose the connection terminal unit, wherein the metallic shell comprises a first shell unit in which the connection terminal unit is mounted, and a second shell unit mounted to be separated and spaced from the first shell unit.