Abstract: A reset signal generator includes an output unit, a trip signal generator, an inverter unit, and a variation reducing unit. The output unit generates a reset signal from a pre-reset signal, and the reset signal follows a supply voltage signal before transitioning to a ground level when the supply voltage signal reaches a tripping voltage. The variation reducing unit is coupled to the inverter unit for reducing a range of the tripping voltage with temperature variations.

Abstract: An internal reference voltage generating circuit that reduces a standby current and the number of pins of a semiconductor memory device, in which a reference voltage is provided to an input buffer that receives a signal through an input to which an on die transmitor resistor is connected, includes: a voltage dividing circuit outputting the reference voltage by a power voltage; a pull down driver connected to an end of the voltage dividing circuit; and a calibration control circuit comparing a voltage level of the input and a voltage level of an end of the voltage dividing circuit, and controlling the on resistor value of the pull down driver according to a result of the comparison. The internal reference voltage generating circuit is operated while the memory controller inputs a signal into a mode register set (MRS) to enable the internal reference voltage generating circuit and the output signal of the MRS is activated.

Abstract: A dynamic random access memory (DRAM) device, including a DRAM core having memory cells for storing data information, and a read protection unit, prevents data stored in the memory cells before power-off, from being read out at power-on.

Abstract: A semiconductor memory device includes: a substrate with first and second memory-cell array regions disposed on first and second substrate sides and first and second sense-circuit regions disposed on the first and second substrate sides between the first and second memory-cell array regions; first and second bitlines coupled to a plurality of memory cells in the first memory-cell array region; first and second complementary bitlines coupled to a plurality of memory cells in the second memory-cell array region; first and second column-selection transistors formed in the first sense-circuit region, and selectively couple the first bitline and the first complementary bitline to a first input/output (I/O) line and a first complementary I/O line; and third and fourth column-selection transistors formed in the second sense-circuit region, and selectively couple the second bitline and the second complementary bitline to a second I/O line and a second complementary I/O line.

Abstract: A layout structure of bit line sense amplifiers for use in a semiconductor memory device includes first and second bit line sense amplifiers arranged to share and be electrically controlled by a first column selection line signal, and each including a plurality of transistors. In this layout structure, each of the plurality of transistors forming the first bit line sense amplifier is arranged so as not to share an active region with any transistors forming the second bit line sense amplifier.

Abstract: Provided are a semiconductor memory device and a test method thereof. The semiconductor memory device includes: a die in which a plurality of internal circuits are integrated; a plurality of first and second channel pads having a first pad size and a first pad pitch, disposed in an alternating manner in a straight line at a center part of the die, and divided into a plurality of parallel rows, wherein the plurality of first and second channel pads are configured to selectively contact test probes in an alternating manner to receive an external wafer test signal and to output a signal generated by the plurality of internal circuits to the exterior. Therefore, it is possible to perform a test using plural channel pads during a wafer test of the semiconductor memory device using a plurality of probes of a probe card without incorrect contacts or non-contact with adjacent pads.

Abstract: A driver circuit for an integrated circuit device includes a transistor that has a gate terminal, a source terminal, and a bulk substrate terminal. The source terminal is connected to the bulk substrate terminal. A pull-up circuit is connected between a power supply node and the source terminal. The pull up circuit is configured to increase a voltage at the source terminal and the bulk substrate terminal of the transistor responsive to a control signal.

Abstract: A dynamic random access memory (DRAM) device, including a DRAM core having memory cells for storing data information, and a read protection unit, prevents data stored in the memory cells before power-off, from being read out at power-on.

Abstract: A dynamic random access memory (DRAM) device, including a DRAM core having memory cells for storing data information, and a read protection unit, prevents data stored in the memory cells before power-off, from being read out at power-on.

Abstract: An internal reference voltage generating circuit that reduces a standby current and the number of pins of a semiconductor memory device, in which a reference voltage is provided to an input buffer that receives a signal through an input to which an on die transmitor resistor is connected, includes, a voltage dividing circuit outputting the reference voltage by a power voltage; a pull down driver connected to an end of the voltage dividing circuit; and a calibration control circuit comparing a voltage level of the input and a voltage level of an end of the voltage dividing circuits and controlling the on resistor value of the pull down driver according to a result of the comparison. The internal reference voltage generating circuit is operated white the memory controller inputs a signal into a mode register set (MRS) to enable the internal reference voltage generating circuit and the output signal of the MRS is activated.

Abstract: A reset signal generator includes an output unit, a trip signal generator, an inverter unit, and a variation reducing unit. The output unit generates a reset signal from a pre-reset signal, and the reset signal follows a supply voltage signal before transitioning to a ground level when the supply voltage signal reaches a tripping voltage. The variation reducing unit is coupled to the inverter unit for reducing a range of the tripping voltage with temperature variations.

Abstract: An inrush current prevention circuit for a DC-DC converter is provided and in preferred aspects comprises a switching element that transforms an input voltage by being switched on and off and outputs the transformed voltage. A filter filtrates the outputted voltage, transformed via the switching element, and outputs the filtrated voltage as an output voltage. A reference voltage generator generates a reference voltage. An error amplifier compares the reference voltage and output voltage and outputs an error signal. A Pulse Width Modulation (PWM) signal generator generates a PWM signal to switch on and off the switching element according to the error signal. An on-off circuit either transmits or isolates the PWM signal to the switching element. An Electronic Control Unit (ECU) controls the on-off circuit. Preferred systems of the invention can prevent an inrush current immediately following power input or during reactivation of the DC-DC converter.

Abstract: An external high/low voltage compatible semiconductor memory device includes an internal voltage pad, an internal voltage generation circuit, and an internal voltage control signal generation circuit. The internal voltage pad connects a low external voltage with an internal voltage, and the internal voltage generation circuit generates an internal voltage in response to an internal voltage control signal and a high external voltage. The internal voltage control signal generation circuit generates an internal voltage control signal according to an high or low external voltage. Thus, a database of the semiconductor memory device can be managed without classifying the database into databases for the high voltage and databases for the low voltage because of the internal voltage control signal. In addition, the internal voltage level is stable because charges provided to the internal voltage are regulated according to a voltage level of the external voltage.

Abstract: A bit line pre-charge circuit of a semiconductor memory device includes a pre-charge circuit connected between a pair of bit lines for pre-charging the pair of bit lines in response to a pre-charge control signal and a pre-charge voltage transmitting circuit for transmitting a pre-charge voltage to the pre-charge circuit in response to the pre-charge control signal. A voltage drop in a pre-charge voltage generation line may be prevented when a short circuit is formed between a word line and a pair of bit lines, and current consumption during a standby operation of the semiconductor memory device may also be reduced, by preventing current from flowing from the pair of bit lines to the pre-charge voltage generation line.

Abstract: An inrush current prevention circuit for a DC-DC converter is provided and in preferred aspects comprises a switching element that transforms an input voltage by being switched on and off and outputs the transformed voltage. A filter filtrates the outputted voltage, transformed via the switching element, and outputs the filtrated voltage as an output voltage. A reference voltage generator generates a reference voltage. An error amplifier compares the reference voltage and output voltage and outputs an error signal. A Pulse Width Modulation (PWM) signal generator generates a PWM signal to switch on and off the switching element according to the error signal. An on-off circuit either transmits or isolates the PWM signal to the switching element. An Electronic Control Unit (ECU) controls the on-off circuit. Preferred systems of the invention can prevent an inrush current immediately following power input or during reactivation of the DC-DC converter.

Abstract: A semiconductor memory device and a method for pre-charging the same, the semiconductor memory device comprising a plurality of memory cell array blocks, each having a plurality of memory cells connected between respective bit line pairs and respective word line pairs, a plurality of pairs of data input/output lines connected to the respective bit line pairs for transferring data, a first pre-charge circuit for pre-charging the bit line pairs to a first pre-charge voltage during a first operation, a second pre-charge circuit for pre-charging the data input/output line pairs and the first pre-charge voltage to the first pre-charge voltage during the first operation, a plurality of third pre-charge circuits, each being disabled in the first operation and pre-charges the data input/output line pairs in the corresponding memory cell array blocks to a second pre-charge voltage during a second operation, and a discharging circuit for lowering the first pre-charge voltage when the first pre-charge voltage is greater

Abstract: A dynamic random access memory (DRAM) device, including a DRAM core having memory cells for storing data information, and a read protection unit, prevents data stored in the memory cells before power-off, from being read out at power-on.

Abstract: A bit line pre-charge circuit of a semiconductor memory device includes a pre-charge circuit connected between a pair of bit lines for pre-charging the pair of bit lines in response to a pre-charge control signal and a pre-charge voltage transmitting circuit for transmitting a pre-charge voltage to the pre-charge circuit in response to the pre-charge control signal. A voltage drop in a pre-charge voltage generation line may be prevented when a short circuit is formed between a word line and a pair of bit lines, and current consumption during a standby operation of the semiconductor memory device may also be reduced, by preventing current from flowing from the pair of bit lines to the pre-charge voltage generation line.

Abstract: An external high/low voltage compatible semiconductor memory device includes an internal voltage pad, an internal voltage generation circuit, and an internal voltage control signal generation circuit. The internal voltage pad connects a low external voltage with an internal voltage, and the internal voltage generation circuit generates an internal voltage in response to an internal voltage control signal and a high external voltage. The internal voltage control signal generation circuit generates an internal voltage control signal according to an high or low external voltage. Thus, a database of the semiconductor memory device can be managed without classifying the database into databases for the high voltage and databases for the low voltage because of the internal voltage control signal. In addition, the internal voltage level is stable because charges provided to the internal voltage are regulated according to a voltage level of the external voltage.

Abstract: A semiconductor memory device including a delay locked loop (DLL) that is capable of turning off the DLL in a precharge mode while maintaining locking information stored before the DLL operates in the precharge mode is provided. The DLL includes an ON/OFF mode for turning the DLL on or off. The DLL also includes a standby mode for turning the DLL off while still maintaining locking information stored before the DLL operates in a precharge mode in response to the activation of a standby enabling signal. The standby enabling signal is inactive when the DLL locks. The standby enabling signal is active when DLL lock is complete.