Abstract: A semiconductor memory device and a method for pre-charging the same, the semiconductor memroy device comprising a plurality of memory cell array blocks, each having a plurality of memory cells connected between respective bit line pairs and respective word line pairs, a plurality of pairs of data input/output lines connected to the respective bit line pairs for transferring data, a first pre-charge circuit for pre-charging the bit line pairs to a first pre-charge voltage during a first operation, a second pre-charge circuit for pre-charging the data input/output line pairs and the first pre-charge voltage to the first pre-charge voltage during the first operation, a plurality of third pre-charge circuits, each being disabled in the first operation and pre-charges the data input/output line pairs in the corresponding memory cell array blocks to a second pre-charge voltage during a second operation, and a discharging circuit for lowering the first pre-charge voltage when the first pre-charge voltage is greater

Abstract: A semiconductor memory device including a delay locked loop (DLL) that is capable of turning off the DLL in a precharge mode while maintaining locking information stored before the DLL operates in the precharge mode is provided. The DLL includes an ON/OFF mode for turning the DLL on or off. The DLL also includes a standby mode for turning the DLL off while still maintaining locking information stored before the DLL operates in a precharge mode in response to the activation of a standby enabling signal The standby enabling signal is inactive when the DLL locks. The standby enabling signal is active when DLL lock is complete.

Abstract: A signal line drive circuit for a semiconductor device includes a first driver having an input for receiving an input signal and an output, a second driver having an input connected to the output of the first driver and an output connected to a signal line, and a third driver having an input connected to the output of the first driver and an output connected to a point of the signal line. The point of the signal line is spaced from the output of the second driver such that a first load is present between the output of the second driver and the point of the signal line, and such that a second load is present between the point of the signal line and an output of the signal line. The first, second and third drivers each include at least one inverting buffer. The drive circuit reduces a delay time of a signal transmitted through the signal line, and improves the voltage-time slope of the transmitted signal.

Abstract: The semiconductor memory device includes a power supply voltage (Vcc) applied to the semiconductor device, a row controller for generating an output signal in response to a control signal representing one of a normal operation state and a stand-by state, and a plurality of row decoders connected between the row controller and a plurality of word lines. Each row decoder activates a corresponding word line in response to the output signal from the row controller and a row address signal from an external source, and the output signal of the row controller is a high voltage or a ground voltage when the plurality of row decoders are in a normal operation state or in a stand-by state, respectively. The semiconductor memory device also includes a column controller for generating an output signal in response to a first control signal representing one of a normal operation state and a stand-by state and a plurality of column decoders connected between the column controller and a plurality of column selection lines.

Abstract: Multi-bank integrated circuit memory devices include a plurality of banks of memory cells that are divided into pairs of sub-banks of memory cells. The sub-banks of memory cells are arranged in a plurality of rows and columns of sub-banks of memory cells. The pairs of sub-banks extend diagonally relative to the plurality of rows and columns of sub-banks of memory cells. The pairs of sub-banks of the respective banks preferably are adjacent one another and extend diagonally relative to the plurality of rows and columns of sub-banks of memory cells. By providing diagonally extending sub-banks, the row address lines that extend between respective sub-banks of each bank may occupy reduced area. More specifically, row address lines that extend between pairs of sub-banks in same adjacent rows and same adjacent columns can cross over one another to thereby allow reduced area.

Abstract: An integrated circuit memory device includes a two-dimensional memory array in which the first and second dimensions extend in first and second directions respectively. The memory device further includes a decoder for the first dimension and a plurality of fuses between the decoder and the memory array. Upon encountering a defective storage cell in the memory array, the appropriate fuse can be cut to physically segregate the decoder from the defective cell. This allows the memory to operate without any delay inserted for switching to a spare or redundant memory array of storage cells, thus maximizing the memory operating speed. In a preferred embodiment, the fuses are arranged such that the relative spacing between the fuses proceeds substantially along the second direction and the fuses are oriented lengthwise in the first direction. By following this arrangement, the impact on the layout area for the memory device is minimal.

Abstract: A back bias generator for a semiconductor device improves refresh characteristics, reduces leakage current, and increases back bias supply capacity in a DRAM having a triple well structure by applying a well bias voltage to the bulk of an NMOS transfer transistor. The back bias generator includes a well bias generator that generates the well bias voltage before the pumping voltage is applied to the transfer transistor. The well bias provides a back bias to a parasitic NPN transistor formed in the triple well of the NMOS transfer transistor, thereby preventing leakage through the NPN into the substrate. The well bias is also applied to the bulk of a clamp transistor that initializes a pumping capacitor.

Abstract: A PFC converter includes a bridge diode, a booster section controlled for improving a power factor of the bridge diode, a transformer section supplied with an output of the booster section via a primary coil side to excite it to a secondary coil side, a switch section for switching the output of the booster section, an output section for rectifying and smoothing the output of secondary coil side of the transformer section, a control section for sensing to feedback an output voltage of the output section and thus control the switch section, and a delay section operated for applying a stable voltage to the transformer section by controlling the booster section according to the output of the control section, so that the booster section is controlled for decreasing the harmonic current by the delayed output of the delay section to constantly maintain the voltage of a bulk condenser and thereby improve the power factor while controlling double stage PFC converter and DC--DC converter by the single phase.

Abstract: Integrated circuit memory devices include a semiconductor substrate of first conductivity type (e.g., P-type), a first well region of second conductivity type (e.g., N-type) in the substrate and first and second nonoverlapping sub-well regions of first conductivity type in the first well region. To improve the electrical characteristics of circuits within the memory device, a first semiconductor device is provided in the first sub-well region (which is biased at a back-bias potential (Vbb)) and a second semiconductor device is provided in the second sub-well region (which is biased at a ground or negative supply potential (Vss)). The first semiconductor device is preferably selected from the group consisting of memory cell access transistors, equalization circuits and isolation gates. The second semiconductor device is also preferably selected from the group consisting of column select circuits and sense amplifiers.

Abstract: A synchronous semiconductor memory device having a wave pipelining control structure and a method of outputting data therefrom. A register for storing the data output from a memory cell is controlled by a control signal in response to first and second external clock signals. The level transition of the control signal derived from the first clock is delayed, so that data output malfunctioning is prevented even though manufacturing process conditions are changed.

Abstract: A semiconductor memory device having a hierarchical input/output line structure and a method for arranging the same are provided. The semiconductor memory device includes a sub-array including a plurality of memory cells. The semiconductor memory device further includes a sense amplifier for sensing and amplifying the data of the memory cells of the sub-array. The semiconductor memory device further includes a sub-word line driver for driving the word lines of the memory cells. The semiconductor memory device further includes a local input/output line for receiving and transmitting the output signal of the sense amplifier. The semiconductor memory device further includes a global input/output line for receiving and transmitting the signal of the local input/output line. The semiconductor memory device further includes switching means for transmitting the signal of the local input/output line to the global input/output line in response to predetermined control signals.

Abstract: An internal power control circuit for a semiconductor device allows easy testing of the internal circuit blocks or memory arrays at various voltage levels. In the semiconductor device, internal voltage switching circuits connected between the internal power supply line and each array power supply line are switched ON or OFF according to signals applied to control pads coupled to each internal voltage switching circuit. During normal operation, a power voltage generated by the internal voltage generator is applied through an internal power supply line to each array power supply line coupled to the internal circuit blocks. During a test operation, different power voltages may be applied to the control pads to selectively decouple individual array power supply lines from the internal power supply line, and selectively couple the power voltages applied to the control pads to the corresponding array power supply lines and internal circuit blocks.

Abstract: A signal generator produces enable signals for bitline sense amplifiers in a semiconductor device. The signal generator includes a first driving element for producing a first enable signal at a first output line in response to first and second control signals, a second driving element for producing a second enable signal at a second output line in response to inverted signals of the first and second control signals, and an equalizing element connected between the first output line and the second output line for equalizing the first and second output lines in response to a third control signal. A control signal generating element generates the first, second, and third control signals, and inverted signals thereof, in response to predetermined input signals. The DC current generated from an output driver and the charging and discharging current of output loading can be reduced, to thereby reduce power consumption.

Abstract: A memory device includes a plurality of data input/output (I/O) lines and means for receiving a column address. The memory device also includes a plurality of primary memory cells, a selected primary memory cell of the plurality of primary memory cells being connected to a primary global I/O line in response to receipt of one column address, and a plurality of redundant memory cells, a selected redundant memory cell of the plurality of redundant memory cells being connected to a redundant global I/O line in response to receipt of the one column address.

Abstract: An integrated circuit memory device includes an array of memory cells arranged into rows and columns. A main word line decoder receives a first portion of a row address and generates a main word line activation signal on a predetermined word line in response thereto. A word driver predecoder receives a second portion of the row address and generates a sub-row activation signal in response thereto. A sub-word line driver generates a sub-word line activation signal on an output node. This sub-word line driver includes a pull-down transistor, a pull-up transistor, and a driving transistor. The pull-down transistor electrically connects the output node to a ground terminal in response to an inverse of the sub-row activation signal. The pull-up transistor transfers the sub-row activation signal to the output node in response to the main word line activation signal. The driving transistor transfers the main word line activation signal to the output node in response to the sub-row activation signal.

Abstract: Programmable disabling and selection circuits operate on a block level for integrated circuit memory devices. Thus, a redundant block can be substituted for a block having more defective rows and/or columns than the number of redundant rows and/or columns which are provided in the integrated circuit memory devices. A plurality of normal block selection circuits are included, a respective one of which produces a respective normal block selection signal in response to an address of a respective one of the plurality of blocks of memory cells. A plurality of programmable block selection circuits are also included, a respective one of which is connected between the respective one of the plurality of normal block selection circuits and a respective one of the plurality of blocks of memory cells. Each programmable block selection circuit includes a first fuse, the activation of which blocks the corresponding one of the plurality of normal block selection circuits.

Abstract: A reference voltage generator includes a pull-up stage which pulls a reference voltage signal rapidly up toward 1/2Vcc at power-up. The pull-up stage is controlled by a controller which has a comparator and control voltage generator which are disabled after the pull-up operation is terminated so as to reduce stand-by current consumption. The controller includes a pair of NAND gates cross connected as an RS flip-flop to turn on the pull-up stage at power up. A boost signal allows the flip-flop to enable the comparator and control voltage generator after the power supply has stabilized. When the reference voltage signal reaches 1/2Vcc, the comparator sets the flip flop which turns off the pull-up stage and disables the comparator and control voltage generator.

Abstract: Integrated circuit memory devices include at least first and second memory cells electrically coupled to respective first and second sense bit signal lines of a sense amplifier. The sense amplifier comprises a circuit for amplifying a difference in potential between the first and second sense bit signal lines by driving these lines to respective first and second different potentials. A driving circuit is also provided for simultaneously driving the first and second sense bit signal lines towards the first potential in response to application of a boost control signal. This driving circuit preferably comprises a first capacitor electrically connected in series between the boost control input and the first sense bit signal line and a second capacitor electrically connected in series between the boost control input and the second sense bit signal line. The boost control signal is established at the first potential to drive both the sense bit signal lines from different intermediate potentials (e.g.

Abstract: A semiconductor integrated circuit with a stress circuit and a stress voltage supplying method thereof ensures the reliability of the device. The semiconductor integrated circuit has a stress enable circuit for generating an enable signal during a test operation of the chip and for enabling the test operation, a stress voltage supplying circuit for supplying a first stress voltage and a second stress voltage in response to an output signal of the stress enable circuit during the test operation, and a sensing delay control circuit for receiving the first and second stress voltages and for delaying an operation of the sense amp control circuit during the test operation. During the test operation, the first and second stress voltages are supplied to word lines adjacent to each other in response to the output signal of the stress enable circuit, and a state of a selected memory cell by the word line is sensed in response to an output signal of the sensing delay control circuit.

Abstract: A current sense amplifier for use in a semiconductor memory device having a pair of sub-I/O lines and a pair of I/O lines includes a first circuit leg having a first PMOS transistor in series with a second NMOS transistor. A second circuit leg has a third PMOS transistor in series with a fourth NMOS transistor. The gates of the PMOS transistors are each cross coupled to the drain of the other PMOS transistor. The gates of the NMOS transistor are each cross coupled to the source of the PMOS transistor in the other circuit leg. The source of each PMOS transistor comprises a sub-Input/Output line with an Input/Output line located between the transistors in each of the legs.