Patents by Inventor Kyu Cho

Kyu Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160327297
    Abstract: An air conditioner (AC) indoor unit includes a housing having an inlet and an outlet; a heat exchanger arranged inside the housing; a blower fan for sucking in air at the inlet to be subject to heat exchange with the heat exchanger, and discharging the heat-exchanged air out of the outlet; and an air flow control device for controlling an air flow discharged from the outlet by sucking in air around the outlet. The AC indoor unit may control the direction of a discharged air flow without a conventional blade structure, thereby increasing an amount of discharged air, reducing circulation noise, and enabling design differentiation.
    Type: Application
    Filed: May 3, 2016
    Publication date: November 10, 2016
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Woo Seog SONG, Dong Yoon Lee, Bu Youn Lee, Dong Woon Kang, Do Yeon Kim, Do-Hoon Kim, Byung Ghun Kim, Young-Jae Kim, Jun Woo Kim, Hyun Ah Kim, Yong Ho Seo, Hyeong Joon Seo, Byung Yul So, Jae Hyoung Sim, Joon-Ho Yoon, Jung Dae Lee, Chang Seon Lee, Chul Ju Lee, Seung Beom Lim, Keun Jeong Jang, Min Gu Jeon, Min-Gi Cho, Sung-June Cho, Eun Sung Jo, Hyeong Kyu Cho
  • Patent number: 9490070
    Abstract: A multilayer ceramic electronic component may include: a ceramic body in which dielectric layers containing plate-shaped dielectric grains are stacked; and internal electrodes disposed on the dielectric layers within the ceramic body. The dielectric layer may contain dielectric grains, plate-shaped surfaces of which have an angle of 20° or less with regard to a boundary surface between the dielectric layer and the internal electrode.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: November 8, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sun Ho Yoon, Hang Kyu Cho, Han Soung Jeong, Hyo Jung Kim
  • Publication number: 20160322653
    Abstract: A flow battery system includes a first tank having a hydrogen reactant, a second tank having a bromine electrolyte, at least one cell including a hydrogen reactant side operably connected to the first tank through an ¾ feed and return system and a bromine electrolyte side operably connected to the second tank, and a crossover return system. The crossover return system includes a vessel operably connected to the ¾ feed and return system and configured to receive an effluent containing a first portion of the hydrogen reactant and a second portion of the bromine electrolyte, the vessel configured to separate the first portion from the second portion. A first return line returns the first portion of the hydrogen reactant to the first tank and a second return line returns the bromine electrolyte to the second tank.
    Type: Application
    Filed: December 22, 2014
    Publication date: November 3, 2016
    Inventors: Edward Knudsen, Paul Albertus, Michael C. Tucker, Taek Kyu Cho, Adam Z. Weber
  • Publication number: 20160308237
    Abstract: A flow battery system includes a first tank including a hydrogen reactant, a second tank including a bromine electrolyte, and at least one cell including a first electrolyte side operably connected to the first tank and a second electrolyte side operably connected to the second tank. The battery system further includes a direct connection line directly connecting the first tank and the second tank and configured such that the hydrogen reactant passes between the first tank and the second tank.
    Type: Application
    Filed: December 18, 2014
    Publication date: October 20, 2016
    Applicant: Robert Bosch GmbH
    Inventors: Paul Albertus, Edward Knudsen, Michael C. Tucker, Taek Kyu Cho, Adam Z. Weber
  • Patent number: 9472509
    Abstract: Methods for forming a dummy metal structure between dies on a semiconductor wafer and the resulting devices are disclosed. Embodiments may include forming metal interconnection layers extending from a substrate of a semiconductor wafer to a top metal interconnection layer of the semiconductor wafer between a plurality of die regions, each of the metal interconnection layers including a plurality of dummy vertical interconnect accesses (VIAs) and a plurality of dummy metal lines, with the plurality of dummy metal lines laterally connecting the plurality of dummy VIAs within each respective metal interconnection layer, and a plurality of dummy VIAs within a first metal interconnection layer vertically connecting a plurality of dummy metal lines within the first metal interconnection layer to a plurality of dummy metal lines within a second metal interconnection layer, and the second metal interconnection layer being below the first metal interconnection layer.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: October 18, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Jae Kyu Cho, Shan Gao
  • Publication number: 20160298238
    Abstract: A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reactors; a plurality of gas supply units connected to the plurality of reactors; and a plurality of plasma supply units connected to the plurality of reactors. Each of the plasma supply units includes: a plasma power supplier; a plurality of diodes connected to the plasma power supplier; and a reverse voltage driver connected to the plurality of diodes through respectively corresponding switches.
    Type: Application
    Filed: June 21, 2016
    Publication date: October 13, 2016
    Inventor: Hyun-Kyu CHO
  • Patent number: 9466424
    Abstract: A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers; internal electrodes disposed in the ceramic body and having one ends exposed to outer surfaces of the ceramic body; and external electrodes disposed on the outer surfaces of the ceramic body to be connected to the respective one ends of the internal electrodes and containing a conductive metal and a conductive ceramic powder.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: October 11, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chung Eun Lee, Doo Young Kim, Hang Kyu Cho, Jong Ho Lee
  • Patent number: 9455210
    Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability, and that does not cause whitening and surface stickiness even under harsh conditions.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: September 27, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Bum Gyu Choi, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Publication number: 20160258062
    Abstract: A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reaction spaces, a plurality of plasma electrodes respectively disposed in the reaction spaces, a first plasma processor connected to at least two plasma electrodes, and a first plasma power source connected to the first plasma processor. The first plasma processor may include a plasma distributor or a plasma splitter.
    Type: Application
    Filed: May 18, 2016
    Publication date: September 8, 2016
    Inventors: Ki Jong KIM, Hyun Kyu CHO, Jin Su LEE, Se Yong KIM
  • Publication number: 20160254234
    Abstract: Methods for forming a dummy metal structure between dies on a semiconductor wafer and the resulting devices are disclosed. Embodiments may include forming metal interconnection layers extending from a substrate of a semiconductor wafer to a top metal interconnection layer of the semiconductor wafer between a plurality of die regions, each of the metal interconnection layers including a plurality of dummy vertical interconnect accesses (VIAs) and a plurality of dummy metal lines, with the plurality of dummy metal lines laterally connecting the plurality of dummy VIAs within each respective metal interconnection layer, and a plurality of dummy VIAs within a first metal interconnection layer vertically connecting a plurality of dummy metal lines within the first metal interconnection layer to a plurality of dummy metal lines within a second metal interconnection layer, and the second metal interconnection layer being below the first metal interconnection layer.
    Type: Application
    Filed: May 12, 2016
    Publication date: September 1, 2016
    Inventors: Jae Kyu CHO, Shan GAO
  • Patent number: 9418789
    Abstract: A multilayer ceramic electronic component may include: a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on an upper portion of the active part, and a lower cover part disposed on a lower portion thereof; a first dummy electrode disposed between a central portion of the upper or lower cover part in a length direction and one end surface of the cover part in the length direction; and a second dummy electrode disposed between the central portion of the upper or lower cover part in the length direction and the other end surface of the cover part in the length direction, and spaced apart from the first dummy electrode.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: August 16, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho Lee, Hang Kyu Cho, Doo Young Kim, Chung Eun Lee, Chul Seung Lee
  • Patent number: 9406608
    Abstract: Methods for forming a dummy metal structure between dies on a semiconductor wafer and the resulting devices are disclosed. Embodiments may include forming metal interconnection layers extending from a substrate of a semiconductor wafer to a top metal interconnection layer of the semiconductor wafer between a plurality of die regions, each of the metal interconnection layers including a plurality of dummy vertical interconnect accesses (VIAs) and a plurality of dummy metal lines, with the plurality of dummy metal lines laterally connecting the plurality of dummy VIAs within each respective metal interconnection layer, and a plurality of dummy VIAs within a first metal interconnection layer vertically connecting a plurality of dummy metal lines within the first metal interconnection layer to a plurality of dummy metal lines within a second metal interconnection layer, and the second metal interconnection layer being below the first metal interconnection layer.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: August 2, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Jae Kyu Cho, Shan Gao
  • Patent number: 9399819
    Abstract: A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reactors; a plurality of gas supply units connected to the plurality of reactors; and a plurality of plasma supply units connected to the plurality of reactors. Each of the plasma supply units includes: a plasma power supplier; a plurality of diodes connected to the plasma power supplier; and a reverse voltage driver connected to the plurality of diodes through respectively corresponding switches.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: July 26, 2016
    Assignee: ASM IP HOLDINGS B.V.
    Inventor: Hyun-Kyu Cho
  • Publication number: 20160206241
    Abstract: A wearable body composition analyzer according to various embodiments of the present disclosure may include an induction part for inducing secretion of bodily liquid while being in contact with a body part, a collection part that collects the bodily liquid secreted, a sensor part that detects a body composition from the bodily liquid collected, and a wearable part to which the induction part and the collection part is detachably attached, wherein the wearable part may be worn on a body. The above-described wearable body composition analyzer may be implemented variously according to embodiments.
    Type: Application
    Filed: January 20, 2016
    Publication date: July 21, 2016
    Inventors: Chul-Ho CHO, Kwang-Bok KIM, Seong-Je CHO, Young-Kyu CHO, Seung-Min LEE, Jeong-Gun LEE, Sun-Tae JUNG, Jae-Geol CHO
  • Patent number: 9390854
    Abstract: A multilayer ceramic electronic component may include: a plurality of active parts including a plurality of dielectric layers and a plurality of internal electrodes that are alternately disposed, the plurality of active parts being stacked; an interlayer margin part disposed between the active parts adjacent to each other and containing magnesium; an upper cover part disposed on an upper portion of an uppermost active part among the plurality of active parts and containing magnesium; and a lower cover part disposed on a lower portion of a lowermost active part among the plurality of active parts and containing magnesium, wherein the upper and lower cover parts and the interlayer margin part include magnesium-nickel oxide layers formed on interfaces thereof adjacent to the active parts.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: July 12, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chung Eun Lee, Doo Young Kim, Hang Kyu Cho, Jong Ho Lee
  • Patent number: 9371583
    Abstract: A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reaction spaces, a plurality of plasma electrodes respectively disposed in the reaction spaces, a first plasma processor connected to at least two plasma electrodes, and a first plasma power source connected to the first plasma processor. The first plasma processor may include a plasma distributor or a plasma splitter.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: June 21, 2016
    Assignee: ASM GENITECH KOREA LTD.
    Inventors: Ki Jong Kim, Hyun Kyu Cho, Jin Su Lee, Se Yong Kim
  • Publication number: 20160174421
    Abstract: Disclosed herein are a metal texture coating for transmitting an electric wave and a manufacturing method thereof The metal texture coating for transmitting an electric wave includes: a transparent resin film; a metal texture layer deposited on any one of both surfaces of the resin film; and a chromium oxide layer deposited on the metal texture layer so as to transmit the electric wave therethrough and protect the metal texture layer.
    Type: Application
    Filed: May 18, 2015
    Publication date: June 16, 2016
    Inventors: So Jung Shim, Byung Kyu Cho, Seung Chan Hong
  • Patent number: 9368282
    Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers and internal electrodes; an electrode layer disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes; a first composite resin layer disposed on the electrode layer and including a first conductive powder; and a second composite resin layer disposed on the first composite resin layer and including a second conductive powder different from the first conductive powder.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: June 14, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Ik Moon, Byoung Jin Chun, Hang Kyu Cho, Jae Hwan Han
  • Patent number: 9362468
    Abstract: Provided are a curable composition and its use. The curable composition having excellent processability, workability, heat resistance, and light resistance, and having no problem of discoloring despite using for a long time may be provided. The curable composition which may scatter light and disperse linearity of light when used as an encapsulant of an optical semiconductor such as an LED may be provided.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: June 7, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 9355926
    Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability, and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions and that does not cause whitening or surface stickiness.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: May 31, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Min Jin Ko, Bum Gyu Choi, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho