Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an oxide film formed on one surface of the ceramic body; first and second external electrodes formed on both sides of the oxide film on one surface of the ceramic body; a first internal electrode formed on the dielectric layer and including a first electrode lead-out portion exposed to the first external electrode and a first insulating lead-out portion exposed to the oxide film and having a composite-metal-oxide region formed in an exposed edge portion thereof; a second internal electrode facing the first internal electrode, having the dielectric layer interposed therebetween, and including a second electrode lead-out portion exposed to the second external electrode and a second insulating lead-out portion exposed to the oxide film, having a composite-metal-oxide region formed in an exposed edge portion thereof, and overlapped with the first insulating lead-out portion to form additional capacitance.

Abstract: A belt type CVT, which has a variable drive pulley controlling a transmission gear ratio by varying a diameter and a variable driven pulley connected to the variable drive pulley by a belt and controlling a tension of the belt by varying a diameter in a manner opposite to that of the variable drive pulley, in which each of the variable drive and driven pulleys includes belt supports movably installed between a pair of pulley plates, and transmission plates mounted to outside surfaces of respective pulley plates and rotated in opposite directions, thereby moving the plurality of belt supports in the radial directions, and the inner surface of the belt is provided with ratchet gear parts engaged with the belt holding ratchet gear parts of the belt supports, so that the diameters of the variable drive pulley and the variable driven pulley can be more easily and efficiently varied.

Abstract: The present invention provides an inertia test apparatus for a model ship that mimics a pitching inertia radius of an actual ship by reciprocating a model ship. The apparatus includes a base frame providing a supporting force, vertical frames integrally fixed at both sides of the base frame and having a hinge shaft on an upper end, a swing including a pair of fixing members rotatably hung on the hinge shafts of the vertical frames and a bed integrally formed at a lower ends of the fixing members, and providing a pitching inertia radius of the model ship by reciprocating about the hinge shafts, with the model ship seated on the bed, and a centering adjuster seating the model ship on the bed of the swing and matching a center of gravity of the model ship with a center of the swing by allowing the model ship to move.

Abstract: Disclosed is a radio wave penetration-type multilayer optical coating. The coating includes: a transparent first resin layer; an optical coating with a multilayer structure formed by alternately forming TiO2 and SiO2 on the first resin layer; and an opaque second resin layer formed on the optical coating.

Abstract: A heat dissipating plate for a light emitting diode (LED) includes a metal thin film containing a hydroxyl functional group (—OH). A coating layer is disposed on at least one surface of the metal thin film and includes a carbon nanotube containing a hydrophilic functional group. The coating layer is attached to the metal thin film by bonding the hydroxyl functional group with the hydrophilic functional group in a hydrogen bond.

Abstract: Methods for forming a dummy metal structure between dies on a semiconductor wafer and the resulting devices are disclosed. Embodiments may include forming metal interconnection layers extending from a substrate of a semiconductor wafer to a top metal interconnection layer of the semiconductor wafer between a plurality of die regions, each of the metal interconnection layers including a plurality of dummy vertical interconnect accesses (VIAs) and a plurality of dummy metal lines, with the plurality of dummy metal lines laterally connecting the plurality of dummy VIAs within each respective metal interconnection layer, and a plurality of dummy VIAs within a first metal interconnection layer vertically connecting a plurality of dummy metal lines within the first metal interconnection layer to a plurality of dummy metal lines within a second metal interconnection layer, and the second metal interconnection layer being below the first metal interconnection layer.

Abstract: An electronic device comprising: a memory; and at least one processor configured to: install an application by using an installation file associated with the application; grant at least one permission to the application based on a permission setting token that is included in the installation file; and store, in a database, an indication that the application is granted the permission.

Abstract: Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and adhesiveness after curing, has long-lasting durability and reliability even under harsh conditions, and does not cause whitening or surface stickiness. The curable composition can be used as an encapsulant or adhesive material for an optical semiconductor such as an LED.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained. Specifically the curable composition is a blend of three different polyorganosiloxanes having aliphatic unsaturated groups and specific Ar/Si ratios and a polyorganosiloxane having SiH groups.

Abstract: A multilayer ceramic electronic component may include: a plurality of active parts including a plurality of dielectric layers and a plurality of internal electrodes that are alternately disposed, the plurality of active parts being stacked; an interlayer margin part disposed between the active parts adjacent to each other and containing magnesium; an upper cover part disposed on an upper portion of an uppermost active part among the plurality of active parts and containing magnesium; and a lower cover part disposed on a lower portion of a lowermost active part among the plurality of active parts and containing magnesium, wherein the upper and lower cover parts and the interlayer margin part include magnesium-nickel oxide layers formed on interfaces thereof adjacent to the active parts.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on an upper portion of the active part, and a lower cover part disposed on a lower portion thereof; a first dummy electrode disposed between a central portion of the upper or lower cover part in a length direction and one end surface of the cover part in the length direction; and a second dummy electrode disposed between the central portion of the upper or lower cover part in the length direction and the other end surface of the cover part in the length direction, and spaced apart from the first dummy electrode.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers; internal electrodes disposed in the ceramic body and having one ends exposed to outer surfaces of the ceramic body; and external electrodes disposed on the outer surfaces of the ceramic body to be connected to the respective one ends of the internal electrodes and containing a conductive metal and a conductive ceramic powder.

Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions in a long time and having no whitening and surface stickiness.

Abstract: Disclosed are an Fe—Au barcode type nanowire and a method of manufacturing the same. The nanowire has a magnetic-optical multifunction and is suitable for adjusting magnetic intensity thereof. The Fe—Au nanowire has a multilayered structure, in which an iron layer and a gold layer are alternately and repeatedly formed, and is formed in a single plating bath through a pulse electro-deposition.

Abstract: A method of managing application installation is provided. The method includes receiving an application by an electronic device, determining an application signature key included in the application, if the application signature key matches a development signature key among the development signature key and a commercial signature key, verifying the application signature key in relation to whether the electronic device corresponds to information on a test electronic device defined in the application signature key, and installing the application based on a verification result of the application signature key.

Abstract: A curable composition and use thereof are provided. The composition can be useful in exhibiting excellent processability and workability, and providing a cured product which exhibits superior light extraction efficiency, crack resistance, hardness, thermal shock resistance, and adhesive properties, has superior reliability under severe conditions for a long period of time and prevents opacity and stickiness onto a surface thereof when cured. Also, the curable composition capable of preventing precipitation of an additive such as a fluorescent material or a photoconversion material and being formed into a cured product having excellent transparency even when the additive is added to the curable composition can be provided.

Abstract: A non-volatile memory device includes gate structures, an insulation layer pattern, and an isolation structure. Multiple gate structures being spaced apart from each other in a first direction are formed on a substrate. Ones of the gate structures extend in a second direction that is substantially perpendicular to the first direction. The substrate includes active regions and field regions alternately and repeatedly formed in the second direction. The insulation layer pattern is formed between the gate structures and has a second air gap therein. Each of the isolation structures extending in the first direction and having a first air gap between the gate structures, the insulation layer pattern, and the isolation structure is formed on the substrate in each field region.

Abstract: Disclosed are a transceiving surface-treated metallic member disposed within a transmission path of a radar, and a method of manufacturing the transceiving surface-treated metallic member. The surface-treated metallic member in the invention provides a more secure transception property within the transmission path of the radar, particularly when it is applied as a smart cruise control (SCC) cover, has an aesthetic appearance, and is manufactured at reduced cost.

Abstract: A multilayer ceramic electronic component may include: a ceramic body in which dielectric layers containing plate-shaped dielectric grains are stacked; and internal electrodes disposed on the dielectric layers within the ceramic body. The dielectric layer may contain dielectric grains, plate-shaped surfaces of which have an angle of 20° or less with regard to a boundary surface between the dielectric layer and the internal electrode.

Abstract: Compositions that have relatively high Tg, relatively low CTE, and relatively low modulus are suitable for use as encapsulants with stress-sensitive electronic assemblies, such as those containing low k dielectrics. These compositions are used in methods of die attachment, encapsulation, and solder bump reinforcement.