Patents by Inventor Kyu Choi

Kyu Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11009691
    Abstract: Provided are a microscope apparatus and a method for correcting a position of a light source according to an exemplary embodiment of the present disclosure. The microscope apparatus for correcting the position of the light source according to the exemplary embodiment of the present disclosure includes: a light source unit which includes a light emitting element array including multiple light emitting elements and is configured to emit light to a subject; an optical unit which is disposed in parallel with the subject and configured to form an enlarged image of the subject to which the light is emitted; an image sensor which is configured to acquire the enlarged image of the subject by capturing the enlarged image formed by the optical unit; and a processor which is operably connected to the light source unit, the optical unit, and the image sensor and corrects a position of the light source unit based on the image acquired by the image sensor.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: May 18, 2021
    Assignees: Industry-Academic Cooperation Foundation, Yonsei University, Small Machines
    Inventors: Chul Min Joo, Seung Ri Song, Sunwoong Hur, Jun Kyu Choi, Chang Hyuk Yoo
  • Publication number: 20210143128
    Abstract: A stack package includes a lower semiconductor chip disposed on a package substrate, an interposer bridge including through vias, and an upper semiconductor chip. The upper semiconductor chip has a first edge and a second edge which are opposite to each other. The upper semiconductor chip includes a first region, a third region and a connection region which are located between the first and second edges. The upper semiconductor chip also includes a redistributed layer pattern that connects pads disposed on the first and third regions to each other. The redistributed layer pattern extends onto the connection region.
    Type: Application
    Filed: May 26, 2020
    Publication date: May 13, 2021
    Applicant: SK hynix Inc.
    Inventor: Bok Kyu CHOI
  • Publication number: 20210134735
    Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 6, 2021
    Inventors: YongIk Choi, Chris Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi, Sarah Haney, Li Sun
  • Patent number: 10991640
    Abstract: A semiconductor package includes a first semiconductor die and a stack of second semiconductor dies disposed on a package substrate. The semiconductor package further includes a first bridge die having first through vias that electrically connect the first semiconductor die to the package substrate, a second bridge die having second through vias that electrically connect the stack of the second semiconductor dies to the package substrate, and a third semiconductor die disposed to overlap with the first semiconductor die and the stack of the second semiconductor dies. Moreover, the semiconductor package further includes redistribution lines electrically connecting the third semiconductor die to the second bridge die.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: April 27, 2021
    Assignee: SK hynix Inc.
    Inventors: Jong Hoon Kim, Ki Bum Kim, Bok Kyu Choi
  • Patent number: 10990658
    Abstract: A user verification apparatus may perform user verification using multiple biometric verifiers. The user verification apparatus may set a termination stage of one or more biometric verifiers. Multiple biometric verifiers may be used to generate outputs, for which separate termination stages are set to establish a particular combination of set termination stages associated with the multiple biometric verifiers, and the user verification apparatus may fuse outputs of the biometric verifiers based on the particular combination of set termination stages. The user verification apparatus may verify a user based on a result of the fusing, and an unlocking command signal may be generated based on the verifying. The unlocking command signal may be generated to selectively grant access, to the verified user, to one or more elements of a device. The device may be a vehicle.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: April 27, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungjoo Suh, Seungju Han, Jae-Joon Han, Chang Kyu Choi
  • Publication number: 20210117657
    Abstract: A facial verification method includes separating a query face image into color channel images of different color channels, obtaining a multi-color channel target face image with a reduced shading of the query face image based on a smoothed image and a gradient image of each of the color channel images, extracting a face feature from the multi-color channel target face image, and determining whether face verification is successful based on the extracted face feature.
    Type: Application
    Filed: December 24, 2020
    Publication date: April 22, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Minsu KO, SeungJu HAN, JaeJoon HAN, Chang Kyu CHOI
  • Patent number: 10973620
    Abstract: In a biomimetic artificial muscle module, a biomimetic artificial muscle assembly having the biomimetic artificial muscle module, and a method of controlling the biomimetic artificial muscle module, the biomimetic artificial muscle module includes an operating part, an elastic part, a driving part, a locking part and first and second sensors. The operating part contracts or relaxes along a longitudinal direction. The elastic part is connected to a first end of the operating part, and behaves elastically behave according to an external force. The driving part is connected to a second end of the operating part, and drives the operating part to be contracted or relaxed. The locking part selectively blocks a length of the operating part from being changed. The first and second sensors respectively sense the elastic part and the operating part.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: April 13, 2021
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Sang-Kyu Choi, Hyun Joon Kwon, Jae Keun Shim, Young-Su Son, Cheol-hoon Park, Seyoung Kim
  • Publication number: 20210097380
    Abstract: The present invention relates to a single transistor implementing a neuromorphic system capable of performing neuron and synaptic operations through the single transistor including a floating body layer and a charge storage layer and being implemented by a neuron device and a synaptic device which are co-integrated on the same plane, and the neuromorphic system using the same, and forms the single transistor including a hole barrier material layer formed on a substrate and including a hole barrier material or an electron barrier material, the floating body layer formed on the hole barrier material layer, a source and a drain formed on opposite sides of the floating body layer, a gate insulating layer formed on the floating body layer and including an oxide layer and the charge storage layer, and a gate formed on the gate insulating layer.
    Type: Application
    Filed: September 29, 2020
    Publication date: April 1, 2021
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Yang-Kyu CHOI, Joon-Kyu HAN, Gyeong Jun YUN
  • Patent number: 10963676
    Abstract: An image processing apparatus, includes an image classifier configured to determine whether an input image is a low-quality image or a high-quality image; and an image evaluator configured to determine a first predetermined number of clearest images from a plurality of low-quality images determined by the image classifier.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: March 30, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Biao Wang, Bing Yu, Chang Kyu Choi, Deheng Qian, Jae-Joon Han, Jingtao Xu, Yaozu An
  • Publication number: 20210089760
    Abstract: A processor implemented method of processing a facial expression image, the method includes controlling a camera to capture a first facial expression image and a second facial expression image, acquiring a first expression feature of the first facial expression image, acquiring a second expression feature of the second facial expression image, generating a new expression feature dependent on differences between the acquired first expression feature and the acquired second expression feature, and adjusting a target facial expression image based on the new expression feature.
    Type: Application
    Filed: December 2, 2020
    Publication date: March 25, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tianchu GUO, Youngsung KIM, Hui ZHANG, Byungin YOO, Chang Kyu CHOI, Jae-Joon HAN, Jingtao XU, Deheng QIAN
  • Publication number: 20210089754
    Abstract: Disclosed is a face verification method and apparatus. The method including analyzing a current frame of a verification image, determining a current frame state score of the verification image indicating whether the current frame is in a state predetermined as being appropriate for verification, determining whether the current frame state score satisfies a predetermined validity condition, and selectively, based on a result of the determining of whether the current frame state score satisfies the predetermined validity condition, extracting a feature from the current frame and performing verification by comparing a determined similarity between the extracted feature and a registered feature to a set verification threshold.
    Type: Application
    Filed: December 4, 2020
    Publication date: March 25, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Changyong SON, Wonsuk CHANG, Deoksang KIM, Dae-Kyu SHIN, Byungin YOO, Seungju HAN, Jaejoon HAN, Jinwoo SON, Chang Kyu CHOI
  • Publication number: 20210089755
    Abstract: Disclosed is a face verification method and apparatus. The method including analyzing a current frame of a verification image, determining a current frame state score of the verification image indicating whether the current frame is in a state predetermined as being appropriate for verification, determining whether the current frame state score satisfies a predetermined validity condition, and selectively, based on a result of the determining of whether the current frame state score satisfies the predetermined validity condition, extracting a feature from the current frame and performing verification by comparing a determined similarity between the extracted feature and a registered feature to a set verification threshold.
    Type: Application
    Filed: December 4, 2020
    Publication date: March 25, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Changyong SON, Wonsuk CHANG, Deoksang KIM, Dae-Kyu SHIN, Byungin YOO, Seungju HAN, Jaejoon HAN, Jinwoo SON, Chang Kyu CHOI
  • Publication number: 20210086114
    Abstract: A strainer for a fuel pump according to the present invention includes: a communicating pipe including a flow path formed to communicate with a fuel inlet of the fuel pump; a filter including an internal space in which a fuel flows and coupled to the communicating pipe so that the internal space communicates with the communicating pipe; and a rib disposed in the filter and coupled to the communicating pipe, in which the filter includes a first filtering portion extending in a length direction with respect to the communicating pipe, a connecting portion extending in a width direction at an edge of the first filtering portion, and a second filtering portion extending in the length direction at the connecting portion and spaced apart from the first filtering portion in the width direction. Therefore, the strainer may have a relatively large filtering area and a small size.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 25, 2021
    Inventors: Joon Seup KIM, Yong Hwan CHOI, Ku Sung KWON, Jong Hyuk YOON, Jin Kyu CHOI, Jeong Sik KIM, Dong Heon MO
  • Patent number: 10956622
    Abstract: The present invention provides a thermal hardware-based data security device that is capable of physically, hardware-wise, and permanently erasing data stored in a memory and of enabling a storage device to be reused, and a method thereof. The thermal hardware-based data security device includes: a memory chip capable of storing data; a heater module which supplies heat to permanently erase the data stored in a memory cell within the memory chip; and a switch module which short-circuits the heater module between a power supply unit and a ground when switched on, and thus, controls the heater module to be operated.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: March 23, 2021
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yang-Kyu Choi, Jun-Young Park
  • Patent number: 10957627
    Abstract: A semiconductor package includes a semiconductor die and a bridge die. The bridge die is configured to include a through via formed in a body of the bridge die and a capacitor electrically coupled to the through via.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: March 23, 2021
    Assignee: SK hynix Inc.
    Inventor: Bok Kyu Choi
  • Publication number: 20210082479
    Abstract: A method of operating memory devices disposed in different ranks of a multi-rank memory device and sharing a signal line includes receiving, in all of the memory devices included in the multi-rank memory device, on-die termination (ODT) state information of the signal line. The method further includes storing, in each of the memory devices of the multi-rank memory device, the ODT state information of the signal line in a mode register. The method further includes generating, in each of the memory devices of the multi-rank memory device, a control signal based on the ODT state information of the signal line stored in the mode register. The method further includes changing, in each of the memory devices of the multi-rank memory device, an ODT setting of the signal line in response to the control signal.
    Type: Application
    Filed: November 25, 2020
    Publication date: March 18, 2021
    Inventors: DAE-SIK MOON, KYUNG-SOO HA, YOUNG-SOO SOHN, KI-SEOK OH, CHANG-KYO LEE, JIN-HOON JANG, YEON-KYU CHOI, SEOK-HUN HYUN
  • Patent number: 10952169
    Abstract: The present invention relates to a 5th-generation (5G) or pre-5G communication system to be provided in order to support a higher data transmission rate than a beyond 4th-generation (4G) communication system such as long term evolution (LTE). The present invention relates to a signal transmission method of a radio frequency (RF) processing device, the method comprising the steps of: generating a pulse signal including a control signal and a clock signal for obtaining synchronization with another RF processing device, which is connected through an interface; and transmitting, to the another RF processing device, at least one from among the pulse signal, a RF signal for communication with a base station, and a power signal for supplying power to the another RF processing device, wherein the clock signal and the control signal are assigned to different time units, and the pulse signal, the RF signal and the power signal are signals of different frequency bands.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: March 16, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dae-Young Lee, Chul-Woo Byeon, Ju-Ho Son, Jeong-Ho Lee, Sun-Kyu Choi, Sung-Tae Choi
  • Publication number: 20210074679
    Abstract: A semiconductor package may include: a first chip stack including a plurality of first semiconductor chips stacked in a vertical direction; and first vertical interconnectors electrically coupled to the plurality of first semiconductor chips, respectively, and extended in the vertical direction, wherein each of the other first semiconductor chips, except at least the uppermost first semiconductor chip from among the plurality of first semiconductor chips includes: an active surface defined by two side surfaces of the first semiconductor chip in a first direction and two side surfaces of the first semiconductor chip in a second direction crossing the first direction; a first one-side chip pad disposed at an edge of the active surface, which is close to one side surface in the first direction; a first other-side chip pad disposed at an edge of the active surface, which is close to an other side surface in the first direction; and a first redistribution pad electrically coupled to the first other-side chip pad,
    Type: Application
    Filed: May 5, 2020
    Publication date: March 11, 2021
    Applicant: SK hynix Inc.
    Inventors: Chae-Sung LEE, Bok-Kyu CHOI
  • Publication number: 20210056332
    Abstract: An object recognition apparatus and method are provided. The apparatus includes a processor configured to verify a target image using an object model and based on reference intermediate data extracted by a partial layer of the object model as used in an object recognition of an input image, in response to a failure of a verification of the input image after a success of the object recognition of the input image, and perform an additional verification of the target image in response to the target image being verified in the verifying of the target image.
    Type: Application
    Filed: November 5, 2020
    Publication date: February 25, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: SeungJu HAN, SungUn PARK, JaeJoon HAN, Jinwoo SON, ChangYong SON, Minsu KO, Jihye KIM, Chang Kyu CHOI
  • Patent number: 10926332
    Abstract: A method of manufacturing iron powder configured for improving a recovery rate of chromium using ingot including chromium in a content suitably higher than a target content at the time of manufacturing iron powder including chromium, may include preparing ingot further including chromium (Cr) so that a content of chromium (Cr) in the ingot is 1 to 30% higher than a target content of chromium (Cr) in finally produced iron powder; dissolving the ingot to prepare molten steel; forming iron powder by performing water atomization on the molten steel; and adjusting a content of carbon (C) in the iron powder by performing reduction treatment on the iron powder.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: February 23, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Joon Chul Yun, Hyun Gon Lyu, Hyun Kyu Choi, Ji Min Yu