Abstract: The present disclosure relates to a novel anti-HER2 antibody or an antigen-binding fragment thereof used in the prevention or treatment of cancer, a chimeric antigen receptor including the same, and uses thereof. The antibody of the present disclosure is an antibody that specifically binds to HER2 which is highly expressed in cancer cells (particularly, breast cancer or gastric cancer cells), and binds to an epitope that is different from an epitope to which trastuzumab binds.

Abstract: A lighting device includes a light guide plate configured to guide and diffuse a light from a light source, and a garnish body including a lighting area to which the diffused light is radiated, wherein the light guide plate is disposed at a predetermined angle with respect to the garnish body.

Abstract: Disclosed is a cleaning robot including: a driving unit configured to move the cleaning robot; an obstacle sensor configured to sense an obstacle; and a controller configured to reduce, if a distance between the cleaning robot and the obstacle is shorter than or equal to a reference distance, a driving speed of the cleaning robot so that the driving speed of the cleaning robot is lower than a shock absorbing speed when the cleaning robot contacts the obstacle.

Abstract: A dishwasher includes a main body, a tub provided in the inside of the main body, a basket provided in the inside of the tub to store dishes, an injection unit configured to spray wash water to wash dishes in the basket, and a circulation pump configured to circulate wash water, a sump arranged on a lower surface of the tub, and a connector provided to connect the circulation pump to the injection unit and having a tubular shape. The sump includes a coupling portion extending upward from the lower surface of the tub, and the connector and the injection unit are connected to each other in the inside of the tub by being coupled to the coupling portion.

Abstract: Disclosed is a robot cleaner which adjusts a suction area of air suctioned into a suction port through a shutter and a shutter driving device configured to operate the shutter, so that a flow rate of air is adjusted, thus more effectively suctioning dust in the air by using a fan motor having a fixed capacity.

Abstract: A method for wafer planarization includes forming a second insulating layer and a polishing layer on a substrate having a chip region and a scribe lane region; forming a first through-hole in the polishing layer in the chip region and the scribe lane region and a second through-hole in the second insulating layer in the chip region, wherein the second through-hole and the first through-hole meet in the chip region; forming a pad metal layer inside the first through-hole and the second through-hole and on an upper surface of the polishing layer; and polishing the polishing layer and the pad metal layer by a chemical mechanical polishing (CMP) process to expose an upper surface of the second insulating layer in the chip region and the scribe lane region.

Abstract: Disclosed is a cleaning robot including: a driving unit configured to move the cleaning robot; an obstacle sensor configured to sense an obstacle; and a controller configured to reduce, if a distance between the cleaning robot and the obstacle is shorter than or equal to a reference distance, a driving speed of the cleaning robot so that the driving speed of the cleaning robot is lower than a shock absorbing speed when the cleaning robot contacts the obstacle.

Abstract: A dishwasher includes a main body, a tub provided in the inside of the main body, a basket provided in the inside of the tub to store dishes, an injection unit configured to spray wash water to wash dishes in the basket, and a circulation pump configured to circulate wash water, a sump arranged on a lower surface of the tub, and a connector provided to connect the circulation pump to the injection unit and having a tubular shape. The sump includes a coupling portion extending upward from the lower surface of the tub, and the connector and the injection unit are connected to each other in the inside of the tub by being coupled to the coupling portion.

Abstract: A method for wafer planarization includes forming a second insulating layer and a polishing layer on a substrate having a chip region and a scribe lane region; forming a first through-hole in the polishing layer in the chip region and the scribe lane region and a second through-hole in the second insulating layer in the chip region, wherein the second through-hole and the first through-hole meet in the chip region; forming a pad metal layer inside the first through-hole and the second through-hole and on an upper surface of the polishing layer; and polishing the polishing layer and the pad metal layer by a chemical mechanical polishing (CMP) process to expose an upper surface of the second insulating layer in the chip region and the scribe lane region

Abstract: A wheel for a robot cleaner includes an outer ring in contact with a surface to be cleaned, an inner ring which is disposed inside the outer ring and receives a driving force, a plurality of spokes which connect the outer ring and the inner ring, and form a plurality of independent spaces through which air passes, and a plurality of ribs disposed in the plurality of independent spaces, each of the plurality of ribs having a shorter length than a length of each of the plurality of spokes.

Abstract: Disclosed is a cleaning robot including: a driving unit configured to move the cleaning robot; an obstacle sensor configured to sense an obstacle; and a controller configured to reduce, if a distance between the cleaning robot and the obstacle is shorter than or equal to a reference distance, a driving speed of the cleaning robot so that the driving speed of the cleaning robot is lower than a shock absorbing speed when the cleaning robot contacts the obstacle.

Abstract: Disclosed is a robot cleaner which adjusts a suction area of air suctioned into a suction port through a shutter and a shutter driving device configured to operate the shutter, so that a flow rate of air is adjusted, thus more effectively suctioning dust in the air by using a fan motor having a fixed capacity.

Abstract: Disclosed herein are a cleaning robot in which light emitting portions emitting infrared rays are installed to face forward, sideward, and upward and infrared rays which are reflected by obstacles and return are received by one light receiving module to sense obstacles to prevent an increase in manufacturing cost caused by installing a plurality of light receiving portions and simultaneously to sense obstacles located above and a method of controlling the cleaning robot. The cleaning robot including a body and a driving portion which moves the body includes at least one light emitting portion which emits light to an obstacle, a light receiving module which obtains an image signal of the obstacle by receiving the light reflected by the obstacle, and a control portion which generates obstacle sensing information based on a position of the image signal obtained by the light receiving module and controls the driving portion based on the generated obstacle sensing information.

Abstract: An automatic multi-lingual editing method for cartoon content includes: extracting, from a subtitle table, subtitle data, the number of limiting lines, and a horizontal width to be displayed in a text balloon of a current order; calculating the number of letters to be inserted into one line by using a current font size and a value of the extracted horizontal width; allocating, to a remaining subtitle variable, a text corresponding to the subtitle, and allocating zero to a variable of the number of current lines; and removing, from the remaining subtitle variable, text, which is as much as the number of letters to be inserted into one line, and updating the number of current lines by adding 1 thereto; and processing the display of the extracted subtitle in a corresponding text balloon if the number of current lines is equal to or less than the number of limiting lines.

Abstract: A ceramic electronic component includes a ceramic body; internal electrodes disposed in the ceramic body; external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes; and tin plating layers disposed on the external electrodes.

Abstract: A first insulating layer is formed on a substrate. An opening is formed in the first insulating layer. A barrier layer is formed on the first insulating layer and conforming to sidewalls of the first insulating layer in the opening, and a conductive layer is formed on the barrier layer. Chemical mechanical polishing is performed to expose the first insulating layer and leave a barrier layer pattern in the opening and a conductive layer pattern on the barrier layer pattern in the opening, wherein a portion of the conductive layer pattern protrudes above an upper surface of the insulating layer and an upper surface of the barrier layer pattern. A second insulating layer is formed on the first insulating layer, the barrier layer pattern and the conductive layer pattern and planarized to expose the conductive layer pattern. A second substrate may be bonded to the exposed conductive layer pattern.

Abstract: An electronic device includes an upper insulating layer on a substrate. An upper redistribution structure is embedded in the upper insulating layer. The upper redistribution structure includes an upper contact portion, an upper pad portion, and an upper line portion between the upper contact portion and the upper pad portion. A passivation layer is on the upper insulating layer and the upper redistribution structure. An upper opening is configured to pass through the passivation layer and expose the upper pad portion. Vertical thicknesses of the upper pad portion and the upper contact portion are greater than a vertical thickness of the upper line portion.

Abstract: A method of fabricating a semiconductor device is provided. The method may include preparing a substrate having a first surface and a second surface, forming a via hole exposing at least a portion of the substrate from the first surface of the substrate, forming a first insulating film on an inner wall of the via hole, forming a conductive connection part filling an inside of the via hole including the first insulating film, polishing the second surface of the substrate until the conductive connection part is exposed, and selectively forming a second insulating film on the second surface of the substrate using an electrografting method to expose the conductive connection part.

Abstract: A wheel for a robot cleaner includes an outer ring in contact with a surface to be cleaned, an inner ring which is disposed inside the outer ring and receives a driving force, a plurality of spokes which connect the outer ring and the inner ring, and form a plurality of independent spaces through which air passes, and a plurality of ribs disposed in the plurality of independent spaces, each of the plurality of ribs having a shorter length than a length of each of the plurality of spokes.

Abstract: A semiconductor device includes a substrate having a die region and a scribe region surrounding the die region, a plurality of via structures penetrating through the substrate in the die region, a portion of the via structure being exposed over a surface of the substrate, and a protection layer pattern structure provided on the surface of the substrate surrounding a sidewall of the exposed portion of the via structure and having a protruding portion covering at least a portion of the scribe region adjacent to the via structure.