Abstract: The present specification relates to a method comprising: (A) mixing a ferrite-based catalyst molded article with diluent material particles; and (B) adding the mixture to a catalyst reactor, and a method for preparing butadiene using the same.

Abstract: Provided is a robot control method that controls a robot to guide an evacuation route in response to occurrence of an emergency situation. The robot may acquire evacuation route information on a space from a server when an emergency situation occurs in the space, and may move to a first node closest to the robot among nodes defined in the space and a second node indicated by direction information of the first node based on the evacuation route information and a current location of the robot.

Abstract: Proposed is a pressurizing and sealing device for an all-solid-state secondary battery. More particularly, proposed is a pressurizing and sealing device for an all-solid-state secondary battery, in which a side of the pressurizing and sealing device is vacuum-adsorbed to seal an all-solid-state secondary battery while forming an internal space that transmits a pressurizing force to the all-solid-state battery, thereby enabling the all-solid-state battery to be pressurized under isotropic pressure conditions during a high-temperature pressurization process for the second battery.

Abstract: Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.

Abstract: Example methods and apparatus for embedding interconnect bridges having through silicon vias in substrates are disclosed. An example semiconductor package a bridge die disposed in a recess of an underlying substrate, the bridge die including a via that electrically couples a first contact on a first side of the bridge die and a second contact on a second side of the bridge die, the recess extending to a first surface of the underlying substrate; a bond material to electrically and mechanically couple the first contact and an interconnect of the underlying substrate; and a fill material positioned between the first side of the bridge die and the first surface of the underlying substrate.

Abstract: Embodiments disclosed herein include apparatuses with assemblies comprising passive electrical devices that are embedded in a core of a package substrate. In an embodiment, such an apparatus may comprise a substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface coupling the first surface to the second surface. In an embodiment the substrate comprises a passive electrical device. In an embodiment, a pad is on the first surface of the substrate, and a layer contacts the substrate. In an embodiment, the layer directly contacts the first surface and the sidewall surface of the substrate.

Abstract: Embodiments disclosed herein include components that are embedded in the core of a package substrate. In an embodiment, such an apparatus comprises a substrate with a cavity through a thickness of the substrate. In an embodiment, a component is in the cavity, and a first layer is in the cavity. In an embodiment the first layer is a dielectric material. In an embodiment, a second layer is in the cavity, and the second layer is a dielectric material that is a different material than the second layer.

Abstract: In embodiments herein, a circuit component (e.g., a deep trench capacitor) is embedded within a core layer of a substrate. The circuit component may be encapsulated by multiple (e.g., two) layers of dielectrics or by a polymer material.

Abstract: Embodiments disclosed herein include an apparatus that comprises a first substrate and a second substrate over the first substrate. In an embodiment, an array of interconnects is provided between the first substrate and the second substrate. The array of interconnects comprises a first interconnect with a first material composition, and a second interconnect with a second material composition that is different than the first material composition.

Abstract: Technologies for components embedded in a substrate core are disclosed. In one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. The power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. Configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.

Abstract: Methods and devices to support multiple frequency bands in radio frequency (RF) circuits are shown. The described methods and devices are based on adjusting the effective width of a transistor in such circuits by selectively disposing matching transistors in parallel with the transistor. The presented devices and methods can be used in RF circuits including low noise amplifiers (LNAs), RF receiver front-ends or any other RF circuits where input matching to wideband inputs is required.

Abstract: Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes bumps to electrically couple the die to the substrate. Ones of the bumps have corresponding bases. The bases have a shape that is non-circular.

Abstract: An inhaler according to one embodiment may comprise: a housing having one surface, the other surface opposite the one surface, and a plurality of side surfaces connecting the one surface and the other surface; a reservoir located inside the housing and storing an inhalable composition; a canister accommodating an inhalable composition to be stored in the reservoir and openably/closably connected to the reservoir; a relief valve spaced apart from the canister and installed to open and close the reservoir with respect to the outside; and a lever that controls the opening/closing operation of at least one of the canister or the relief valve, wherein the lever can control the canister to be opened after the relief valve is opened.

Abstract: Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes an array of bumps to electrically couple the die to the substrate. Each of the bumps have a corresponding base. Different ones of the bases have different widths that vary spatially across the array of bumps.

Abstract: A ternary logic element including a transistor and a switching element. The transistor includes a channel layer including silicon, an input electrode, an output electrode, and a control electrode. The switching element includes an emitter, a base extending from the emitter, and a collector extending from the base. When a first control voltage is applied to the control electrode, the ternary logic element outputs a first voltage, and when a second control voltage different from the first control voltage is applied to the control electrode, the ternary logic element outputs a second voltage different from the first voltage, and when a third control voltage different from the first control voltage and the second control voltage is applied to the control electrode, the ternary logic element outputs a third voltage different from the first voltage and the second voltage.

Abstract: Provided is a robot control method that controls a robot to guide an evacuation route in response to occurrence of an emergency situation. The robot may acquire evacuation route information on a space from a server when an emergency situation occurs in the space, and may move to a first node closest to the robot among nodes defined in the space and a second node indicated by direction information of the first node based on the evacuation route information and a current location of the robot.

Abstract: Various aspects may provide a molding system. The molding system may include a molding unit which includes a first mold panel and a second mold panel. The first mold panel and the second mold panel may include a mold cavity which surrounds a semiconductor workpiece along a side surface of the semiconductor workpiece, with the first mold panel and the second mold panel engaged with the semiconductor workpiece. Various aspects may also provide a molding method which utilize the molding system.

Abstract: An inhaler according to an embodiment comprises: a housing provided with one surface, the opposite surface facing the one surface, and a plurality of side surfaces connecting the one surface and the opposite surface; a canister that is mounted inside the housing so as to be replaceable and accommodates an inhalable composition; a reservoir that is connected to the canister and stores the inhalable composition supplied from the canister; a relief valve that is installed in the reservoir and operates to open and close off the reservoir with respect to the outside; and a cover, one side of which is rotatably coupled to the housing and the other side of which is detachably coupled to a location corresponding to the bottom surface of the canister. The cover can be opened to remove the canister from the housing after opening the relief valve.

Abstract: An inhaler according to an embodiment comprises: a housing provided with one surface, the other surface facing the surface, and a plurality of side surfaces connecting one surface to the other surface; a mouthpiece arranged on one surface of the housing; a storage which is in communication with the mouthpiece and stores an inhalable composition; and a canister which accommodates the inhalable composition which is to be stored in the storage and is connected to the storage to be opened/closed, wherein the canister can be coupled to the storage to be attachable/detachable in the housing.

Abstract: An inhaler according to an embodiment comprises: a housing provided with one surface, the other surface facing the surface, and a plurality of side surfaces connecting one surface to the other surface; a canister which is attached in the housing to be replaceable and accommodates an inhalable composition; a storage to which the canister is connected to be opened/closed and which stores the inhalable composition; a lever which controls the opening/closing operations of the canister; and a counter arranged between the canister and the lever to be rotatable, wherein the counter is rotated by a certain angle according to the operation of the lever so as to provide notification of the remaining amount of the inhalable composition in the canister.