Abstract: Surface finishes for contacts and fiducial marks on integrated circuit package substrates and associated methods are disclosed. An example integrated circuit (IC) package substrate includes a first solder resist layer; a second solder resist layer opposite the first solder resist layer; and a fiducial marker including tin in an opening in the first solder resist layer.

Abstract: An inhaler includes a housing having one surface, the other surface opposite to the one surface, and a plurality of side surfaces connecting the one surface and the other surface, a mouthpiece which is disposed on the one side of the housing, a reservoir which is disposed inside the housing and stores an inhalable composition, a nozzle which extends from the mouthpiece to the reservoir, and a needle valve which is movably disposed inside the nozzle, when a suction force is not applied to the mouthpiece, the needle valve is maintained in a first state in which the nozzle is closed, and when a suction force is applied through the mouthpiece, the needle valve is switched into a second state in which the nozzle is opened.

Abstract: Disclosed herein is a method for providing a parking lot guidance service of a server. The method includes: receiving parking lot data including information of a parking space in a parking lot from an image capturing apparatus for a vehicle provided in the vehicle; generating a parking lot model representing a real-time parking situation of the parking lot as an image based on the received parking lot data; and providing the parking guidance service to a user terminal apparatus using the generated parking lot model.

Abstract: A composite including a crystalline hybrid nanoporous powder, that can have excellent thermal stability and structural stability with respect to pressure because of the coated structural properties of an organometallic nanostructure on the surface of the seed particle, can maintain the conventional properties during converting from the crystalline hybrid material nanoporous powder into the composite because of the bonding force of the seed particle and the organometal nanostructure, and can reduce the production amount of a fine powder due to abrasion without a deterioration in the ability to adsorb volatile organic compounds (VOC), and a method for producing same.

Abstract: Methods and apparatus to mitigate electromigration are disclosed. A disclosed example integrated circuit (IC) package includes a dielectric substrate, a contact pad at least partially extending though or positioned on the dielectric substrate, the contact pad including copper, and a metal interconnect coupled to the contact pad, the interconnect including indium.

Abstract: A method for measuring an inter-vehicle distance includes acquiring driving image photographed by a photographing device of a first vehicle which is being driven; detecting a second vehicle from the acquired driving image; detecting first feature points of a second vehicle region in a first frame corresponding to a frame in which the second frame is detected before a frame in which the second vehicle is not detected among a plurality of frames constituting the driving image, when the second vehicle is not detected from the driving image; detecting second feature points in a second frame corresponding to a current frame by tracking the detected first feature points; calculating a feature point change value between the first feature points and the second feature points; and calculating an inter-vehicle distance from the photographing device of the first vehicle to the second vehicle based on the calculated feature point change value.

Abstract: Provided is a display device, comprising a display panel which comprises a first area and a second area located around the first area; and an under-panel sheet which is located under the display panel and overlaps the first area and the second area, wherein the under-panel sheet comprises a buffer member and a strength reinforcing member, wherein the strength reinforcing member is thinner than the buffer member, and a ratio of a thickness of the buffer member to a thickness of the strength reinforcing member is 3 to 6 times.

Abstract: Microelectronic devices, systems, and techniques are disclosed having package substrate land side fiducial structures that are readily distinguishable from adjacent interconnect structures during registration of the land side of the package substrate. The fiducial structure includes a ring shape, a double ring shape, a donut shape, a triangular shape, an H-shape, or an I-shape in contrast to the circular, square, or rectangular shape of the adjacent interconnect structure. The fiducial structure shape may also have a different size relative to the interconnect structure shape.

Abstract: A method for controlling autonomous lane change of a vehicle is disclosed. The method comprising: receiving a destination from a user; determining a current position of the vehicle; calculating a driving route from the current position to the destination; when an intersection exists within in a predetermined distance on the driving route while performing the route guidance according to the calculated driving route, confirming a ranking of a search link positioned on the calculated driving route among search links exiting from an end node corresponding to the intersection; comparing rotation direction information of the search link corresponding to the confirmed ranking of the search link with moving direction information of a lane of a lane link corresponding to the lane on which the vehicle is currently positioned; and performing lane change guidance of the vehicle according to a comparison result of the rotation direction information and the moving direction information.

Abstract: A method and a system for establishing a route of an unmanned aerial vehicle are provided. The method includes identifying an object from surface scanning data and shaping a space, which facilitates autonomous flight, as a layer, collecting surface image data for a flight path from the shaped layer, and analyzing a change in image resolution according to a distance from the object through the collected surface image data and extracting an altitude value on a flight route.

Abstract: The present invention relates to a non-coating thermoplastic resin composition, a method for manufacturing a molded article by using the same, and a molded article manufactured by the same. More specifically, the present invention is characterized by providing the thermoplastic resin composition which contains polycarbonate, polysiloxane-polycarbonate copolymer, polyester, master-batched carbon black, and additives in specific contents and the molded article, which has excellent chemical resistance, mechanical properties, light resistance, hydrolysis resistance, and low glossiness, manufactured by using the same.

Abstract: Methods and devices to support multiple frequency bands in radio frequency (RF) circuits are shown. The described methods and devices are based on adjusting the effective width of a transistor in such circuits by selectively disposing matching transistors in parallel with the transistor. The presented devices and methods can be used in RF circuits including low noise amplifiers (LNAs), RF receiver front-ends or any other RF circuits where input matching to wideband inputs is required.

Abstract: Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes directed to manufacturing a package having a substrate with a first side and a second side opposite the first side, where a copper layer is coupled with a first region of the first side of the substrate and includes a plurality of bumps coupled with the first region of the first side of the substrate where one or more second regions on the first side of the substrate not coupled with a copper layer, and where a layout of the one or more second regions on the first side of the substrate is to vary a growth, respectively, of each of the plurality of bumps during a plating process by modifying a local copper density of each of the plurality of bumps.

Abstract: Methods and devices for limiting the power level of low noise amplifiers (LNA) implemented in radio frequency (RF) receiver front-ends. The described methods are applicable to bypass, low and high gain modes of the LNA. According to the described methods, the decoder allows the signal to be clamped before or after being attenuated. The benefit of such methods is to improve large signal performances (e.g. IIP3, P1dB) of the RF receiver front-end, while still meeting the clamping requirements, or improve (lower) clamped output power, while still meeting large signal performances (e.g. IIP3, P1dB).

Abstract: A ternary logic element including a transistor and a switching element. The transistor includes a channel layer including silicon, an input electrode, an output electrode, and a control electrode. The switching element includes an emitter, a base extending from the emitter, and a collector extending from the base. When a first control voltage is applied to the control electrode, the ternary logic element outputs a first voltage, and when a second control voltage different from the first control voltage is applied to the control electrode, the ternary logic element outputs a second voltage different from the first voltage, and when a third control voltage different from the first control voltage and the second control voltage is applied to the control electrode, the ternary logic element outputs a third voltage different from the first voltage and the second voltage.

Abstract: Disclosed herein is a method for providing a parking lot guidance service of a server. The method includes: receiving parking lot data including information of a parking space in a parking lot from an image capturing apparatus for a vehicle provided in the vehicle; generating a parking lot model representing a real-time parking situation of the parking lot as an image based on the received parking lot data; and providing the parking guidance service to a user terminal apparatus using the generated parking lot model.

Abstract: A method for measuring an inter-vehicle distance includes acquiring a driving image photographed by a photographing device of a first vehicle which is being driven; detecting a second vehicle from the acquired driving image; detecting first feature points of a second vehicle region in a first frame corresponding to a frame in which the second frame is detected before a frame in which the second vehicle is not detected among a plurality of frames constituting the driving image, when the second vehicle is not detected from the driving image; detecting second feature points in a second frame corresponding to a current frame by tracking the detected first feature points; calculating a feature point change value between the first feature points and the second feature points; and calculating an inter-vehicle distance from the photographing device of the first vehicle to the second vehicle based on the calculated feature point change value.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate with a die coupled to the package substrate by a plurality of interconnects. In an embodiment, a first layer is on the package substrate surrounding the die, and a second layer is over and around the die. In an embodiment, the second layer underfills the plurality of interconnects, and the second layer has a different material composition than the first layer.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes vertical connections with a layer including tin between the vertical connections and conductive traces. In selected examples, a layer including tin is used in conjunction with other interface layers. In selected examples, a layer including tin is used in all vertical connections.

Abstract: An electronic package comprises a first die having at least one first interconnect with solder over or under a first metal feature. A second die has at least one second interconnect to the first die, each second interconnect comprising a second metal feature comprising copper, solder over or under the second metal feature, and a layer between the solder and the second metal feature, wherein the layer comprises iron and has a different material than material of the first interconnect.