Patents by Inventor Kyu Han

Kyu Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230101629
    Abstract: Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Jung Kyu Han, Xiaoying Guo, Jeremy D. Ecton, Santosh Tripathi, Bai Nie, Haobo Chen, Kyle Jordan Arrington, Yue Deng, Wei Wei
  • Publication number: 20230095281
    Abstract: Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes bumps to electrically couple the die to the substrate. Ones of the bumps have corresponding bases. The bases have a shape that is non-circular.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han, Changhua Liu, Leonel Arana, Rahul Manepalli, Dingying Xu, Amram Eitan
  • Publication number: 20230086920
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques for a dam structure on a substrate that is proximate to a die coupled with the substrate, where the dam decreases the risk of die shift during encapsulation material flow over the die during the manufacturing process. The dam structure may fully encircle the die. During encapsulation material flow, the dam structure creates a cavity that moderates the different flow rates of material that otherwise would exert different pressures the sides of the die and cause to die to shift its position on the substrate. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 21, 2021
    Publication date: March 23, 2023
    Inventors: Liang HE, Jisu JIANG, Jung Kyu HAN, Gang DUAN, Yosuke KANAOKA, Jason M. GAMBA, Bai NIE, Robert Alan MAY, Kimberly A. DEVINE, Mitchell ARMSTRONG, Yue DENG
  • Publication number: 20230085698
    Abstract: Capacitor pads and methods of manufacturing the same are disclosed herein. An example apparatus disclosed herein includes a substrate to support a die, and a die-side capacitor pad on the substrate, the die-side capacitor pad including a plurality of distinct pad portions, the distinct pad portions spaced apart from one another.
    Type: Application
    Filed: September 21, 2021
    Publication date: March 23, 2023
    Inventors: Kristof Darmawikarta, Jung Kyu Han, Srinivas Pietambaram, Rajeev Ranjan
  • Publication number: 20230088928
    Abstract: Embedded glass cores in package substrates and related methods are disclosed herein including an integrated circuit including a substrate having a first side and a second side opposite the first side, a plurality of vias disposed within the substrate to electrically couple corresponding contacts on the first and second sides of the substrate, a glass core surrounding a first via of the plurality of vias, and an organic core surrounding a second via of the plurality of vias, the second via different than the first via.
    Type: Application
    Filed: September 23, 2021
    Publication date: March 23, 2023
    Inventors: Jung Kyu Han, Jiwei Sun, Zhiguo Qian, Srinivas Pietambaram
  • Publication number: 20230091379
    Abstract: Embodiments disclosed herein include electronic packages with first level interconnects that comprise a first layer. In an embodiment, the electronic package comprises a package substrate and a pad on the package substrate. In an embodiment, the pad comprises copper. In an embodiment, a first layer is over the pad. In an embodiment, the first layer comprises iron. In an embodiment, a solder is over the first layer, and a die is coupled to the package substrate by the solder.
    Type: Application
    Filed: September 22, 2021
    Publication date: March 23, 2023
    Inventors: Liang HE, Yeasir ARAFAT, Jung Kyu HAN, Ali LEHAF, Gang DUAN, Steve S. CHO, Yue DENG
  • Patent number: 11609101
    Abstract: Provided is an image processing method. The image processing method includes receiving images acquired from a plurality of vehicles positioned on a road; storing the received images according to acquisition information of the received images; determining a reference image and a target image based on images having the same acquisition information among the stored images; performing an image registration using a plurality of feature points extracted from each of the determined reference image and target image; performing a transparency process for each of the reference image and the target image which are image-registered; extracting static objects from the transparency-processed image; and comparing the extracted static objects with objects on map data which is previously stored and updating the map data when the objects on the map data which is previously stored and the extracted static objects are different from each other.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: March 21, 2023
    Assignee: THINKWARE CORPORATION
    Inventors: Ki Wook Lee, Hye Kyung Byun, Tae Kyu Han, Shin Hyoung Kim
  • Publication number: 20230051032
    Abstract: Provided herein are a sidestream smoke removal device and a control method thereof. The sidestream smoke removal device according to some embodiments of the present disclosure includes a housing in which a smoking space is formed, an article insertion portion which is disposed at one end of the housing and forms an opening for insertion of a smoking article into the smoking space, an elastic support portion which is configured to support the smoking article inserted through the article insertion portion, an ignition portion which is configured to ignite the smoking article inserted into the smoking space, and a sidestream smoke processing portion which is configured to process sidestream smoke generated from the smoking article inserted into the smoking space. By elastically supporting an upstream end of the smoking article, the elastic support portion may improve support stability and ignition stability for the smoking article.
    Type: Application
    Filed: September 15, 2021
    Publication date: February 16, 2023
    Applicant: KT&G CORPORATION
    Inventors: Seung Kyu HAN, Jae Hyun KIM, Tae Heon KIM
  • Publication number: 20230015619
    Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).
    Type: Application
    Filed: September 23, 2022
    Publication date: January 19, 2023
    Inventors: Kristof DARMAWAIKARTA, Robert MAY, Sashi KANDANUR, Sri Ranga Sai BOYAPATI, Srinivas PIETAMBARAM, Steve CHO, Jung Kyu HAN, Thomas HEATON, Ali LEHAF, Ravindranadh ELURI, Hiroki TANAKA, Aleksandar ALEKSOV, Dilan SENEVIRATNE
  • Patent number: 11558164
    Abstract: A method and apparatus are provided for transmitting and receiving control information. A method in a base station includes transmitting, to a terminal, information associated with a resource region carrying a control channel; transmitting, to the terminal, a plurality of values associated with control channel candidates, each of the plurality of values corresponding to each of a plurality of numbers associated with CCEs constituting one control channel candidate, wherein the each of the plurality of values indicates a number of control channel candidates to be monitored by the terminal; determining a set of control channel candidates based on an ID of the terminal and at least one of the plurality of values associated with the control channel candidates; selecting at least one control channel candidate from among the set of control channel candidates; and transmitting the control information to the terminal through the at least one selected control channel candidate in the resource region.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: January 17, 2023
    Inventors: Yong-Jun Kwak, Hwan-Joon Kwon, Joon-Young Cho, Ju-Ho Lee, Jin-Kyu Han, Youn-Hyoung Heo, Ping Wang
  • Publication number: 20230000149
    Abstract: Provided herein are a sidestream smoke removal device and a control method thereof. The sidestream smoke removal device according to some embodiments of the present disclosure includes a housing in which a smoking space is formed, an ignition portion which is configured to ignite the smoking article inserted into the smoking space, a sidestream smoke processing portion which is configured to process sidestream smoke generated from the smoking article inserted into the smoking space, a temperature sensor which is configured to measure the temperature of the smoking article inserted into the smoking space, a display which is disposed on an outside of the housing, and a controller which is configured to monitor smoking progress with respect to the smoking article on the basis of the measured temperature and display a monitoring result through the display.
    Type: Application
    Filed: September 15, 2021
    Publication date: January 5, 2023
    Applicant: KT&G CORPORATION
    Inventors: Seung Kyu HAN, Jae Hyun KIM, Tae Heon KIM
  • Patent number: 11546787
    Abstract: A method and apparatus report channel state information (CSI) feedback of a user equipment (UE) in a coordinated multipoint communication system. The method includes identifying, when downlink transmissions to the UE are configured with at least two CSI subframe subsets, an interference measurement resource within one of the CSI subframe subsets belonging to a CSI reference resource. The method also includes using the identified interference measurement resource to derive an interference measurement. The apparatus includes a controller configured to, when downlink transmissions to the UE are configured with at least two CSI subframe subsets, identify an interference measurement resource within one of the CSI subframe subsets belonging to a CSI reference resource. The controller is configured to use the identified interference measurement resource to derive an interference measurement.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: January 3, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Krishna Sayana, Young-Han Nam, Jin-Kyu Han, Boon Loong Ng
  • Patent number: 11539382
    Abstract: Methods and devices to support multiple frequency bands in radio frequency (RF) circuits are shown. The described methods and devices are based on adjusting the effective width of a transistor in such circuits by selectively disposing matching transistors in parallel with the transistor. The presented devices and methods can be used in RF circuits including low noise amplifiers (LNAs), RF receiver front-ends or any other RF circuits where input matching to wideband inputs is required.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: December 27, 2022
    Assignee: PSEMI CORPORATION
    Inventors: Parvez Daruwalla, Rong Jiang, Sung Kyu Han, Khushali Shah
  • Publication number: 20220372243
    Abstract: Disclosed are an antimicrobial composition having excellent antimicrobial and anti-fungal properties and improved fingerprint resistance and chemical resistance, and a molded article including the same. The antimicrobial composition includes a combination of an amount of about 45 to 85 wt % of a polycarbonate resin, an amount of about 10 to 36 wt % of a polyester resin, an amount of about 3 to 12 wt % of an impact modifier, an amount of about 0.2 to 2 wt % of an inorganic antimicrobial agent, and an amount of about 1 to 6 wt % of a micro powder including a fluorine-based polymer resin, based on the total weight of the antimicrobial composition.
    Type: Application
    Filed: November 22, 2021
    Publication date: November 24, 2022
    Inventors: Jin Gi Ahn, Kyeong Hoon Jang, Dae Sik Kim, Jung Kyu Han, Do Young Bae, Jong Ung Byeon, Tae Jin An, Su Hyuk Jang, Chul Jin Jo
  • Patent number: 11493940
    Abstract: A method and a system for establishing a route of an unmanned aerial vehicle are provided. The method includes identifying an object from surface scanning data and shaping a space, which facilitates autonomous flight, as a layer, collecting surface image data for a flight path from the shaped layer, and analyzing a change in image resolution according to a distance from the object through the collected surface image data and extracting an altitude value on a flight route.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: November 8, 2022
    Assignee: THINWARE CORPORATION
    Inventors: Young-Kuk Ham, Tae Kyu Han
  • Patent number: 11489575
    Abstract: A Channel Status Information (CSI) transmission method and apparatus of a terminal are provided for use in a wireless communication system. In the wireless communication system supporting carrier aggregation, the terminal transmits the CSIs of component carriers without conflict of their transmission time points, resulting in an improvement of system performance. In a case where the transmission time points are determined to overlap unavoidably, the terminal transmits the CSI as compressed.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: November 1, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young Bum Kim, Joon Young Cho, Ju Ho Lee, Jin-Kyu Han, Hyoung Ju Ji
  • Patent number: 11488918
    Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: November 1, 2022
    Assignee: Intel Corporation
    Inventors: Kristof Darmawaikarta, Robert May, Sashi Kandanur, Sri Ranga Sai Boyapati, Srinivas Pietambaram, Steve Cho, Jung Kyu Han, Thomas Heaton, Ali Lehaf, Ravindranadh Eluri, Hiroki Tanaka, Aleksandar Aleksov, Dilan Seneviratne
  • Publication number: 20220345293
    Abstract: An electronic device and an operating method thereof according to various example embodiments may be configured to acquire video data and audio data, to scramble audio data of a time interval (?T) in non-time order, and to store the video data and the scrambled audio data together. According to an example embodiment, the time interval (?T) may be fixed to be the same with respect to continuous audio data. According to another example embodiment, the time interval (?T) may vary using a function of receiving an input of a secret key and order and outputting a unique value, such as a Hash-based Message Authentication Codes (HMAC)-based One-time Password (HOTP) algorithm.
    Type: Application
    Filed: July 6, 2022
    Publication date: October 27, 2022
    Applicant: THINKWARE CORPORATION
    Inventors: Daewon Kim, Yeongjin Seo, Tae-kyu Han
  • Patent number: 11465138
    Abstract: A method for preparing a metal complex catalyst by (A) obtaining a precipitate by bringing a metal precursor solution comprising a zinc (Zn) precursor, a ferrite (Fe) precursor, and water into contact with a basic aqueous solution; (B) obtaining a zinc ferrite catalyst by filtering and calcining the precipitate; and (C) supporting an acid onto the zinc ferrite catalyst, and a metal complex catalyst prepared thereby.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: October 11, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Sunhwan Hwang, Kyong Yong Cha, Dong Hyun Ko, Ye Seul Hwang, Jun Kyu Han, Sang Jin Han, Seongmin Kim
  • Patent number: 11431442
    Abstract: A method for wireless communication by a terminal, a method for wireless communication by a base station, the terminal, and the base station, are provided. The method for wireless communication by the terminal includes receiving first information comprising a muting subframe interval, a subframe offset, and a muting position of a resource element in a resource block, checking presence of a data in a subframe, determining the resource element to be muted in the subframe based on the muting subframe interval, the subframe offset, and the muting position, if the data is present, and receiving the data on a physical downlink shared channel (PDSCH) based on the result of the determining step.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: August 30, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youn Sun Kim, Jin Kyu Han, Sung Tae Kim, Myung Hoon Yeon, Cheng Shan, In Ho Lee