Abstract: A method includes providing a first electrode and a second electrode, receiving a first plurality of signals from the first electrode during a first period of time, and receiving a second plurality of signals from the second electrode during a second period of time. The method also includes receiving a pooled signal comprising a third plurality of signals from the first electrode and a fourth plurality of signals from the second electrode and isolating, from the pooled signal, one or more of the third plurality of signals and one or more of the fourth plurality of signals.

Abstract: A semiconductor device including a device isolation layer defining an active region; a first trench in the device isolation layer; a second trench in the active region; a main gate electrode structure filling a portion of the first trench and including a first barrier conductive layer and a main gate electrode; a pass gate electrode structure filling a portion of the second trench and including a second barrier conductive layer and a pass gate electrode; a support structure filling another portion of the second trench above the pass gate electrode; a first capping pattern filling another portion of the first trench above the main gate electrode; and a second gate insulating layer extending along a bottom and sidewall of the second trench, wherein the second barrier conductive layer is between the second gate insulating layer and the pass gate electrode and extends along a bottom and sidewall thereof.

Abstract: A includes an element isolation region, a first active region bounded by the element isolation region and that extends in a first direction and includes first and second parts disposed at a first level, and a third part disposed at a second level located above the first level, and a gate electrode disposed inside each of the element isolation region and the first active region and that extends in a second direction different from the first direction. The second part is spaced apart in the first direction from the first part, and the third part contacts each of the first and second parts. A first width in the second direction of the first part is less than a second width in the second direction of the third part.

Abstract: Disclosed are methods of predicting semiconductor material properties and methods of testing semiconductor devices using the same. The prediction method comprises preparing a machine learning model that is trained with a training system and using the machine learning model to predict material properties of a target system. The machine learning model is represented as a function of material properties with respect to a descriptor. The descriptor is calculated from unrelaxed charge density (UCD) that is represented by summation of atomic charge density (ACD) of single atoms.

Abstract: A semiconductor device including a device isolation layer defining an active region; a first trench in the device isolation layer; a second trench in the active region; a main gate electrode structure filling a portion of the first trench and including a first barrier conductive layer and a main gate electrode; a pass gate electrode structure filling a portion of the second trench and including a second barrier conductive layer and a pass gate electrode; a support structure filling another portion of the second trench above the pass gate electrode; a first capping pattern filling another portion of the first trench above the main gate electrode; and a second gate insulating layer extending along a bottom and sidewall of the second trench, wherein the second barrier conductive layer is between the second gate insulating layer and the pass gate electrode and extends along a bottom and sidewall thereof.

Abstract: A semiconductor device including a device isolation layer defining an active region; a first trench in the device isolation layer; a second trench in the active region; a main gate electrode structure filling a portion of the first trench and including a first barrier conductive layer and a main gate electrode; a pass gate electrode structure filling a portion of the second trench and including a second barrier conductive layer and a pass gate electrode; a support structure filling another portion of the second trench above the pass gate electrode; a first capping pattern filling another portion of the first trench above the main gate electrode; and a second gate insulating layer extending along a bottom and sidewall of the second trench, wherein the second barrier conductive layer is between the second gate insulating layer and the pass gate electrode and extends along a bottom and sidewall thereof.

Abstract: A main Insulated Gate Bipolar Transistor (IGBT) and a sense IGBT may have a sense resistor connected between a sense emitter of the sense IGBT and a main emitter of the main IGBT. Back-to-back Zener diodes may be connected between a sense gate of the sense IGBT and the sense emitter, and configured to clamp a voltage between the sense gate and the sense emitter during an electrostatic discharge (ESD) event.

Abstract: A includes an element isolation region, a first active region bounded by the element isolation region and that extends in a first direction and includes first and second parts disposed at a first level, and a third part disposed at a second level located above the first level, and a gate electrode disposed inside each of the element isolation region and the first active region and that extends in a second direction different from the first direction. The second part is spaced apart in the first direction from the first part, and the third part contacts each of the first and second parts. A first width in the second direction of the first part is less than a second width in the second direction of the third part.

Abstract: A method includes providing a first electrode and a second electrode, receiving a first plurality of signals from the first electrode during a first period of time, and receiving a second plurality of signals from the second electrode during a second period of time. The method also includes receiving a pooled signal comprising a third plurality of signals from the first electrode and a fourth plurality of signals from the second electrode and isolating, from the pooled signal, one or more of the third plurality of signals and one or more of the fourth plurality of signals.

Abstract: A semiconductor device including a device isolation layer defining an active region; a first trench in the device isolation layer; a second trench in the active region; a main gate electrode structure filling a portion of the first trench and including a first barrier conductive layer and a main gate electrode; a pass gate electrode structure filling a portion of the second trench and including a second barrier conductive layer and a pass gate electrode; a support structure filling another portion of the second trench above the pass gate electrode; a first capping pattern filling another portion of the first trench above the main gate electrode; and a second gate insulating layer extending along a bottom and sidewall of the second trench, wherein the second barrier conductive layer is between the second gate insulating layer and the pass gate electrode and extends along a bottom and sidewall thereof.

Abstract: A main Insulated Gate Bipolar Transistor (IGBT) and a sense IGBT may have a sense resistor connected between a sense emitter of the sense IGBT and a main emitter of the main IGBT. Back-to-back Zener diodes may be connected between a sense gate of the sense IGBT and the sense emitter, and configured to clamp a voltage between the sense gate and the sense emitter during an electrostatic discharge (ESD) event.

Abstract: A power device, which has a Field Stop (FS) layer based on a semiconductor substrate between a collector region and a drift region in an FS-IGBT structure. The FS layer includes multiple implants for improved functionality of the power device.

Abstract: A Hunter syndrome therapeutic agent contains a first composition to be intravenously injected and a second composition to be subcutaneously injected. The agent can reduce the number of visits to the hospital by patients with Hunter syndrome to twice a month or less. It maintains a medicinal effect equivalent to or greater than that of a conventional once-a-week IV injection, increases drug-taking compliance of patients in comparison to conventional therapeutic agents and treatment methods, and enables enhanced patient welfare and convenience.

Abstract: A Hunter syndrome therapeutic agent contains a first composition to be intravenously injected and a second composition to be subcutaneously injected. The agent can reduce the number of visits to the hospital by patients with Hunter syndrome to twice a month or less. It maintains a medicinal effect equivalent to or greater than that of a conventional once-a-week IV injection, increases drug-taking compliance of patients in comparison to conventional therapeutic agents and treatment methods, and enables enhanced patient welfare and convenience.

Abstract: In one general aspect, a power device can include a first Field Stop (FS) layer of a first conductivity type formed from a first-conductive-type semiconductor substrate. The first FS layer can include a first region having a constant impurity density profile along a depth direction and a second region having an impurity density profile along the depth direction lower than the impurity density profile of the first region. The power device can include a second FS layer of the first conductivity type disposed on a first surface of the first FS layer. The second FS layer can include a first implanted FS layer having an impurity density higher than an impurity density of the first FS layer, and a second implanted FS layer having an impurity density lower than the first implanted FS layer. The second implanted FS layer can be disposed between the first FS layer and the first implanted FS layer. The power device can include a transistor device having components disposed on the second FS layer.

Abstract: A Hunter syndrome therapeutic agent contains a first composition to be intravenously injected and a second composition to be subcutaneously injected. The agent can reduce the number of visits to the hospital by patients with Hunter syndrome to twice a month or less. It maintains a medicinal effect equivalent to or greater than that of a conventional once-a-week IV injection, increases drug-taking compliance of patients in comparison to conventional therapeutic agents and treatment methods, and enables enhanced patient welfare and convenience.

Abstract: In one general aspect, a method of fabricating a power device can include preparing a semiconductor substrate of a first conductivity type, and forming a first Field Stop (FS) layer and a second FS layer.

Abstract: Provided are a power device having an improved field stop layer and a method of manufacturing the same. The method can include performing a first ion implant process by implanting impurity ions of a first conductive type into a front surface of a semiconductor substrate to form an implanted field stop layer where the semiconductor substrate is the first conductive type. The method can include performing a second ion implant process by implanting impurity ions of the first conductive type into a first part of the implanted field stop layer such that an impurity concentration of the first part of the implanted field stop layer is higher than an impurity concentration of a second part of the implanted field stop layer.

Abstract: Provided are a power device having an improved field stop layer and a method of manufacturing the same. The method can include performing a first ion implant process by implanting impurity ions of a first conductive type into a front surface of a semiconductor substrate to form an implanted field stop layer where the semiconductor substrate is the first conductive type. The method can include performing a second ion implant process by implanting impurity ions of the first conductive type into a first part of the implanted field stop layer such that an impurity concentration of the first part of the implanted field stop layer is higher than an impurity concentration of a second part of the implanted field stop layer.

Abstract: Provided are a power device having an improved field stop layer and a method of manufacturing the same. The power device includes: a first field stop layer formed of a semiconductor substrate and of a first conductive type; a second field stop layer formed on the first field stop layer and of the first conductive type, the second field stop layer having a region with an impurity concentration higher than the first field stop layer; a drift region formed on the second field stop layer and of the first conductive type, the drift region having an impurity concentration lower than the first field stop layer; a plurality of power device cells formed on the drift region; and a collector region formed below the first field stop layer, wherein the second field stop layer includes a first region having a first impurity concentration and a second region having a second impurity concentration higher than the first impurity concentration.