Patents by Inventor Kyu Kang

Kyu Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SCAN DRIVER
    Publication number: 20200175913
    Abstract: A scan driver includes: a first transistor having a first electrode coupled to an output scan line, a second electrode coupled to a first power line, and a gate electrode coupled to a first node; a second transistor having a first electrode coupled to a first clock line, a second electrode coupled to the output scan line, and a gate electrode coupled to a second node; a third transistor having a first electrode coupled to the first node, a second electrode coupled to a first input scan line, and a gate electrode coupled to a second clock line; and a fourth transistor having a first electrode coupled to the second node and a second electrode and a gate electrode, which are coupled to a second input scan line, wherein the first input scan line and the second input scan line are different from each other.
    Type: Application
    Filed: November 27, 2019
    Publication date: June 4, 2020
    Inventors: Chul Kyu KANG, Sung Hwan KIM, Soo Hee OH, Dong Sun LEE, Sang Moo CHOI
  • STAGE AND SCAN DRIVER INCLUDING THE SAME
    Publication number: 20200168160
    Abstract: A stage and a scan driver including the same for supplying a scan signal using a stage formed of P-type transistors to prevent output of an unwanted noise in a period where the scan signal is not supplied.
    Type: Application
    Filed: September 13, 2019
    Publication date: May 28, 2020
    Inventors: Soo Hee OH, Chul Kyu KANG, Dong Sun LEE, Sang Moo CHOI
  • ULTRA-SMALL MULTI-CHANNEL OPTICAL MODULE WITH OPTICAL WAVELENGTH DISTRIBUTION
    Publication number: 20200158958
    Abstract: An ultra-small multi-channel optical module according to one embodiment of the present invention includes a base board, a glass substrate, a heat sink, optical elements, parallel light lenses, a first rectangular reflector, a glass cover, a second rectangular reflector, horizontal reflectors, and a light collecting lens.
    Type: Application
    Filed: November 18, 2019
    Publication date: May 21, 2020
    Inventors: Dae Seon KIM, Jong Jin LEE, Eun Kyu KANG, Sang Jin KWON, Jeong Eun KIM, Kwon Seob LIM, Eun Kyoung JEON, Soo Yong JUNG
  • METHIONINE-METAL CHELATE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200157121
    Abstract: The present disclosure relates to a preparation method of a methionine-metal chelate, and the methionine-metal chelate, which is prepared by first reacting Ca(OH)2 and methionine and adding metal chloride salts, can be used as feeds and feed additives.
    Type: Application
    Filed: July 6, 2018
    Publication date: May 21, 2020
    Inventors: Jun-Woo KIM, Min Kyu KANG, Gyeonghwan KIM, Il Chul KIM, Juun PARK, Yong Bum SEO, In Sung LEE, Jun Young JUNG, Je-won HONG
  • Method and apparatus for controlling frame transmission
    Patent number: 10659374
    Abstract: A frame transmission controlling apparatus includes: a list configuration unit managing a parameter related to a gate control; a cycle timer unit managing a start timing of a cycle; a list executing unit performing the gate control based on the parameter, wherein the list executing unit includes: a cycle executing state machine setting an expiration time of at least one section included in the cycle, checking gate operation information corresponding to a list pointer indicating the at least one section, and performing a control corresponding to the gate operation information; a delaying state machine deducting and updating the expiration time by a predetermined unit; a cycle holding state machine generating a control signal indicating stopping transmission in MAC; and a cycle releasing state machine generating a control signal indicating resuming the transmission in MAC.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: May 19, 2020
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Chang Ho Choi, Tae Kyu Kang, Jeong Dong Ryoo, Tae Sik Cheung
  • Pixel and display device including the same
    Patent number: 10658444
    Abstract: A pixel and a display device having the pixel, the pixel including: a light emitting element; a first transistor configured to control, in response to a voltage of a first node coupled to a gate electrode thereof, current to be supplied from a first power supply coupled with a first electrode thereof to a second power supply via the light emitting element; a storage capacitor coupled between the first node and the first power supply; a second transistor coupled between a data line and the first transistor; an initialization transistor coupled between the light emitting element and an initialization power supply to transmit a voltage of the initialization power supply the light emitting element; and a dummy transistor coupled between the light emitting element and the initialization power supply, and including a first electrode and a second electrode that are coupled with each other.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: May 19, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Chul Kyu Kang, Won Kyu Kwak, Sang Moo Choi
  • STAGE AND EMISSION CONTROL DRIVER HAVING THE SAME
    Publication number: 20200152127
    Abstract: Provided herein may be a stage and an emission control driver having the same. The stage may include an output unit configured to supply a voltage of a first or second power supply to a first output terminal depending on voltages of first and second nodes, an input unit configured to control the voltages of the second node and a third node, a first signal processing unit configured to control the voltage of the first node, and supply a voltage corresponding to the first node to a second output terminal, a second signal processing unit including a second capacitor coupled between the third node and a fifth node, the second signal processing unit being configured to control the voltage of the first node, and control a potential difference between opposite terminals of the second capacitor, and a third signal processing unit configured to control the voltage of the second node.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 14, 2020
    Inventors: Chul Kyu KANG, Dae Hyun KIM, Sung Hwan KIM, Soo Hee OH, Dong Sun LEE, Sang Moo CHOI
  • CHEMICAL SUPPLY STRUCTURE AND A DEVELOPING APPARATUS HAVING THE SAME
    Publication number: 20200150539
    Abstract: A chemical supply structure includes a bar-shaped body having a plurality of chemical reservoirs in which a plurality of chemicals is individually stored such that the body partially crosses an underlying substrate, a bar-shaped nozzle protruded from a bottom surface of the body and injecting injection chemicals onto the substrate, a plurality of the chemicals being mixed into the injection chemicals, and a hydrophobic unit arranged on the bottom surface of the body and on a side surface of the nozzle such that a mixed solution mixed with the injection chemicals is prevented from adhering to the bottom surface and the side surface by controlling a contact angle of the mixed solution with respect to the bottom surface and the side surface.
    Type: Application
    Filed: June 19, 2019
    Publication date: May 14, 2020
    Inventors: Jong-Keun OH, Kyoung-Noh KIM, Man-Kyu KANG, Byung-Gook KIM
  • PIXEL CIRCUIT
    Publication number: 20200143747
    Abstract: A pixel circuit, includes: an organic light-emitting diode; a first transistor coupled between a second node and a third node, wherein a gate electrode of the first transistor is coupled to a first node; a second transistor coupled between a data line and the second node, wherein a gate electrode of the second transistor is coupled to a first scan line; a fourth transistor coupled between the first node and an initialization power source, wherein a gate electrode of the fourth transistor is coupled to a second scan line; a fifth transistor coupled between a first power source and the second node, wherein a gate electrode of the fifth transistor is coupled to a first emission line; and a sixth transistor and an eighth transistor coupled in series between the third node and the organic light-emitting diode.
    Type: Application
    Filed: September 6, 2019
    Publication date: May 7, 2020
    Inventors: Sung Hwan KIM, Chul Kyu KANG, Soo Hee OH, Dong Sun LEE
  • Wafer bonding apparatus and wafer bonding system including the same
    Patent number: 10639875
    Abstract: Provided are a wafer bonding apparatus for accurately detecting a bonding state of wafers in a wafer bonding process and/or in a wafer bonding system including the wafer bonding apparatus. The wafer bonding apparatus includes a first supporting plate including a first surface and vacuum grooves for vacuum-absorption of a first wafer disposed on the first surface, a second supporting plate including a second surface facing the first surface. A second wafer is on the second surface. The wafer bonding apparatus and/or the wafer bonding system include a bonding initiator at a center portion of the first supporting plate, and an area sensor on the first supporting plate and configured to detect a propagation state of bonding between the first wafer and the second wafer.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: May 5, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-yeong Kim, Pil-kyu Kang, Seok-ho Kim, Kwang-jin Moon, Na-ein Lee, Ho-jin Lee
  • THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
    Publication number: 20200135749
    Abstract: A three-dimensional semiconductor device includes a first gate group on a lower structure and a second gate group on the first gate group. The first gate group includes first pad regions that are: (1) lowered in a first direction that is parallel to an upper surface of the lower structure and (2) raised in a second direction that is parallel to an upper surface of the lower structure and perpendicular to the first direction. The second gate group includes second pad regions that are sequentially raised in the first direction and raised in the second direction.
    Type: Application
    Filed: August 17, 2019
    Publication date: April 30, 2020
    Inventors: SUNG MIN HWANG, JOON SUNG LIM, BUM KYU KANG, JAE HO AHN
  • SEMICONDUCTOR LASER DEVICE
    Publication number: 20200136341
    Abstract: A semiconductor laser device may include a first cladding on a substrate, an optical waveguide on the first cladding, a laser light source chip on the optical waveguide to generate a laser beam, a first adhesive layer between the optical waveguide and the laser light source chip, and a second adhesive layer covering a sidewall of the laser light source chip.
    Type: Application
    Filed: August 12, 2019
    Publication date: April 30, 2020
    Inventors: Pil-Kyu KANG, Seok-Ho KIM, Tae-Yeong KIM, Hoe-Chul KIM, Hoon-Joo NA
  • SYSTEM FOR REGENERATING DPF DURING OPERATION OF ENGINE-POWERED FORKLIFT AND METHOD THEREFOR
    Publication number: 20200123949
    Abstract: The present disclosure is related to a system for regenerating a DPF and a method thereof. The system for regenerating a DPF during operation of an engine-powered forklift that includes the DPF for collecting particulate matter form exhaust gas discharged from an engine to an exhaust path includes: an engine control unit for controlling operation of the engine; an electro-hydraulic pump for discharging a working fluid that generates a hydraulic load; a control unit for determining a state of the forklift when a DPF regeneration request signal is received from the engine control unit, and controlling at least one of the hydraulic load of the electro-hydraulic pump and revolutions per minute of the engine according to the determined state of the forklift; and a diesel oxidation catalyst unit for regenerating the DPF according to the control of the control unit.
    Type: Application
    Filed: December 28, 2017
    Publication date: April 23, 2020
    Applicant: DOOSAN CORPORATION
    Inventors: Hyun Kyu KANG, Byung Do CHOI, Deok Rae KIM, Jun Il YI
  • SEMICONDUCTOR PACKAGES INCLUDING A SUPPORTING BLOCK SUPPORTING AN UPPER CHIP STACK
    Publication number: 20200126919
    Abstract: A semiconductor package includes a package substrate, a first chip stack, a second chip stack, and a supporting block. The first chip stack includes first semiconductor chips stacked on the package substrate to be offset in a first direction, and the second chip stack includes second semiconductor chips stacked on the first chip stack to be offset in a second direction. The supporting block includes a through via structure. The second chip stack is supported by the first chip stack and the supporting block.
    Type: Application
    Filed: December 14, 2018
    Publication date: April 23, 2020
    Applicant: SK hynix Inc.
    Inventor: Min Kyu KANG
  • MEMORY DEVICE AND OPERATING METHOD THEREOF
    Publication number: 20200117391
    Abstract: A memory device includes a command encoder encoding a command into a command code, a command decoder decoding the command code, selecting one of a plurality of read only memory (ROM) lines according to a decoding result, and outputting an enable signal through a selected ROM line among the plurality of ROM lines, a ROM code generator including a plurality of registers storing ROM codes for executing various operations and outputting a ROM code stored in a register to which the enable signal is input, among the plurality of registers, and an operation controller executing an algorithm according to the ROM code output from the ROM code generator.
    Type: Application
    Filed: May 28, 2019
    Publication date: April 16, 2020
    Inventor: Tai Kyu KANG
  • Semiconductor memory device for performing suspend operation and method of operating the same
    Patent number: 10613753
    Abstract: Provided herein are a semiconductor memory device and a method of operating the semiconductor memory device, which have an improved processing speed for a suspend operation. The semiconductor memory device includes a memory cell array, a peripheral circuit configured to perform a data operation corresponding to an externally provided command on the memory cell array and a control circuit configured to control the peripheral circuit to perform the data operation by sequentially executing instructions corresponding to a plurality of instruction lines of an operation algorithm for the data operation and, when a suspend command is provided during the data operation, to perform a preset suspend operation in any one of a checker mode and an instant mode.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: April 7, 2020
    Assignee: SK hynix Inc.
    Inventor: Tai Kyu Kang
  • SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    Publication number: 20200098711
    Abstract: A semiconductor device and a semiconductor package, the device including a first buffer dielectric layer on a first dielectric layer; a second dielectric layer and a second buffer dielectric layer sequentially disposed on the first buffer dielectric layer, the second buffer dielectric layer being in contact with the first buffer dielectric layer; and a pad interconnection structure that penetrates the first buffer dielectric layer and the second buffer dielectric layer, wherein the pad interconnection structure includes copper and tin.
    Type: Application
    Filed: May 7, 2019
    Publication date: March 26, 2020
    Inventors: Ju-Il CHOI, Pil-Kyu KANG, Hoechul KIM, Hoonjoo NA, Jaehyung PARK, Seongmin SON
  • Semiconductor packages including a heat insulation wall
    Patent number: 10600713
    Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip which are disposed side-by-side on a surface of a package substrate. A heat insulation wall is disposed between the first semiconductor chip and the second semiconductor chip. The heat insulation wall thermally isolates the first semiconductor chip from the second semiconductor chip.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: March 24, 2020
    Assignee: SK hynix Inc.
    Inventors: Min Kyu Kang, Jae Hyun Son, Ji Hyeok Shin
  • APPARATUS FOR COMBINING PRINTED CIRCUIT BOARDS
    Publication number: 20200084925
    Abstract: An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.
    Type: Application
    Filed: April 15, 2019
    Publication date: March 12, 2020
    Inventors: Young-Shin CHOI, Seul-Ki HAN, Myoun-Kyu KANG, Ki-Bong MUN, Du-San BAEK
  • HOT PLATE, SUBSTRATE HEAT-TREATING APPARATUS INCLUDING THE HOT PLATE, AND METHOD OF FABRICATING THE HOT PLATE
    Publication number: 20200066555
    Abstract: A hot plate in which holes are formed in proximity pins. The holes of the proximity pins are connected to vacuum holes to suppress generation of air flow during substrate heat treatment. A substrate heat-treating apparatus including the hot plate, and a method of fabricating the hot plate. The hot plate includes: a body with a heater; a plurality of first holes pass through the body in a downward direction; a plurality of proximity pins formed on the body support the substrate such that the substrate does not contact the top of the body. A plurality of second holes formed in at least some of the proximity pins and pass through the proximity pins in the downward direction from surfaces of the proximity pins. The first and second holes are connected to each other, and a vacuum is created inside the first and second holes to fix the substrate.
    Type: Application
    Filed: August 12, 2019
    Publication date: February 27, 2020
    Inventors: Kyung Sik Shin, Man Kyu Kang, Jun Ho Kim