Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

Abstract: A pixel includes an organic light emitting diode, a first transistor configured to control an amount of a current flowing from a first power to a second power via a second node and the organic light emitting diode in response to a voltage of a first node, a first capacitor between the first node and a third node, a second capacitor between the second node and the third node, a second transistor between the third node and a data line and including a gate electrode coupled to a scan line, and a third transistor between the first power and the second node and including a gate electrode coupled to a first emission control line.

Abstract: An organic light emitting display device driven at a first driving frequency or a second driving frequency lower than the first driving frequency includes pixels coupled to first scan lines, second scan lines, and data lines, a first scan driver configured to supply scan signals to the first scan lines during a first period and a second period in one frame period, when the organic light emitting display device is driven at the second driving frequency, a second scan driver configured to supply scan signals to the second scan lines during the first period, when the organic light emitting display device is driven at the second driving frequency, and a data driver configured to supply a data signal to the data lines during the first period.

Abstract: A variable back beam and a method of allowing an inflator to vary the variable back beam in case of collision. The variable back beam includes a main beam connected to a front end module carrier, an inner beam inserted into each of both sides of the main beam, and an operation member operable to move the inner beam in a vehicle-width direction at the time of left front or right front collision of the vehicle. Since the back beam is extended in length at the time of collision, the impact area or shock absorption area of the back beam can be increased, the impact on the back beam, a crush box, and a collision object can be reduced, and particularly, it is possible to reduce the crush length of the left or right end of the back beam.

Abstract: Provided herein may be a stage and an emission control driver having the same. The stage may include an output unit configured to supply a voltage of a first or second power supply to a first output terminal depending on voltages of first and second nodes, an input unit configured to control the voltages of the second node and a third node, a first signal processing unit configured to control the voltage of the first node, and supply a voltage corresponding to the first node to a second output terminal, a second signal processing unit including a second capacitor coupled between the third node and a fifth node, the second signal processing unit being configured to control the voltage of the first node, and control a potential difference between opposite terminals of the second capacitor, and a third signal processing unit configured to control the voltage of the second node.

Abstract: An apparatus for treating a substrate includes a process chamber having a process space therein, a support unit that supports the substrate in the process space, a heating member that heats the substrate supported on the support unit, and an exhaust unit that evacuates the process space. The exhaust unit includes an exhaust duct and a heat retention unit having a retention space that retains heat released from the process space. The retention space surrounds an adjacent area located adjacent to the process chamber in the exhaust duct.

Abstract: Disclosed herein is an inclined thin film solar cell. The inclined thin film solar cell includes a substrate including at least one first surface having a surface inclined at a first angle with respect to the bottom surface of the substrate and at least one second surface located adjacent to the first surface and having a surface which is connected to a next inclined surface and inclined at a second angle, a first electrode famed on a surface of the substrate, a light absorbing layer famed on the first electrode, and a second electrode formed on the light absorbing layer.

Abstract: Provided is a fluid container including: a container main body, of which one side is open, configured to store a fluid; a housing having an outlet provided at one side and in which the container main body slides in a longitudinal direction; and a pump module coupled to the open one side of the container main body and configured to discharge the fluid to the outlet by sliding the container main body.

Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

Abstract: An organic light emitting display device driven at a first driving frequency or a second driving frequency lower than the first driving frequency includes pixels coupled to first scan lines, second scan lines, and data lines, a first scan driver configured to supply scan signals to the first scan lines during a first period and a second period in one frame period, when the organic light emitting display device is driven at the second driving frequency, a second scan driver configured to supply scan signals to the second scan lines during the first period, when the organic light emitting display device is driven at the second driving frequency, and a data driver configured to supply a data signal to the data lines during the first period.

Abstract: A memory device, including a plurality of planes, includes a mode setting component to set an operation mode of the memory device as a verify pass mode to allow a verify operation, performed in the plurality of planes, to forcibly pass; and a verify signal generator for outputting a verify pass signal signaling that the verify operation has passed for each of the plurality of planes.

Abstract: A three-dimensional semiconductor device includes a lower substrate, a plurality of lower transistors disposed on the lower substrate, an upper substrate disposed on the lower transistors, a plurality of lower conductive lines disposed between the lower transistors and the upper substrate, and a plurality of upper transistors disposed on the upper substrate. At least one of the lower transistors is connected to a corresponding one of the lower conductive lines. Each of the upper transistors includes an upper gate electrode disposed on the upper substrate, a first upper source/drain pattern disposed in the upper substrate at a first side of the upper gate electrode, and a second upper source/drain pattern disposed in the upper substrate at a second, opposing side of the upper gate electrode. The upper gate electrode includes silicon germanium (SiGe).

Abstract: A display device includes a display panel including a plurality of pixels and a panel driver that drives the display panel. Each of the pixels includes a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, a seventh transistor, an eighth transistor, a first capacitor, and an emission element.

Abstract: A display device includes: a display panel including: a scan line, a data line, and an emission control line; a pixel including: a plurality of transistors connected to the scan line, the data line and the emission control line; and an organic light-emitting diode driven by the plurality of transistors, and a scan driver configured to: in response to an image mode being a moving image mode, generate a first mode scan signal having a turning-on voltage of a transistor for a plurality of horizontal periods; and in response to the image mode being a static image mode, generate a second mode scan signal having the turning-on voltage for a single horizontal period.

Abstract: Disclosed is a method for producing calcobutrol used as an MRI contrast agent. The method comprises the steps of: obtaining butrol represented by chemical formula 2 in the specification by reacting a gadobutrol represented by chemical formula 1 in the specification and a decomplexing agent; and obtaining a calcobutrol represented by chemical Formula 3 in the specification by reacting butrol with calcium ions.

Abstract: A semiconductor device includes a semiconductor layer having a first surface and a second surface opposite to the first surface, an active pattern on the first surface, the active pattern including a source/drain region, a power rail electrically connected to the source/drain region, and a power delivery network on the second surface, the power delivery network electrically connected to the power rail. The semiconductor layer includes an etch stop dopant, and the etch stop dopant has a maximum concentration at the second surface.

Abstract: Disclosed is a method and a battery management system for calibrating a state of charge of a battery. The method includes measuring a terminal voltage and a current of the battery, storing a measured voltage value indicating the terminal voltage and a measured current value indicating the current in a memory, updating a state of charge of the battery based on the measured current value, estimating an open-circuit voltage of the battery based on a first number of measured voltage values and a first number of measured current values in the order stored in the memory, storing an estimated voltage value indicating the open-circuit voltage in the memory, and calibrating the updated state of charge with a reference state of charge when a calibration condition is satisfied by a data set in which a second number of estimated voltage values sequentially stored in the memory are arranged in sequential order.

Abstract: A three-dimensional semiconductor memory device including a stack structure including gate structures and first dielectric patterns alternately stacked, a vertical channel penetrating the stack structure, and a charge storage layer extending from between the vertical channel and the first gate structures to between the vertical channel and the first dielectric patterns. The gate structures include first gate structures having a top surface and a bottom surface facing each other and having different width. The charge storage layer includes first segments between the vertical channel and the first gate structures, and second segments between the vertical channel and the first dielectric patterns. A thickness of the first segments is greater than a thickness of the second segments. One of the width of the top surface and the width of bottom surface of each first gate structure is the same as that of a first dielectric pattern on the first gate structure.

Abstract: A semiconductor package includes a package substrate, a first chip stack, a second chip stack, and a supporting block. The first chip stack includes first semiconductor chips stacked on the package substrate to be offset in a first direction, and the second chip stack includes second semiconductor chips stacked on the first chip stack to be offset in a second direction. The supporting block includes a through via structure. The second chip stack is supported by the first chip stack and the supporting block.

Abstract: Disclosed is a method of reconstructing a three-dimensional color mesh and an apparatus for the same. According to an embodiment of the present disclosure, the method includes: receiving mesh information of an object, multiple multi-view images obtained by photographing the object at different positions, and camera parameter information corresponding to the multiple multi-view images; constructing a texture map with respect to the object on the basis of the received information and setting a texture patch referring to a color value of the same multi-view image; correcting a color value of a vertex included for each texture patch; and performing rendering with respect to the object by applying the corrected color value of the vertex to the texture map.