Abstract: Provided are an optical module platform structure and a method of manufacturing the same. The optical module platform structure includes an optical module platform substrate, a light source device mounted on a light source mount attached on one upper side of the optical module platform substrate, a waveguide spaced apart from the light source device by a certain interval and mounted on a waveguide mount attached on the optical module platform substrate, a lens mount fixed between the light source mount and the waveguide mount, and a lens fixed to a top of the lens mount. Therefore, optical coupling efficiency between a light source and a waveguide is maximized by applying a lens mount, and an optical alignment error is minimized.

Abstract: Provided are an optical alignment device applied to an assembly process of an optical transmitter and an optical receiver that include multi-channel optical elements and optical waveguide elements for optical communication, and an optical alignment method thereof. The optical alignment device includes an element fixing case with a mounting space formed thereinside and an element insertion hole communicating with the mounting space formed at an upper side thereof, and a light source mounted in the mounting space of the element fixing case and configured to emit light toward a lower side of an optical element or an optical waveguide element which is inserted into the element insertion hole to check a position of a core.

Abstract: The present invention relates to an optical module, and more specifically, to an optical module which allows an optical coupling loss of an optical signal to be minimized and a frequency bandwidth thereof to be maximized. The optical module according to an embodiment of the present invention includes: a circuit substrate; an electronic element mounted on one surface of the circuit substrate; an optical element mounted on another surface perpendicular to the one surface of the circuit substrate; a capacitor mounted between the electronic element and the optical element; and an optical waveguide array on which an optical waveguide is disposed.

Abstract: A memory device includes a first data buffer receiving data of a first frequency band or a second frequency band, a first clock buffer providing a clock signal of the first frequency band to the first data buffer when the first data buffer receives the data of the first frequency band and providing a clock signal of the second frequency band to the first data buffer when the first data buffer receives the data of the second frequency band, a second data buffer receiving the data of the first frequency band or the second frequency band and receiving the clock signal of the second frequency band from the first clock buffer in response to receiving the data of the second frequency band, and a second clock buffer providing the clock signal of the first frequency band to the second data buffer in a first frequency band operation.

Abstract: According to an embodiment of the present disclosure, provided are a vibration output device and a portable electronic apparatus outputting vibration.

Abstract: A display device includes: a flexible substrate including a display unit and a plurality of peripheral units which surrounds the display unit and are bent to overlap a part of the display unit; a display member positioned at the display unit and which displays an image; and a signal line positioned at the plurality of peripheral units, where the plurality of peripheral units is bent in a way such that parts of the signal line, which are respectively positioned at adjacent peripheral units, are in contact with each other.

Abstract: Provided are a wafer bonding apparatus for accurately detecting a bonding state of wafers in a wafer bonding process and/or in a wafer bonding system including the wafer bonding apparatus. The wafer bonding apparatus includes a first supporting plate including a first surface and vacuum grooves for vacuum-absorption of a first wafer disposed on the first surface, a second supporting plate including a second surface facing the first surface. A second wafer is on the second surface. The wafer bonding apparatus and/or the wafer bonding system include a bonding initiator at a center portion of the first supporting plate, and an area sensor on the first supporting plate and configured to detect a propagation state of bonding between the first wafer and the second wafer.

Abstract: The present invention provides a 3-dimensional P-N junction solar cell composed of a base board coated with a back plate on the upper face of the same; a P type semiconductor thin film formed on the top side of the back plate which has a 3-dimensional porous structure and is composed of P type semiconductor crystal grains; a N type buffer layer formed on the surface of the crystal grains of the said P type semiconductor thin film with playing a role of coating the thin film; and a transparent electrode formed on the surface of the crystal grains of the P type semiconductor thin film on which the N type buffer layer is formed. The solar cell of the present invention is a P-N junction solar cell including a 3-dimensional photo catalytic thin film, which can provide an improved photoelectric conversion efficiency, compared with the conventional P-N junction solar cell, owing to the formation of the N-type buffer layer on the surface of the crystal grains of the 3-dimensional P type semiconductor thin film.

Abstract: A circuit stage including a first transistor including a first electrode and a gate electrode, the first electrode being coupled to a first input terminal and the gate electrode being coupled to a second input terminal configured to receive a first clock signal, an output circuit coupled to the second input terminal and a second power input terminal, an input circuit coupled to a second electrode of the first transistor and to a third input terminal, the third input terminal being configured to receive a first control clock signal, the input circuit being configured to control voltages of the second node and a third node, a first driving circuit coupled to a first power input terminal and to a fourth input terminal configured to receive a second control clock signal, and a second driving circuit coupled to the fourth input terminal and the third node.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of bank arrays and a control logic circuit. The control logic circuit controls access to the memory cell array in response to a command and an address. A first number of memory cells are coupled to a bit-line of a first bank array of the plurality of bank arrays, a second number of memory cells are coupled to a bit-line of a second bank array of the plurality of bank arrays and the first number is different from the second number.

Abstract: An organic light emitting display device driven at a first driving frequency or a second driving frequency lower than the first driving frequency includes pixels coupled to first scan lines, second scan lines, and data lines, a first scan driver configured to supply scan signals to the first scan lines during a first period and a second period in one frame period, when the organic light emitting display device is driven at the second driving frequency, a second scan driver configured to supply scan signals to the second scan lines during the first period, when the organic light emitting display device is driven at the second driving frequency, and a data driver configured to supply a data signal to the data lines during the first period.

Abstract: An organic light-emitting display device includes a substrate having a display area and a non-display area, a thin-film transistor (TFT) that includes a gate electrode and that is disposed in the display area of the substrate, a first scan line disposed in a same layer as the gate electrode that is connected to the gate electrode; and a second scan line disposed in a different layer from the first scan line that overlaps the first scan line, wherein the first scan line is connected to the second scan line in the non-display area of the substrate.

Abstract: An apparatus for auto focus with a three-location supporting structure includes a first frame having a magnet; a second frame having an AF coil, configured to move the first frame in an optic-axial direction; and a plurality of balls located between the first frame and the second frame to maintain a spaced state of the first frame and the second frame, wherein among the plurality of balls, three balls have a greater size than the other balls.

Abstract: An organic light emitting display device includes a pixel unit and a driving unit. The pixel unit includes at least one pixel and the driving unit is configured to drive the pixel unit. The at least one pixel includes a first switching transistor, a second switching transistor, a third switching transistor, a fourth switching transistor, a first capacitor, a second capacitor, an organic light emitting diode, a third capacitor, and a driving transistor.

Abstract: A method of manufacturing a substrate structure includes providing a first substrate including a first device region on a first surface, providing a second substrate including a second device region on a second surface, such that a width of the first device region is greater than a width of the second device region, and bonding the first substrate and the second substrate, such that the first and second device regions are facing each other and are electrically connected to each other.

Abstract: In a touch display device, a controller generates a touch sync signal for controlling timing of a touch sensing period and a display period in each of a plurality of frames. A touch panel has a plurality of touch electrodes in a display area to generate touch sensing signals indicating whether or not a touch occurs during the touch sensing period. A touch sensing circuit supplies a touch drive signal to the plurality of touch electrodes during the touch sensing period and detects if the touch occurred based on the touch sensing signals received from the plurality of touch electrodes. A touch assistance line surrounds the display area and is disposed in the non-display area of the touch panel. A touch assistance signal supply circuit generates a touch assistance signal on the touch assistance line. The touch assistance signal mimics the touch drive signal during the touch sensing period.

Abstract: An apparatus and method for editing three-dimensional (3D) building data. The apparatus for editing the 3D building data includes an input unit configured to obtain 3D scan data of a building, and a processor configured to divide the obtained 3D scan data of the building in units of construction components.

Abstract: The present invention relates to a sensory signal output apparatus, and more particularly, to a sensory signal output apparatus for generating a sound or a vibration force, in which a magnetic circuit thereof is vibrating in response to an alternating signal of the coil fixed to a case, the magnetic circuit being elastically rebounded and supported by an elastic rebound body, and the elastic rebound body being fixed to an open part of the case; wherein elastic rebound and support paths of the elastic rebound body are traversing the center of the open part of the case in a straight line having the shortest distance, are three-dimensionally traversing such that both the side ends and the middle part thereof have an altitude difference therebetween, and elastically rebounds and supports the magnetic circuit.

Abstract: A method is provided including: detecting an activation of an electronic device; detecting a current location of the electronic device; detecting whether the activation is prohibited at the current location of the electronic device; and shutting down the electronic device when the activation is prohibited.

Abstract: Disclosed are a driver IC and a display apparatus including the same, which supply a touch auxiliary signal, having the same phase and potential difference as those of a touch signal supplied to a touch electrode which is also used as a common electrode, to a plurality of supply lines disposed in a non-display area during a touch sensing period. The driver IC includes a common voltage supply element, a touch sensing unit, and a common voltage switching unit. The common voltage switching unit connects the common voltage supply element to a plurality of touch electrode lines connected to the plurality of touch electrodes during an image display period, and during a touch sensing period, the common voltage switching unit connects the plurality of touch electrode lines to the touch sensing unit.