Abstract: A refrigerant flow rate adjustment device and a system using the same include a refrigerant provided at a quantitative flow rate to a heat exchanger such that the occurrence of a liquid refrigerant is reduced at an outlet end of an evaporator. The refrigerant flow rate adjustment device and system prevent the occurrence of the liquid refrigerant at the outlet end of the heat exchanger, prevent an increase in load, and prevent a lubrication defect of a compressor.

Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, wherein at least one of both ends of the internal electrodes in the third direction may be spaced apart from the side margin portion.

Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, and an additional pattern spaced apart from the internal electrodes may be disposed in at least one of a region between the internal electrodes and the fifth surface or a region between the internal electrodes and the sixth surface.

Abstract: A refrigerator for drinks is provided. The refrigerator may have an open hole that is open upward, so a drink container may be inserted in an erect state in a cabinet through the open hole. An insertion guide connected to the open hole may be disposed in the cabinet and the width of the insertion guide may change in a height direction. Accordingly, a drink container may be guided by the insertion guide when being inserted into or taken out of the refrigerator for drinks.

Abstract: A shoe management device may have a housing having a body to define an inner space and a cover to open or close the body to allow access to the inner space. Agitators may be provided at a bottom of the body, which may be configured to hold shoes, and the agitators may remove foreign matter from the shoes. An upper portion of the body may have an air generator configured to blow air toward the shoes to remove foreign matter. In addition, moisture and germs inside the shoe may be removed by hot air, ultraviolet light, and plasma ions provided by a care assembly provided inside of the body and configured to be at least partially inserted into the shoes.

Abstract: An apparatus for processing a substrate is provided. The apparatus includes: a levitation stage transferring a substrate in a first direction and including first areas and second areas, which are arranged in a second direction that is different from the first direction; a plurality of rollers installed in the first areas and transferring the substrate; a plurality of first vacuum holes installed in the first areas and sucking the air at first pressure; and a plurality of second vacuum holes installed in the second areas and sucking the air at second pressure that is different from the first pressure.

Abstract: An embodiment discloses an ultraviolet light emitting element including: a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and an etched region in which the first conductive semiconductor layer is exposed; a first insulating layer disposed on the light emitting structure and including a first hole which exposes a portion of the etched region; a first electrode electrically connected to the first conductive semiconductor layer; and a second electrode electrically connected to the second conductive semiconductor layer, wherein the light emitting structure includes an intermediate layer regrown on the first conductive semiconductor layer exposed in the first hole, the first electrode is disposed on the intermediate layer, the etched region includes a first etched region disposed at an inner side and a second etched region disp

Abstract: A battery management apparatus according to an embodiment disclosed herein includes a microcontroller unit (MCU) for identifying whether a Modbus-communication connector is connected, identifying whether a controller area network (CAN)-communication connector is connected, and configuring a communication protocol based on identification results of the first identifying unit and the second identifying unit.

Abstract: A portable hood may include a base, a head, a column, and a roll filter unit. The roll filter unit may include a purification filter installed in the head and discharged to an outside of the head after moving past a suction inlet. Accordingly, one of purification filters, for example, an oil mist filter, may be provided as a roll filter, so cleanliness, maintenance, and replacement of the filter is easy.

Abstract: A portable hood may include a base, a head, a column, and a fan. The head may introduce air thereinto and discharge the introduced air to the outside. The column may be coupled eccentrically to a side of the head in a horizontal direction. Further, the fan may be located inside of the head such that the fan is eccentric to the head toward the column.

Abstract: Proposed is a method of controlling a portable air-flow guiding apparatus including adjusting at least one of an angle in a horizontal direction of a head unit including a sucking unit by a horizontal angle adjustment unit of the portable air-flow guiding apparatus and a height of the head unit by a height adjustment unit of the portable air-flow guiding apparatus according to a position of a heating source and a height of a cooking utensil.

Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.

Abstract: Transmission pathways in substrates, and associated methods are shown. Example transmission pathways include a semiconductor substrate with a core, a dielectric layer fixed on the core, at least one first electrical transmission pathway extending through at least one of the dielectric layer and the core. The first pathway includes a magnetic material disposed within the at least the core of the at least one first electrical transmission pathway, at least one second electrical transmission pathway extending through the magnetic material, a nickel layer disposed on inner circumferential surface of the magnetic material at least within the second electrical transmission pathway, a copper layer disposed on at least the nickel layer within the second electrical transmission pathway. The dielectric spacer or the nickel layer separates the copper layer from the magnetic material.

Abstract: The present disclosure relates to an LED display device, and more particularly, to an LED display device including a repair structure for a deteriorated pixel. In the present disclosure, a subLED electrically connected to first and second connecting electrodes for applying a voltage to a LED is disposed on a deteriorated LED. Thus, deterioration of a display quality due to a deteriorated pixel is prevented. Since it is not required to remove a deteriorated LED, a fabrication cost is reduced and a process efficiency is improved.

Abstract: An air management device may include three independently operated primary impellers 131, 131?, 131?, and drawn-in air is discharged through discharge ports 15?-1, 15?-2, 15?-3 provided in the front plate 15 of the housing 10. Louvers 141, 142, 143 installed downstream of the air flow and discharge ports 15?-1, 15?-2, 15?-3 may be independently opened or closed to provide discharge of the air to the surrounding environment. Further, at least one retractable or pop-up fan may be provided. The air management allows customization of air flow. The housing 10 of the furniture-type air management device may be installed on the floor of the livable space and may have a hexahedron shape that extends from side to side. A bottom inlet 11? may be formed on the bottom plate 11 of the housing 10 facing the floor of the living space above a predetermined distance. The replaceable filter 300 may be installed to filter the air sucked through the bottom inlet 11?, and may be drawn in and out of the housing 10.

Abstract: A shoe management device has a housing forming an exterior appearance, an inner space provided inside of a housing body of the housing, and a cover to open or close the housing body. A shoe may be provided inside of the inner space, and dust and foreign matter on the shoe may be removed by agitators and an air flow provided by an air generator. In addition, moisture and germs inside the shoe are removed by hot air, an ultraviolet ray, and plasma ions provided by a care device.

Abstract: A refrigerator for drinks is provided. The refrigerator has an open hole that is open upward to allow a drink container to be inserted in an erect state in a cabinet through the open hole. An insertion guide connected to the open hole is disposed in the cabinet and the width of the insertion guide changes in a height direction. Accordingly, a drink container is guided by the insertion guide when being inserted into or taken out of the refrigerator for drinks.

Abstract: Various embodiments disclosed relate to methods of making hybrid bonds for semiconductor assemblies, such as including substrate, semiconductor dies, and/or interconnects. The present disclosure includes a hybrid bond assembly having a via and a dielectric layer, each of the via and the dielectric layer bonding two or more components to each other.