Abstract: Described herein are magnetic core inductors (MCI) and methods for manufacturing magnetic core inductors. A first embodiment of the MCI can be a snake-configuration MCI. The snake-configuration MCI can be formed by creating an opening in a base material, such as copper, and providing a nonconductive magnetic material in the opening. The inductor can be further formed by forming plated through holes into the core material. The conductive elements for the inductor can be formed in the plated through holes. The nonconductive magnetic material surrounds each conductive element and plated through hole. In embodiments, a layered coil inductor can be formed by drilling a laminate to form a cavity through the laminate within the metal rings of the layered coil inductor. The nonconductive magnetic material can be provided in the cavity.

Abstract: Transmission pathways in substrates, and associated methods are shown. Example transmission pathways include a semiconductor substrate with a core, a dielectric layer fixed on the core, at least one first electrical transmission pathway extending through at least one of the dielectric layer and the core. The first pathway includes a magnetic material disposed within the at least the core of the at least one first electrical transmission pathway, at least one second electrical transmission pathway extending through the magnetic material, a nickel layer disposed on inner circumferential surface of the magnetic material at least within the second electrical transmission pathway, a copper layer disposed on at least the nickel layer within the second electrical transmission pathway. The dielectric spacer or the nickel layer separates the copper layer from the magnetic material.

Abstract: A substrate for an integrated circuit package, the substrate comprising a dielectric, at least one conductor plane within the dielectric, and a planar magnetic structure comprising an organic magnetic laminate embedded within the dielectric, wherein the planar magnetic structure is integrated within the at least one conductor plane.

Abstract: A method for preparing an acrylonitrile dimer according to the present disclosure makes it is possible to efficiently recover an acrylonitrile dimerization catalyst while reducing the process load.

Abstract: A cell penetrating peptide (CPP) according to the present invention is a novel cationic cell penetrating peptide that can effectively transport a biologically active molecule by passing through a cell membrane even when a biologically active molecule is bound thereto, and compared with conventional CPPs, it has excellent cell permeability enabling the transport of a biologically active molecule into cells, and the delivered biologically active molecule may effectively maintain its activity in cells. Accordingly, the CPP of the present invention may be very useful in various fields including cosmetics, diagnostics, drug delivery systems, recombinant protein vaccines, DNA/RNA therapeutics, and gene and protein therapy.

Abstract: A refrigerator for drinks is provided. The refrigerator may include a cabinet having a storage compartment therein, and a dispenser nozzle disposed to be at least partially exposed outside the cabinet. A pump connection line being able to increase pressure in a drink container by delivering high-pressure air into the drink container and a tank connection line preventing oxidation of the drink in the drink container by delivering an unreactive gas into the drink container may be disposed in the cabinet. Accordingly, two functions of discharging a drink and preventing oxidation may be individually performed, so consumption of an unreactive gas may be reduced.

Abstract: A system includes a memory and a processing device, operatively coupled to the memory, to perform operations including receiving, as input to a trained machine learning model for identifying defect impact with respect to at least one type defect type, data associated with a process related to electronic device manufacturing. The data associated with the process comprises at least one of: an input set of recipe settings for processing a component, a set of desired characteristics to be achieved by processing the component, or a set of constraints specifying an allowable range for each setting of the set of recipe settings. The operations further include obtaining an output by applying the data associated with the process to the trained machine learning model. The output is representative of the defect impact with respect to the at least one defect type.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes a plurality of build-up layers and a plurality of conductive layers in the build-up layers. The conductive layers include a first conductive layer and a second conductive layer. The first conductive layer is over the second conductive layer and build-up layers, where a first via couples the first and second conductive layers. The semiconductor package also includes a thin film capacitor (TFC) in the build-up layers, where a second via couples the TFC to the first conductive layer, and the second via has a thickness less than a thickness of the first via. The first conductive layer may be first level interconnects. The build-up layers may be dielectrics. The TFC may include a first electrode, a second electrode, and a dielectric. The first electrode may be over the second electrode, and the dielectric may be between the first and second electrodes.

Abstract: A semiconductor fabrication apparatus comprises a process chamber, an ozone supply that provides the process chamber with ozone, an oxygen supply that provides the ozone supply with a source gas of the ozone, and a plurality of impurity detectors disposed between the oxygen supply and the ozone supply. The impurity detectors detect an inactive gas in the source gas.

Abstract: An air management device may include three independently operated primary impellers 131, 131?, 131?, and drawn-in air is discharged through discharge ports 15?-1, 15?-2, 15?-3 provided in the front plate 15 of the housing 10. Louvers 141, 142, 143installed downstream of the air flow and discharge ports 15?-1, 15?-2, 15?-3 may be independently opened or closed to provide discharge of the air to the surrounding environment. Further, at least one retractable or pop-up fan may be provided. A bottom inlet 11? may be formed on the bottom plate 11 of the housing 10 facing the floor of the living space above a predetermined distance. The replaceable filter 300 may be installed to filter the air sucked through the bottom inlet 11?, and may be drawn in and out of the housing 10.

Abstract: In an LED display device according to an embodiment of the present disclosure, the LED display device comprises a second pixel driving circuit on a substrate, an LED element attached to a region not overlapping the second pixel driving circuit, including a first LED element, a second LED element and a growth substrate, and providing a double light-emitting spectrum, an element fixing layer surrounding the LED element, a first pixel driving circuit on the element fixing layer, and an element protecting layer on the first pixel driving circuit. In addition, the first LED element is controlled by the first pixel driving circuit, and the second LED element is controlled by the second pixel driving circuit. Therefore, the LED display device provides a dual emission spectrum, can realized high luminance and high definition, and can prevent a pixel defect.

Abstract: Disclosed herein are cavity structures in integrated circuit (IC) package supports, as well as related methods and apparatuses. For example, in some embodiments, an IC package support may include: a cavity in a dielectric material, wherein the cavity has a bottom and sidewalls; conductive contacts at the bottom of the cavity, wherein the conductive contacts include a first material; a first peripheral material outside the cavity, wherein the first peripheral material is at the sidewalls of the cavity and proximate to the bottom of the cavity, and the first peripheral material includes the first material; and a second peripheral material outside the cavity, wherein the second peripheral material is at the sidewalls of the cavity and on the first peripheral material, and the second peripheral material is different than the first peripheral material.

Abstract: Techniques and mechanisms for providing structures of a magnetic material based inductor. In an embodiment, an inductor comprises a body of a magnetic material, and a conductor which extends along a surface of the body. The body comprises a carrier material and magnetic filler particles distributed in the carrier material. A passivation material of the inductor is provided adjacent to the conductor and to surfaces of the filler particles. The conductor and the passivation material comprise different respective material compositions, wherein the passivation material comprises one of nickel, tin, copper, palladium, or gold. In another embodiment, the inductor is one of a plated through hole inductor type of a planar inductor type.

Abstract: The present disclosure relates to an LED display device, and more particularly, to an LED display device including a repair structure for a deteriorated pixel. In the present disclosure, a subLED electrically connected to first and second connecting electrodes for applying a voltage to a LED is disposed on a deteriorated LED. Thus, deterioration of a display quality due to a deteriorated pixel is prevented. Since it is not required to remove a deteriorated LED, a fabrication cost is reduced and a process efficiency is improved.

Abstract: Microelectronic assemblies that include a cooling channel, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a surface, a die having a surface, and a fluidic channel between the surface of the die and the surface of the package substrate, wherein a top surface of the fluidic channel is defined by the surface of the die and a bottom surface of the fluidic channel is defined by the surface of the package substrate. In some embodiments, a microelectronic assembly may include a package substrate having a surface; a die having a surface; and an interposer having a fluidic channel between the surface of the die and the surface of the package substrate.

Abstract: Disclosed is an air conditioning apparatus for a vehicle, the air conditioning apparatus being applicable to an autonomous vehicle, etc. having console removed therefrom by ensuring a lower space of a driver's seat in a front part of the vehicle and being capable of preventing condensate water from flowing backward. The air conditioning apparatus for a vehicle comprises: an air conditioning case having an air flow path formed therein and a plurality of air discharge ports; and a cooling heat exchanger and a heating heat exchanger provided in the air flow path of the air conditioning case and exchanging heat with the air passing through the air flow path, wherein the air discharge ports include a front seat air discharge port and a back seat air discharge port, and the back seat air discharge port is arranged under the heating heat exchanger in the direction of gravity.

Abstract: A portable hood may include a base, a head, a column, and a roll filter unit. The roll filter unit may include a purification filter installed in the head and discharged to an outside of the head after moving past a suction inlet. Accordingly, one of purification filters, for example, an oil mist filter, may be provided as a roll filter, so cleanliness, maintenance, and replacement of the filter is easy.

Abstract: Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.

Abstract: An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.

Abstract: The present disclosure relates to a method for preparing acrylonitrile dimer.