Abstract: The present invention relates to a steam generator and a washing machine therewith. The present invention provides a steam generator including a water chamber for holding water actually, the water chamber having a heater mounted thereto for heating the water, and a steam chamber for holding steam generated as the water is heated actually, wherein the water chamber has a vertical direction length (a vertical length) relatively greater than a horizontal direction length (a horizontal length).

Abstract: A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other.

Abstract: A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads.

Abstract: A semiconductor device has a substrate. A first conductive layer is formed over the substrate. A duplex plated bump on lead pad is formed over the substrate. An insulating layer is formed over the first conductive layer and the substrate. A portion of the insulating over the duplex plated bump on lead pad is removed using a laser direct ablation process. The insulating layer is a lamination layer. The duplex plated bump on lead pad has a wide bump on lead pad. A semiconductor die is mounted over the substrate. The semiconductor die has a composite conductive interconnect structure. The semiconductor die has a first bump and a second bump with a pitch ranging from 90-150 micrometers between the first bump and the second bump. A duplex plated contact pad is formed on a surface of the substrate opposite the duplex plated bump-on-lead pad.

Abstract: A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads.

Abstract: A substrate for a semiconductor package is provided having first and second core layers defining a cavity having an adhesive member and sized and shaped to receive a semiconductor chip. The semiconductor package further having a connection member formed on a bond finger and connected to a via pattern formed through the first and second core layers. A stack package is also provided having multiple substrates.

Abstract: A control method of a laundry machine comprising a water supply, washing and rinsing cycle, the control method includes first determination step performed prior to the rinsing cycle and determining a kind of detergent, second determination step performed during a first rinsing course of the rinsing cycle and determining an amount of remained detergent in a rinsing water, and condition determination step of at least one following rinsing course based on the kind and amount of the remained detergent.

Abstract: A semiconductor device for use in a printed circuit board is provided. In the semiconductor device, metal pillars are disposed perpendicular to bond pads of a semiconductor die. This configuration eliminates the need to form via holes for the connection of interconnection layers and the bond pads of the semiconductor die, thus simplifying the fabrication procedure of the semiconductor device. In addition, the semiconductor die is embedded in the semiconductor device. Based on this configuration, the use of the semiconductor device in a printed circuit board facilitates the stacking of a plurality of semiconductor dies and can reduce the thickness required for the stack, which make the semiconductor device light in weight and small in thickness and size.

Abstract: The present invention relates to a pure tone audiometer, and more particularly, to a pure tone audiometer with automated masking which is capable of automatically performing air-conduction and bone-conduction hearing tests and automatically performing a masking test, if necessary, so that a person obtains an accurate pure tone hearing threshold without others' assistance. The pure tone audiometer of the present invention can accurately perform the pure tone hearing test with automated masking without assistance from a doctor or an audiologist. Thus, with the pure tone audiometer, people can easily check their hearing ability for prevention and early detection of hearing loss and take swift action to cure hearing loss.

Abstract: Disclosed herein is a buffer substrate comprising: a first substrate having a first surface and a second surface opposite to the first surface, the first substrate having one or more through-holes formed therein; a first elastic material component filling the through-holes and covering the second surface of the first substrate; and a second substrate arranged on the first elastic material component arranged on the second surface of the first substrate.

Abstract: A steam generating device and a washing machine having the same are disclosed. The steam generating device includes a lower housing, which contains water, in which a heater is arranged, and which has a vertical length longer than a horizontal length, an upper housing including a steam chamber for containing steam generated as the water is heated, a water level sensor for sensing a water level of the water chamber, and a receptacle for covering the water level sensor, the receptacle including an opening for allowing water to be introduced into the receptacle. In accordance with this configuration, it is possible to easily install the steam generating device, to achieve a superior performance, to prevent the water level sensor from malfunctioning, and to prevent spots from being formed on laundry.

Abstract: A steam generating device and a washing machine having the same are disclosed. The steam generating device includes a lower housing including a main portion for receiving a heater, and connecting portions extending outwardly from the main portion, the lower housing defining a water chamber for containing water, an upper housing connected to the connecting portions, the upper housing defining a steam chamber for containing steam, a water level sensor for sensing a level of water contained in the water chamber, and a receptacle for protecting the water level sensor. The receptacle has an opening for allowing water to be introduced into the receptacle, and is substantially aligned with an inner surface of the lower housing or is arranged at a position spaced apart from the heater by a longer distance than the inner surface of the lower housing.

Abstract: A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern.

Abstract: Disclosed are a composition for introducing the osteogenic differentiation of human embryonic stem cells and a method for differentiating human embryonic stem cells into an osteoblastic lineage by inhibiting the mTOR signaling pathway. When cultured in the presence of an inhibitor of the mTOR signaling pathway, human embryonic stem cells are effectively induced to differentiate into an osteoblastic lineage. The osteogenic differentiation of human embryonic stem cells using the method and the composition is useful in examining the development and differentiation mechanism of osteoblasts and the cause of metabolic bone diseases, including osteoporosis. In addition, the method and the composition can be applied to the development of osteogenic differentiation techniques for generating clinically useful, terminally differentiated mature cells or progenitor cells.

Abstract: A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads.

Abstract: A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other.

Abstract: A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive is member is disposed at the first region. The second adhesive member is disposed at the third region.

Abstract: A steam generator includes a water chamber for holding water, the water chamber having a heater mounted thereto for heating the water, a steam chamber for holding steam generated as the water is heated, a water supply line for supplying the water to the water chamber, and a steam discharge line for discharging steam from the steam chamber, wherein the water chamber has a vertical direction length relatively greater than a horizontal direction length and the steam chamber has a horizontal direction length relatively greater than the horizontal length of the water chamber. A dryer or washing machine may include the steam generator described herein.

Abstract: A dryer or a washing machine includes a cabinet which forms an exterior of the dryer or the washing machine. A drum is rotatably mounted in the cabinet and a steam generator is provided outside the drum to supply steam to the drum, where the steam generator includes a water chamber to hold water, the water chamber having a heater mounted thereto for heating the water. The steam chamber is provided above the water chamber to hold steam generated as the water is heated, where the steam chamber has a steam discharge opening for discharging the steam, where the steam discharge opening is provided with a separator for isolating a steam discharge area from other areas and where the water chamber has a vertical direction length relatively greater than a horizontal direction length.

Abstract: Disclosed are the steam generator and the washing/drying machine having the same, the steam generator including: a case having an opening at one side thereof, a heating unit formed to penetrate the opening, and a fixing assembly mounted at the opening so as to seal the opening and supporting the heating unit, wherein the fixing assembly includes a sealing member for sealing the opening, and the opening includes a leakage prevention portion for preventing a gap formation between the opening and the sealing member when the sealing member is deformed, thereby preventing a leakage between the opening of the case and the sealing member even though the case or the sealing member is thermally deformed.