Patents by Inventor Kyuha Chung

Kyuha Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6232424
    Abstract: Soluble silicone resin compositions having good solution stability and a method for their preparation.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: May 15, 2001
    Assignee: Dow Corning Corporation
    Inventors: Bianxiao Zhong, Russell Keith King, Kyuha Chung, Shizhong Zhang
  • Patent number: 6210749
    Abstract: This invention pertains to a method for producing thermally stable multi-layer coatings and the coatings produced therefrom. The multi-layer coating is comprised of a first coating produced from hydrogen silsesquioxane having a thickness of 1.25 to 2.25 &mgr;m and a second coating comprising silicon dioxide having a thickness of at least 100 nm. The method for producing the first coating comprises applying a fillerless hydrogen silsesquioxane resin composition onto a substrate and thereafter heating the hydrogen silsesquioxane resin at a temperature of 150° C. to 500° C. for a sufficient period of time to produce a crack-free coating having a thickness of 1.25 &mgr;m to 2.25 &mgr;m. The second coating is produced by depositing, preferably by PECVD, silicon dioxide over the first coating at a thickness of at least 100 nm.
    Type: Grant
    Filed: March 1, 2000
    Date of Patent: April 3, 2001
    Assignee: Dow Corning, Corporation
    Inventors: Jeffrey Nicholas Bremmer, Kyuha Chung, Chandan Kumar Saha, Michael John Spaulding
  • Patent number: 6022625
    Abstract: This invention pertains to a method for producing crack-free, insoluble, greater than 1.25 .mu.m thick coatings from hydrogen silsesquioxane resin compositions. The method for producing the coating comprises applying a fillerless hydrogen silsesquioxane resin composition onto a substrate and thereafter heating the hydrogen silsesquioxane resin at a temperature of less than 500.degree. C. for a controlled period of time to produce the crack-free coating having a thickness of greater than 1.25 .mu.m. The resins may be cured in an inert or oxygen containing environment.
    Type: Grant
    Filed: August 3, 1998
    Date of Patent: February 8, 2000
    Assignee: Dow Corning Corporation
    Inventors: Jeffrey Nicholas Bremmer, Kyuha Chung, Chandan Kumar Saha, Michael John Spaulding
  • Patent number: 5994454
    Abstract: The present invention relates to a method of preparing an aerosol suppressant composition and to use of the composition to reduce or suppress silicone mist in high speed coating processes and significantly increase the adhesion of the coating to the substrate. More particularly, the present invention relates to a method of preparing an aerosol suppressant composition by reacting an organosilicon compound, an oxyalkylene containing compound, and a catalyst. The composition, when added to curable silicone coatings, reduces the amount of silicone mist in high speed coating processes.
    Type: Grant
    Filed: May 22, 1997
    Date of Patent: November 30, 1999
    Assignee: Dow Corning Corporation
    Inventors: Kyuha Chung, Gary Rex Homan, Raymond Lee Tabler
  • Patent number: 5866197
    Abstract: This invention pertains to a method for producing crack-free, insoluble, greater than 1.25 .mu.m thick coatings from hydrogen silsesquioxane resin compositions. The method for producing the coating comprises applying a fillerless hydrogen silsesquioxane resin composition onto a substrate and thereafter heating the hydrogen silsesquioxane resin at a temperature of less than 500.degree. C. for a controlled period of time to produce the crack-free coating having a thickness of greater than 1.25 .mu.m. The resins may be cured in an inert or oxygen containing environment.
    Type: Grant
    Filed: June 6, 1997
    Date of Patent: February 2, 1999
    Assignee: Dow Corning Corporation
    Inventors: Jeffrey Nicholas Bremmer, Kyuha Chung, Chandan Kumar Saha, Michael John Spaulding
  • Patent number: 5777047
    Abstract: Organosiloxane compositions curable to silicone elastomers having improved weep properties are described. The compositions include an alkenyl-containing polydiorganosiloxane, an organohydrogensiloxane, a platinum-group metal catalyst and a MQ-type resinous organosiloxane copolymer having at least one fluorine atom-containing group per molecule; and a silicone elastomer prepared from such composition. A method of minimizing the leakage of a hydrocarbon fluid from a container using the silicone elastomer is also described.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: July 7, 1998
    Assignee: Dow Corning Corporation
    Inventors: Kyuha Chung, Stephen Clay Warren
  • Patent number: 5756598
    Abstract: Organosiloxane compositions curable to silicone elastomers having improved weep properties are described. The compositions include an alkenyl-containing polydiorganosiloxane, an organohydrogensiloxane, a platinum-group metal catalyst and a MQ-type resinous organosiloxane copolymer; and a silicone elastomer prepared from such composition. A method of a minimizing the leakage of a hydrocarbon fluid from a container using the silicone elastomer is also described.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: May 26, 1998
    Assignee: Dow Corning Corporation
    Inventors: Kyuha Chung, Stephen Clay Warren
  • Patent number: 5708075
    Abstract: The present invention relates to a curable silicone release coating composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogensiloxane having at least two silicon-bonded hydrogen atoms per molecule, (C) a siloxane resin having silicon-bonded hydrogen groups, (D) a platinum group metal-containing catalyst, and optionally (E) an inhibitor. The compositions of this invention are useful as release coatings for pressure sensitive adhesives.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: January 13, 1998
    Assignee: Dow Corning Corporation
    Inventors: Kyuha Chung, Robert Alan Ekeland, Randall Gene Schmidt
  • Patent number: 5698655
    Abstract: The present invention relates to a method of preparing an aerosol suppressant composition and to use of the composition to reduce or suppress silicone mist in high speed coating processes and significantly increase the adhesion of the coating to the substrate. More particularly, the present invention relates to a method of preparing an aerosol suppressant composition by reacting an organosilicon compound, an oxyalkylene containing compound, and a catalyst. The composition, when added to curable silicone coatings, reduces the amount of silicone mist in high speed coating processes.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: December 16, 1997
    Assignee: Dow Corning Corporation
    Inventors: Kyuha Chung, Gary Rex Homan, Raymond Lee Tabler
  • Patent number: 5696211
    Abstract: Release modifier composition useful in release coating compositions comprising a fluorosilicone compound having perfluoroalkyl groups and at least three silicon-bonded hydrogen atoms and a MQ resin having at least one alkenyl group.Release coating compositions comprising the release modifier compositions and a method for modifying the release force of release coating compositions is also claimed.
    Type: Grant
    Filed: December 16, 1996
    Date of Patent: December 9, 1997
    Assignee: Dow Corning Corporation
    Inventors: Kyuha Chung, Simon Hurford, Bhukandas Parbhoo
  • Patent number: 5625023
    Abstract: The present invention relates to a method of preparing an aerosol suppressant composition and to use of the composition to reduce or suppress silicone mist in high speed coating processes and significantly increase the adhesion of the coating to the substrate. More particularly, the present invention relates to a method of preparing an aerosol suppressant composition by reacting an organosilicon compound, an oxyalkylene containing compound, and a catalyst. The composition, when added to curable silicone coatings, reduces the amount of silicone mist in high speed coating processes.
    Type: Grant
    Filed: December 9, 1994
    Date of Patent: April 29, 1997
    Assignee: Dow Corning Corporation
    Inventors: Kyuha Chung, Gary R. Homan, Raymond L. Tabler
  • Patent number: 5248739
    Abstract: There is disclosed a pressure-sensitive adhesive composition based on a silicone resin and a polydiorganosiloxane polymer wherein the resin component has a number average molecular weight of about 950 to 1,600 and consists essentially of triorganosiloxy (M) units and silicate (Q) units wherein the molar ratio M/Q is in the range 1.1/1 to 1.4/1, inclusive. The adhesives of the invention exhibit improved adhesion to low energy substrates such as polyethylene and polytetrafluoroethylene.
    Type: Grant
    Filed: October 14, 1992
    Date of Patent: September 28, 1993
    Assignee: Dow Corning Corporation
    Inventors: Randall G. Schmidt, William P. Brady, Gary A. Vincent, Kyuha Chung
  • Patent number: 5108791
    Abstract: A curable organosilicon composition comprises a component having silicon-bonded hydrogen atoms, a component having silicon-bonded radicals reactive therewith, a curing catalyst, a catalyst-inhibitor and a bath life extender. The use of certain compounds, which are ineffective as a bath life extender in the absence of a catalyst inhibitor, effectively extend the room temperature bath life of a silicone coating composition containing a catalyst inhibitor. Being a substantial non-inhibitor for the catalyst the bath life extender component does not effect the cure time and/or cure temperature of the composition.This discovery has permitted the preparation of curable coating compositions which have a long bath life at room temperature and a rapid cure time at elevated temperatures which does not drift to longer intervals as the coating compositions ages over a typical production run.
    Type: Grant
    Filed: April 1, 1991
    Date of Patent: April 28, 1992
    Assignee: Dow Corning Corporation
    Inventors: Kyuha Chung, Antony P. Wright, Ming-Hsiung Yeh
  • Patent number: 5036117
    Abstract: A curable organosilicon composition comprises a component having silicon-bonded hydrogen atoms, a component having silicon-bonded radicals reactive therewith, a curing catalyst, a catalyst-inhibitor and a bath life extender. The use of certain compounds, which are ineffective as a bath life extender in the absence of a catalyst inhibitor, effectively extend the room temperature bath life of a silicone coating composition containing a catalyst inhibitor. Being a substantial non-inhibitor for the catalyst the bath life extender component does not effect the cure time and/or cure temperature of the composition.This discovery has permitted the preparation of curable coating compositions which have a long bath life at room temperature and a rapid cure time at elevated temperatures which does not drift to longer intervals as the coating compositions ages over a typical production run.
    Type: Grant
    Filed: November 3, 1989
    Date of Patent: July 30, 1991
    Assignee: Dow Corning Corporation
    Inventors: Kyuha Chung, Antony P. Wright, Ming-Hsiung Yeh
  • Patent number: 4994198
    Abstract: This invention relates to an electrorheological (ER) fluid composition comprising a suspension of a solid silicone ionomer in an electrically non-conducting liquid wherein the silicone ionomer is a reaction product of (I) an amine functional diorganopolysiloxane having a degree of polymerization of less than about 10,000 in which at least about 3 mole percent of the silicon atoms have attached thereto, through silicon-carbon bonds, an amine functional organic group bearing at least one --NHR" group, in which R" is selected from the group consisting of hydrogen and an alkyl radical having 1 to 6 carbon atoms; and (II) an acid.
    Type: Grant
    Filed: January 29, 1990
    Date of Patent: February 19, 1991
    Assignee: Dow Corning Corporation
    Inventor: Kyuha Chung