Patents by Inventor Kyung Hwan Ko
Kyung Hwan Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11962764Abstract: Disclosed are an inter-prediction method and an image decoding apparatus using the same. According to an embodiment of the present invention, there is provided an inter-prediction method including extracting a merge candidate flag and offset information from a bitstream, selecting a merge candidate corresponding to the extracted merge candidate flag from a merge candidate list including neighboring blocks of a current block as merge candidates, deciding a motion vector of the current block by applying the offset information to a motion vector of the selected merge candidate, and generating, as a prediction block of the current block, a block indicated by the motion vector of the current block in a reference picture referenced by the selected merge candidate.Type: GrantFiled: April 26, 2023Date of Patent: April 16, 2024Assignee: SK TELECOM CO., LTD.Inventors: Tae Young Na, Sun Young Lee, Kyung Hwan Ko, Se Hoon Son, Jae Il Kim
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Patent number: 11956427Abstract: A method is disclosed for reconstructing a current block in units of sub-blocks included in the current block. The method includes: decoding transform coefficients in a transform block of the current block, sub-block information indicating a division form of the sub-blocks and transform type information indicating a transform type applied to the transform block from a bitstream; deriving a residual block of the current block from the transform coefficients on the basis of the transform type indicated by the transform type information and the sub-block information; and filtering boundaries of the sub-blocks in a reconstructed block of the current block derived on the basis of the residual block.Type: GrantFiled: March 20, 2020Date of Patent: April 9, 2024Assignee: SK TELECOM CO., LTD.Inventors: Tae Young Na, Sun Young Lee, Kyung Hwan Ko, Se Hoon Son, Jae Il Kim
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Publication number: 20230262213Abstract: Disclosed are an inter-prediction method and an image decoding apparatus using the same. According to an embodiment of the present invention, there is provided an inter-prediction method including extracting a merge candidate flag and offset information from a bitstream, selecting a merge candidate corresponding to the extracted merge candidate flag from a merge candidate list including neighboring blocks of a current block as merge candidates, deciding a motion vector of the current block by applying the offset information to a motion vector of the selected merge candidate, and generating, as a prediction block of the current block, a block indicated by the motion vector of the current block in a reference picture referenced by the selected merge candidate.Type: ApplicationFiled: April 26, 2023Publication date: August 17, 2023Inventors: Tae Young NA, Sun Young LEE, Kyung Hwan KO, Se Hoon SON, Jae Il KIM
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Patent number: 11671584Abstract: Disclosed are an inter-prediction method and an image decoding apparatus using the same. According to an embodiment of the present invention, there is provided an inter-prediction method including extracting a merge candidate flag and offset information from a bitstream, selecting a merge candidate corresponding to the extracted merge candidate flag from a merge candidate list including neighboring blocks of a current block as merge candidates, deciding a motion vector of the current block by applying the offset information to a motion vector of the selected merge candidate, and generating, as a prediction block of the current block, a block indicated by the motion vector of the current block in a reference picture referenced by the selected merge candidate.Type: GrantFiled: May 14, 2021Date of Patent: June 6, 2023Assignee: SK TELECOM CO., LTD.Inventors: Tae Young Na, Sun Young Lee, Kyung Hwan Ko, Se Hoon Son, Jae Il Kim
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Publication number: 20220368899Abstract: A method for partitioning a picture is disclosed. The method includes: decoding, from a bitstream, a split flag indicating whether the picture is partitioned into one or more sub-units; decoding, from the bitstream, partition information when the split flag indicates partitioning; and partitioning the picture into the sub-units based on the partition information.Type: ApplicationFiled: October 6, 2020Publication date: November 17, 2022Inventors: Jae Il KIM, Sun Young LEE, Se Hoon SON, Kyung Hwan KO, A Ram BAEK
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Publication number: 20220353516Abstract: A video decoding apparatus and a method for adaptively setting a resolution are disclosed. According to one embodiment of the present invention, a method for adaptively setting a resolution on a per-picture basis comprises the steps of: decoding maximum resolution information from a bitstream; decoding, from the bitstream, resolution information about a current picture; and setting the resolution of the current picture on the basis of the maximum resolution information or the resolution information, wherein the resolution information has a size less than or equal to that of the maximum resolution information.Type: ApplicationFiled: June 26, 2020Publication date: November 3, 2022Inventors: Jae Il KIM, Sun Young LEE, Kyung Hwan KO, A Ram BAEK, Se Hoon SON, Jae Seob SHIN, Tae Young NA
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Patent number: 11439021Abstract: An electronic component-embedded substrate includes a first core layer having a first through-hole, a first passive component disposed in the first through-hole, a second core layer disposed on the first core layer and having a second through-hole, a second passive component disposed in the second through-hole, an insulating material covering at least a portion of each of the first passive component and the second passive component and disposed in at least a portion of each of the first through-hole and the second through-hole, and a first wiring layer disposed on a level between the first passive component and the second passive component such that at least a portion of the first wiring layer is covered with the insulating material. The first passive component and the second passive component are connected to each other by the first wiring layer.Type: GrantFiled: November 11, 2020Date of Patent: September 6, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Koo Woong Jeong, Kyung Hwan Ko, Jung Hyun Cho, Chang Soo Woo, Soon Cheol Jung
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Publication number: 20220272390Abstract: There is provided a video signal decoding method. The method comprises decoding block division information of a current block, dividing the current block into a plurality of sub blocks based on the block division information, and decoding the sub blocks.Type: ApplicationFiled: April 8, 2022Publication date: August 25, 2022Applicant: INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNIVERSITYInventors: Yung Lyul LEE, Nam Uk KIM, Kyung Hwan KO, Young Hwan YOO
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Publication number: 20220224885Abstract: A method and apparatus for deriving an intra-prediction mode are disclosed. At least one embodiment of the present disclosure provides a method of deriving an intra-prediction mode, including (i) obtaining, based on reference line information indicating any one of a plurality of reference lines, most probable mode (MPM) information indicating whether an intra-prediction mode of a current block is included in an MPM list lacking a planar mode, (ii) determining, based on the reference line information and the MPM information, planar information indicating whether the intra-prediction mode of the current block is the planar mode, and (iii) deriving the intra-prediction mode of the current block by using the planar information.Type: ApplicationFiled: May 27, 2020Publication date: July 14, 2022Inventors: Jae Il KIM, Sun Young LEE, Kyung Hwan KO
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Publication number: 20220224884Abstract: A method of configuring candidate intra modes and a video decoding apparatus are disclosed. At least one embodiment of the present disclosure provides a method of configuring candidate intra modes for a chroma block, including determining whether a luma region corresponding to the chroma block has an encoding mode that is available for use, setting a direct mode (DM) among the candidate intra modes as a default mode when the encoding mode of the luma region is not available, and configuring the candidate intra modes by including the DM.Type: ApplicationFiled: May 27, 2020Publication date: July 14, 2022Inventors: Jae Il KIM, Sun Young LEE, Kyung Hwan KO
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Publication number: 20220182604Abstract: A video decoding method is disclosed for predicting a picture, which is split into equal-sized coding tree blocks, in units of blocks. The method includes: reconstructing a block vector for a current coding block in a current coding tree block to be decoded, by decoding block vector information from a bitstream, wherein the current coding block is one of blocks split from the current coding tree block in a tree structure; and setting, as a prediction block of the current coding block, a reference block indicated by the block vector in the picture in which the current coding block is located.Type: ApplicationFiled: March 16, 2020Publication date: June 9, 2022Inventors: Jae Il KIM, Sun Young LEE, Kyung Hwan KO, Jae Seob SHIN
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Publication number: 20220166974Abstract: A method is disclosed for reconstructing a current block in units of sub-blocks included in the current block. The method includes: decoding transform coefficients in a transform block of the current block, sub-block information indicating a division form of the sub-blocks and transform type information indicating a transform type applied to the transform block from a bitstream; deriving a residual block of the current block from the transform coefficients on the basis of the transform type indicated by the transform type information and the sub-block information; and filtering boundaries of the sub-blocks in a reconstructed block of the current block derived on the basis of the residual block.Type: ApplicationFiled: March 20, 2020Publication date: May 26, 2022Inventors: Tae Young NA, Sun Young LEE, Kyung Hwan KO, Se Hoon SON, Jae Il KIM
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Publication number: 20220007511Abstract: An electronic component-embedded substrate includes a first core layer having a first through-hole, a first passive component disposed in the first through-hole, a second core layer disposed on the first core layer and having a second through-hole, a second passive component disposed in the second through-hole, an insulating material covering at least a portion of each of the first passive component and the second passive component and disposed in at least a portion of each of the first through-hole and the second through-hole, and a first wiring layer disposed on a level between the first passive component and the second passive component such that at least a portion of the first wiring layer is covered with the insulating material. The first passive component and the second passive component are connected to each other by the first wiring layer.Type: ApplicationFiled: November 11, 2020Publication date: January 6, 2022Inventors: Koo Woong Jeong, Kyung Hwan Ko, Jung Hyun Cho, Chang Soo Woo, Soon Cheol Jung
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Patent number: 11178761Abstract: A printed circuit board includes a printed circuit board includes a substrate portion having a recess portion and including a first circuit layer, abridge disposed in the recess portion and including an insulating layer and a bridge circuit layer, an insulating material disposed in at least a portion of the recess portion and covering at least a portion of the bridge, a second circuit layer disposed on the insulating material, and a first via penetrating through the insulating material and a portion of the bridge and connecting the second circuit layer and the bridge circuit layer to each other.Type: GrantFiled: November 20, 2020Date of Patent: November 16, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Hyun Cho, Kyung Hwan Ko, Chi Won Hwang
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Patent number: 11129280Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.Type: GrantFiled: March 2, 2020Date of Patent: September 21, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Kwan Lee, Kyung Hwan Ko, Kyoung Jun Kim, Yong Hoon Kim, Seung Eun Lee, Hak Chun Kim
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Publication number: 20210274164Abstract: Disclosed are an inter-prediction method and an image decoding apparatus using the same. According to an embodiment of the present invention, there is provided an inter-prediction method including extracting a merge candidate flag and offset information from a bitstream, selecting a merge candidate corresponding to the extracted merge candidate flag from a merge candidate list including neighboring blocks of a current block as merge candidates, deciding a motion vector of the current block by applying the offset information to a motion vector of the selected merge candidate, and generating, as a prediction block of the current block, a block indicated by the motion vector of the current block in a reference picture referenced by the selected merge candidate.Type: ApplicationFiled: May 14, 2021Publication date: September 2, 2021Inventors: Tae Young NA, Sun Young LEE, Kyung Hwan KO, Se Hoon SON, Jae Il KIM
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Publication number: 20210195750Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.Type: ApplicationFiled: March 2, 2020Publication date: June 24, 2021Inventors: Young Kwan Lee, Kyung Hwan Ko, Kyoung Jun Kim, Yong Hoon Kim, Seung Eun Lee, Hak Chun Kim
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Patent number: 10998247Abstract: A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.Type: GrantFiled: July 26, 2019Date of Patent: May 4, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jung Hyun Cho, Young Sik Hur, Won Wook So, Kyung Hwan Ko, Yong Ho Baek, Yong Duk Lee
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Publication number: 20210058646Abstract: According to the present invention, there is provided a video signal processing method of dividing an input image on a per-block basis for encoding, the method including: determining, at a division determination step, whether to divide a current block; dividing, at a block division step, the current block into multiple sub blocks on the basis of the determination; generating block division information on division of the current block; and encoding, at an encoding step, the block division information, the current block, or the sub blocks. Examples of division of the block according to the present invention include division using N-ary tree structures, such as the quad tree structure, the binary tree structure, and/or the triple tree structure.Type: ApplicationFiled: October 15, 2020Publication date: February 25, 2021Applicant: INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNIVERSITYInventors: Yung Lyul LEE, Nam Uk KIM, Kyung Hwan KO, Young Hwan YOO
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Patent number: 10925161Abstract: A printed circuit board includes: an insulation material including a cavity formed therein; a first electronic element disposed in the cavity and including a groove; and a second electronic element disposed in the groove of the first electronic element.Type: GrantFiled: October 25, 2019Date of Patent: February 16, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kyung-Hwan Ko, Jin-Hyun Kim, Byung-Kuk Kang, Jung-Hyun Cho, Chi-Won Hwang