Patents by Inventor Kyung Hwan Ko

Kyung Hwan Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11962764
    Abstract: Disclosed are an inter-prediction method and an image decoding apparatus using the same. According to an embodiment of the present invention, there is provided an inter-prediction method including extracting a merge candidate flag and offset information from a bitstream, selecting a merge candidate corresponding to the extracted merge candidate flag from a merge candidate list including neighboring blocks of a current block as merge candidates, deciding a motion vector of the current block by applying the offset information to a motion vector of the selected merge candidate, and generating, as a prediction block of the current block, a block indicated by the motion vector of the current block in a reference picture referenced by the selected merge candidate.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: April 16, 2024
    Assignee: SK TELECOM CO., LTD.
    Inventors: Tae Young Na, Sun Young Lee, Kyung Hwan Ko, Se Hoon Son, Jae Il Kim
  • Patent number: 11956427
    Abstract: A method is disclosed for reconstructing a current block in units of sub-blocks included in the current block. The method includes: decoding transform coefficients in a transform block of the current block, sub-block information indicating a division form of the sub-blocks and transform type information indicating a transform type applied to the transform block from a bitstream; deriving a residual block of the current block from the transform coefficients on the basis of the transform type indicated by the transform type information and the sub-block information; and filtering boundaries of the sub-blocks in a reconstructed block of the current block derived on the basis of the residual block.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: April 9, 2024
    Assignee: SK TELECOM CO., LTD.
    Inventors: Tae Young Na, Sun Young Lee, Kyung Hwan Ko, Se Hoon Son, Jae Il Kim
  • Publication number: 20230262213
    Abstract: Disclosed are an inter-prediction method and an image decoding apparatus using the same. According to an embodiment of the present invention, there is provided an inter-prediction method including extracting a merge candidate flag and offset information from a bitstream, selecting a merge candidate corresponding to the extracted merge candidate flag from a merge candidate list including neighboring blocks of a current block as merge candidates, deciding a motion vector of the current block by applying the offset information to a motion vector of the selected merge candidate, and generating, as a prediction block of the current block, a block indicated by the motion vector of the current block in a reference picture referenced by the selected merge candidate.
    Type: Application
    Filed: April 26, 2023
    Publication date: August 17, 2023
    Inventors: Tae Young NA, Sun Young LEE, Kyung Hwan KO, Se Hoon SON, Jae Il KIM
  • Patent number: 11671584
    Abstract: Disclosed are an inter-prediction method and an image decoding apparatus using the same. According to an embodiment of the present invention, there is provided an inter-prediction method including extracting a merge candidate flag and offset information from a bitstream, selecting a merge candidate corresponding to the extracted merge candidate flag from a merge candidate list including neighboring blocks of a current block as merge candidates, deciding a motion vector of the current block by applying the offset information to a motion vector of the selected merge candidate, and generating, as a prediction block of the current block, a block indicated by the motion vector of the current block in a reference picture referenced by the selected merge candidate.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: June 6, 2023
    Assignee: SK TELECOM CO., LTD.
    Inventors: Tae Young Na, Sun Young Lee, Kyung Hwan Ko, Se Hoon Son, Jae Il Kim
  • Publication number: 20220368899
    Abstract: A method for partitioning a picture is disclosed. The method includes: decoding, from a bitstream, a split flag indicating whether the picture is partitioned into one or more sub-units; decoding, from the bitstream, partition information when the split flag indicates partitioning; and partitioning the picture into the sub-units based on the partition information.
    Type: Application
    Filed: October 6, 2020
    Publication date: November 17, 2022
    Inventors: Jae Il KIM, Sun Young LEE, Se Hoon SON, Kyung Hwan KO, A Ram BAEK
  • Publication number: 20220353516
    Abstract: A video decoding apparatus and a method for adaptively setting a resolution are disclosed. According to one embodiment of the present invention, a method for adaptively setting a resolution on a per-picture basis comprises the steps of: decoding maximum resolution information from a bitstream; decoding, from the bitstream, resolution information about a current picture; and setting the resolution of the current picture on the basis of the maximum resolution information or the resolution information, wherein the resolution information has a size less than or equal to that of the maximum resolution information.
    Type: Application
    Filed: June 26, 2020
    Publication date: November 3, 2022
    Inventors: Jae Il KIM, Sun Young LEE, Kyung Hwan KO, A Ram BAEK, Se Hoon SON, Jae Seob SHIN, Tae Young NA
  • Patent number: 11439021
    Abstract: An electronic component-embedded substrate includes a first core layer having a first through-hole, a first passive component disposed in the first through-hole, a second core layer disposed on the first core layer and having a second through-hole, a second passive component disposed in the second through-hole, an insulating material covering at least a portion of each of the first passive component and the second passive component and disposed in at least a portion of each of the first through-hole and the second through-hole, and a first wiring layer disposed on a level between the first passive component and the second passive component such that at least a portion of the first wiring layer is covered with the insulating material. The first passive component and the second passive component are connected to each other by the first wiring layer.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: September 6, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Koo Woong Jeong, Kyung Hwan Ko, Jung Hyun Cho, Chang Soo Woo, Soon Cheol Jung
  • Publication number: 20220272390
    Abstract: There is provided a video signal decoding method. The method comprises decoding block division information of a current block, dividing the current block into a plurality of sub blocks based on the block division information, and decoding the sub blocks.
    Type: Application
    Filed: April 8, 2022
    Publication date: August 25, 2022
    Applicant: INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNIVERSITY
    Inventors: Yung Lyul LEE, Nam Uk KIM, Kyung Hwan KO, Young Hwan YOO
  • Publication number: 20220224885
    Abstract: A method and apparatus for deriving an intra-prediction mode are disclosed. At least one embodiment of the present disclosure provides a method of deriving an intra-prediction mode, including (i) obtaining, based on reference line information indicating any one of a plurality of reference lines, most probable mode (MPM) information indicating whether an intra-prediction mode of a current block is included in an MPM list lacking a planar mode, (ii) determining, based on the reference line information and the MPM information, planar information indicating whether the intra-prediction mode of the current block is the planar mode, and (iii) deriving the intra-prediction mode of the current block by using the planar information.
    Type: Application
    Filed: May 27, 2020
    Publication date: July 14, 2022
    Inventors: Jae Il KIM, Sun Young LEE, Kyung Hwan KO
  • Publication number: 20220224884
    Abstract: A method of configuring candidate intra modes and a video decoding apparatus are disclosed. At least one embodiment of the present disclosure provides a method of configuring candidate intra modes for a chroma block, including determining whether a luma region corresponding to the chroma block has an encoding mode that is available for use, setting a direct mode (DM) among the candidate intra modes as a default mode when the encoding mode of the luma region is not available, and configuring the candidate intra modes by including the DM.
    Type: Application
    Filed: May 27, 2020
    Publication date: July 14, 2022
    Inventors: Jae Il KIM, Sun Young LEE, Kyung Hwan KO
  • Publication number: 20220182604
    Abstract: A video decoding method is disclosed for predicting a picture, which is split into equal-sized coding tree blocks, in units of blocks. The method includes: reconstructing a block vector for a current coding block in a current coding tree block to be decoded, by decoding block vector information from a bitstream, wherein the current coding block is one of blocks split from the current coding tree block in a tree structure; and setting, as a prediction block of the current coding block, a reference block indicated by the block vector in the picture in which the current coding block is located.
    Type: Application
    Filed: March 16, 2020
    Publication date: June 9, 2022
    Inventors: Jae Il KIM, Sun Young LEE, Kyung Hwan KO, Jae Seob SHIN
  • Publication number: 20220166974
    Abstract: A method is disclosed for reconstructing a current block in units of sub-blocks included in the current block. The method includes: decoding transform coefficients in a transform block of the current block, sub-block information indicating a division form of the sub-blocks and transform type information indicating a transform type applied to the transform block from a bitstream; deriving a residual block of the current block from the transform coefficients on the basis of the transform type indicated by the transform type information and the sub-block information; and filtering boundaries of the sub-blocks in a reconstructed block of the current block derived on the basis of the residual block.
    Type: Application
    Filed: March 20, 2020
    Publication date: May 26, 2022
    Inventors: Tae Young NA, Sun Young LEE, Kyung Hwan KO, Se Hoon SON, Jae Il KIM
  • Publication number: 20220007511
    Abstract: An electronic component-embedded substrate includes a first core layer having a first through-hole, a first passive component disposed in the first through-hole, a second core layer disposed on the first core layer and having a second through-hole, a second passive component disposed in the second through-hole, an insulating material covering at least a portion of each of the first passive component and the second passive component and disposed in at least a portion of each of the first through-hole and the second through-hole, and a first wiring layer disposed on a level between the first passive component and the second passive component such that at least a portion of the first wiring layer is covered with the insulating material. The first passive component and the second passive component are connected to each other by the first wiring layer.
    Type: Application
    Filed: November 11, 2020
    Publication date: January 6, 2022
    Inventors: Koo Woong Jeong, Kyung Hwan Ko, Jung Hyun Cho, Chang Soo Woo, Soon Cheol Jung
  • Patent number: 11178761
    Abstract: A printed circuit board includes a printed circuit board includes a substrate portion having a recess portion and including a first circuit layer, abridge disposed in the recess portion and including an insulating layer and a bridge circuit layer, an insulating material disposed in at least a portion of the recess portion and covering at least a portion of the bridge, a second circuit layer disposed on the insulating material, and a first via penetrating through the insulating material and a portion of the bridge and connecting the second circuit layer and the bridge circuit layer to each other.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: November 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Hyun Cho, Kyung Hwan Ko, Chi Won Hwang
  • Patent number: 11129280
    Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Kwan Lee, Kyung Hwan Ko, Kyoung Jun Kim, Yong Hoon Kim, Seung Eun Lee, Hak Chun Kim
  • Publication number: 20210274164
    Abstract: Disclosed are an inter-prediction method and an image decoding apparatus using the same. According to an embodiment of the present invention, there is provided an inter-prediction method including extracting a merge candidate flag and offset information from a bitstream, selecting a merge candidate corresponding to the extracted merge candidate flag from a merge candidate list including neighboring blocks of a current block as merge candidates, deciding a motion vector of the current block by applying the offset information to a motion vector of the selected merge candidate, and generating, as a prediction block of the current block, a block indicated by the motion vector of the current block in a reference picture referenced by the selected merge candidate.
    Type: Application
    Filed: May 14, 2021
    Publication date: September 2, 2021
    Inventors: Tae Young NA, Sun Young LEE, Kyung Hwan KO, Se Hoon SON, Jae Il KIM
  • Publication number: 20210195750
    Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.
    Type: Application
    Filed: March 2, 2020
    Publication date: June 24, 2021
    Inventors: Young Kwan Lee, Kyung Hwan Ko, Kyoung Jun Kim, Yong Hoon Kim, Seung Eun Lee, Hak Chun Kim
  • Patent number: 10998247
    Abstract: A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 4, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Hyun Cho, Young Sik Hur, Won Wook So, Kyung Hwan Ko, Yong Ho Baek, Yong Duk Lee
  • Publication number: 20210058646
    Abstract: According to the present invention, there is provided a video signal processing method of dividing an input image on a per-block basis for encoding, the method including: determining, at a division determination step, whether to divide a current block; dividing, at a block division step, the current block into multiple sub blocks on the basis of the determination; generating block division information on division of the current block; and encoding, at an encoding step, the block division information, the current block, or the sub blocks. Examples of division of the block according to the present invention include division using N-ary tree structures, such as the quad tree structure, the binary tree structure, and/or the triple tree structure.
    Type: Application
    Filed: October 15, 2020
    Publication date: February 25, 2021
    Applicant: INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNIVERSITY
    Inventors: Yung Lyul LEE, Nam Uk KIM, Kyung Hwan KO, Young Hwan YOO
  • Patent number: 10925161
    Abstract: A printed circuit board includes: an insulation material including a cavity formed therein; a first electronic element disposed in the cavity and including a groove; and a second electronic element disposed in the groove of the first electronic element.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: February 16, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung-Hwan Ko, Jin-Hyun Kim, Byung-Kuk Kang, Jung-Hyun Cho, Chi-Won Hwang