Abstract: An electronic component embedded substrate includes a first electronic component; a first insulating material covering at least a portion of the first electronic component; a first wiring layer disposed on one surface of the first insulating material; a second electronic component disposed on the first wiring layer and connected to the first electronic component by the first wiring layer; and a second insulating material covering at least a portion of the second electronic component, wherein the at least a portion of the first electronic component is exposed from the other surface of the first insulating material, opposite to the one surface of the first insulating material.

Abstract: A printed circuit board includes: an insulation material including a cavity formed therein; a first electronic element disposed in the cavity and including a groove; and a second electronic element disposed in the groove of the first electronic element.

Abstract: A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.

Abstract: According to the present invention, there is provided a video signal processing method of dividing an input image on a per-block basis for encoding, the method including: determining, at a division determination step, whether to divide a current block; dividing, at a block division step, the current block into multiple sub blocks on the basis of the determination; generating block division information on division of the current block; and encoding, at an encoding step, the block division information, the current block, or the sub blocks. Examples of division of the block according to the present invention include division using N-ary tree structures, such as the quad tree structure, the binary tree structure, and/or the triple tree structure.

Abstract: A printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.

Abstract: A printed circuit board includes: a core board including, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; and a second penetration via disposed in the core board and connected to the first penetration via.

Abstract: A printed circuit board and a method of manufacturing the same is described herein. The printed circuit board includes a first insulating layer having a first circuit embedded in a first surface thereof, a second insulating layer disposed on a second surface of the first insulating layer, the second insulating layer having a cavity therein, an electronic component mounted inside the cavity with an adhesion member, and a third insulating layer disposed on the second insulating layer to embed the electronic component.

Abstract: A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered substrate including an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate, a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer, a first electronic component inserted in the cavity, and a bump pad disposed on a surface of the cavity facing the first electronic component, and the bump pad is formed by having the insulation layer and the via exposed to a lateral side of the cavity.

Abstract: A printed circuit board includes: an insulating layer including a cavity formed therein, the cavity being recessed into the insulating layer from a top surface of the insulating layer; a first circuit layer formed inside the insulating layer such that a portion of the first circuit layer is disposed within the cavity; a second circuit layer disposed above the insulating layer; a first surface-treated layer disposed above the portion of the first circuit layer disposed within the cavity; and a second surface-treated layer disposed above the second circuit layer.

Abstract: A printed circuit board and a method of manufacturing the same is described herein. The printed circuit board includes a first insulating layer having a first circuit embedded in a first surface thereof, a second insulating layer disposed on a second surface of the first insulating layer, the second insulating layer having a cavity therein, an electronic component mounted inside the cavity with an adhesion member, and a third insulating layer disposed on the second insulating layer to embed the electronic component.

Abstract: A printed circuit board includes: a first insulating layer; a first circuit layer disposed above the first insulating layer; a second insulating layer disposed above the first insulating layer; a second circuit layer disposed above the second insulating layer and constructed of a photosensitive material; and a protective layer disposed above the second insulating layer and surrounding the second circuit layer, wherein the protective layer includes a tunnel type cavity and exposes a portion of the second circuit layer to an outside environment, and wherein the second insulating layer exposes a portion of the first circuit layer located below the cavity to an outside environment.

Abstract: A printed circuit board includes: an insulating layer including a cavity formed therein, the cavity being recessed into the insulating layer from a top surface of the insulating layer; a first circuit layer formed inside the insulating layer such that a portion of the first circuit layer is disposed within the cavity; a second circuit layer disposed above the insulating layer; a first surface-treated layer disposed above the portion of the first circuit layer disposed within the cavity; and a second surface-treated layer disposed above the second circuit layer.

Abstract: A printed circuit board and method of manufacturing the same are provided. The printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.

Abstract: A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered substrate including an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate, a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer, a first electronic component inserted in the cavity, and a bump pad disposed on a surface of the cavity facing the first electronic component, and the bump pad is formed by having the insulation layer and the via exposed to a lateral side of the cavity.

Abstract: A printed circuit board includes: a core board including, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; and a second penetration via disposed in the core board and connected to the first penetration via.

Abstract: An embedded board and a method of manufacturing the same are provided. The embedded board includes a core substrate below which a mounting pad is formed, a first substrate formed below the core substrate and having a first cavity formed therein, and a second substrate formed below the first substrate and having a second cavity formed therein. The first cavity and the second cavity are connected to each other and externally expose the mounting pad.

Abstract: Embodiments of the invention provide an embedded coreless substrate, and a method for manufacturing the same. According to an embodiment of the present invention, an embedded coreless substrate includes an insulating layer, a conductive pattern including a plurality of circuit pattern layers formed in(on) the insulating layer and a plurality of vias for vertically connecting the circuit pattern layers, and at least one embedded device, which is partially embedded in the insulating layer and an outer circuit pattern layer among the plurality of circuit pattern layers and of which an electrode in an embedded portion is partially or entirely covered with the outer circuit pattern layer to fix the embedded portion, is provided. Further, a method for manufacturing an embedded coreless substrate is provided.

Abstract: A solder ball has a core, an intermediate layer, and a surface layer. In one aspect, the intermediate layer melts at a temperature higher than that of the surface layer. In another aspect, the core is made of a material that maintains a liquid state through a temperature range of from about 20° C. to about 110° C., the intermediate layer is made of a material that maintains a solid state at temperatures up to about 270° C., and the surface layer is made of a material with a melting temperature of about 230° C. to about 270° C. In another aspect, the first metal and the second metal are materials that do not form an intermetallic compound with another material in the solder ball. The solder ball may be used in a circuit board.

Abstract: Disclosed herein is a carrier for manufacturing a printed circuit board, including: an insulating layer; a release layer buried in at least any one of top and bottom surfaces of the insulating layer and having a length shorter than that of the insulating layer; and a metal foil bonded to a surface of the insulating layer in which the release layer is buried and having a length longer than that of the release layer, thereby increasing reliability of a product in the manufacturing the substrate using the carrier.

Abstract: In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.