Patents by Inventor Kyung Moo AN
Kyung Moo AN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11420924Abstract: Provided is a method for purifying organic acids, including: a first extraction which includes separating an aqueous solution of organic acids into a first organic layer and a first aqueous solution layer by adding a solvent containing an amine and an alcohol; removing the alcohol from the separated first organic layer; and a second extraction which includes separating the first organic layer from which the alcohol has been removed into a second organic layer and a second aqueous solution layer by adding water.Type: GrantFiled: October 4, 2019Date of Patent: August 23, 2022Assignee: LG Chem, Ltd.Inventors: Hyun Nam, Kyung Moo Lee, Yukyung Lim
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Patent number: 11370730Abstract: The present specification provides a method for preparing 1,3-butadiene, the method comprising: (A) obtaining a first product comprising a light component, 1,3-butadiene, and a heavy component from a reactant comprising butene; (B) separating the heavy component from a second product comprising the 1,3-butadiene and the light component by condensing the heavy component after heat exchanging the first product; and (C) separating concentrated heavy component by reboiling the condensed heavy component.Type: GrantFiled: February 1, 2019Date of Patent: June 28, 2022Assignee: LG CHEM, LTD.Inventors: Hyunseok Nam, Jun Han Kang, Kyong Yong Cha, Jaewon Jeong, Dong Hyun Ko, Jun Kyu Han, Sang Jin Han, Kyung Moo Lee, Joohyuck Lee, Daeheung Choi, Myungji Suh, Ye Seul Hwang, Sunhwan Hwang, Seongmin Kim
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Publication number: 20220143088Abstract: The present invention relates to cytokine-based immune cells and an immunotherapeutic use thereof, and an immune cell according to an aspect is designed in such a form that a cytokine is linked to the surface of the cell via a linker, and thus the cytokine continuously stimulates the immune cell, thereby inducing proliferation and activation, and the cytokine does not affect surrounding cells, whereby side effects can be minimized.Type: ApplicationFiled: March 13, 2020Publication date: May 12, 2022Applicant: DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Min Seok KIM, Kyung Moo YEA, Hyun Young SHIN
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Publication number: 20210363092Abstract: Provided is a method for purifying organic acids, comprising: a first extraction, comprising separating an aqueous solution of organic acids into a first organic layer and a first aqueous solution layer by adding a solvent containing an amine and an alcohol; removing the alcohol from the separated first organic layer; and a second extraction, comprising separating the first organic layer from which the alcohol has been removed into a second organic layer and a second aqueous solution layer by adding water.Type: ApplicationFiled: October 4, 2019Publication date: November 25, 2021Inventors: Hyun NAM, Kyung Moo LEE, Yukyung LIM
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Patent number: 11179749Abstract: An interposer includes: a circuit board stack in which circuit boards are stacked; and an outer board arranged on at least one of outer side surfaces of the circuit board stack. The circuit boards are arranged include first conductive lines having first ends exposed through a first side portion of the circuit boards and second ends exposed through a second side portion opposite the first side portion of the circuit boards. The outer board includes second conductive lines having first ends exposed through a different side from the first side portion of the circuit boards and second ends exposed through a side portion located on a same side as the second side portion of the circuit boards.Type: GrantFiled: July 18, 2018Date of Patent: November 23, 2021Assignees: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung-moo Choi, Dong Won Shin
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Patent number: 11168785Abstract: A hydraulic pressure control method for a transmission includes determining whether a current shift range is among a plurality of shift ranges, setting a dither frequency of a pressure control solenoid valve of a hydraulic circuit for the transmission to a predetermined first frequency when the current shift range is a predetermined first range, and setting the dither frequency of the pressure control solenoid valve to a predetermined second frequency when the current shift range is a shift range other than the first range.Type: GrantFiled: September 30, 2020Date of Patent: November 9, 2021Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Bong Uk Bae, Sung Sik Choi, Kyung Moo Lee, Ki Bum Kim, Seong Min Son, Seul Chan Park, Se Hwan Jo, Min Jae Chai
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Patent number: 11084771Abstract: The present invention relates to a method for purifying phenol, which comprises: contacting a phenol stream comprising hydroxyacetone, 2-methylbenzofuran, 3-methylbenzofuran and phenol with an acyl chloride in the presence of an organic sulfonic acid to convert one or more selected from the group consisting of hydroxyacetone, 2-methylbenzofuran and 3-methylbenzofuran into a high boiling point compound having a boiling point higher than that of the phenol; and recovering the high boiling point compound from the phenol stream.Type: GrantFiled: January 11, 2018Date of Patent: August 10, 2021Assignee: LG CHEM, LTD.Inventors: Hyun Nam, Young Ho Lee, Ki Yong Yoon, Jun Hyuk Lim, Kyung Moo Lee
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Publication number: 20210206821Abstract: The present invention relates to a cytokine fusion polypeptide or a cytokine library comprising the same, and according to the cytokine fusion polypeptide or a cytokine library comprising the same according to an aspect, it enables continuous stimulation by a cytokine to a target cell and thus can easily and accurately evaluate the functionality of cytokines at the single cell level.Type: ApplicationFiled: June 24, 2019Publication date: July 8, 2021Inventors: Kyung Moo YEA, Min Seok KIM
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Publication number: 20210198170Abstract: The present invention relates to a method for purifying phenol, which comprises: contacting a phenol stream comprising hydroxy acetone, 2-methylbenzofuran, 3-methylbenzofuran and phenol with an acyl chloride in the presence of an organic sulfonic acid to convert one or more selected from the group consisting of hydroxyacetone, 2-methylbenzofuran and 3-methylbenzofuran into a high boiling point compound having a boiling point higher than that of the phenol; and recovering the high boiling point compound from the phenol stream.Type: ApplicationFiled: January 11, 2018Publication date: July 1, 2021Inventors: Hyun NAM, Young Ho LEE, Ki Yong YOON, Jun Hyuk LIM, Kyung Moo LEE
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Publication number: 20210163378Abstract: The present specification provides a method for preparing 1,3-butadiene, the method comprising: (A) obtaining a first product comprising a light component, 1,3-butadiene, and a heavy component from a reactant comprising butene; (B) separating the heavy component from a second product comprising the 1,3-butadiene and the light component by condensing the heavy component after heat exchanging the first product; and (C) separating concentrated heavy component by reboiling the condensed heavy component.Type: ApplicationFiled: February 1, 2019Publication date: June 3, 2021Inventors: Hyunseok NAM, Jun Han KANG, Kyong Yong CHA, Jaewon JEONG, Dong Hyun KO, Jun Kyu HAN, Sang Jin HAN, Kyung Moo LEE, Joohyuck LEE, Daeheung CHOI, Myungji SUH, Ye Seul HWANG, Sunhwan HWANG, Seongmin KIM
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Patent number: 10934431Abstract: Disclosed is a polycarbonate resin composition including (1) a polyester compound having a structure of chemical formula 1 as defined herein or a phenyl-arylene ether sulfone compound having a structure of chemical formula 2 as defined herein; (2) a polycarbonate block copolymer; and (3) a thermoplastic aromatic polycarbonate resin or a polysiloxane-polycarbonate resin; and a molded product including the same. The polycarbonate resin composition exhibits remarkably excellent heat resistance compared to existing high heat resistance polycarbonate resins, and has an excellent balance of physical properties such as fluidity.Type: GrantFiled: November 10, 2017Date of Patent: March 2, 2021Assignee: SAMYANG CORPORATIONInventors: Seung Pil Jung, Jung Up Park, Jin Sik Choi, Seong Hyen Heo, Kyung Moo Shin
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Patent number: 10927223Abstract: The present disclosure relates to a preparation method of super absorbent polymer granules and super absorbent polymer granules prepared according to the same. More specifically, the preparation method of the present disclosure includes the steps of: forming a hydrogel polymer by carrying out a thermal polymerization or a photopolymerization of a monomer composition including a water-soluble ethylene-based unsaturated monomer and a polymerization initiator; drying and pulverizing the hydrogel polymer; classifying the pulverized polymer into a first fine powder having a particle size of 150 ?m or less, and a base resin having a particle size of 150 ?m or more and 850 ?m or less; surface-crosslinking the base resin; classifying the surface crosslinked base resin to separate a second fine powder having a particle size of 150 ?m or less; and forming fine powder granules by mixing the first fine powder, the second fine powder, and silica in a wet state.Type: GrantFiled: March 6, 2020Date of Patent: February 23, 2021Inventors: Dae Woo Nam, Kyung Moo Lee, Jae Hong Lee, Chang Sun Han
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Publication number: 20200291162Abstract: The present invention relates to a thermoplastic copolymer resin having excellent heat resistance and transparency and a process for producing the same. More specifically, the present invention relates to a thermoplastic copolymer resin which is obtained by copolymerizing an ester oligomer having a specific structure with a polycarbonate oligomer, exhibits remarkably excellent heat resistance, and has excellent physical property balance such as transparency, impact strength, fluidity, etc.; a method for producing the same; and a molded article comprising the same.Type: ApplicationFiled: January 19, 2017Publication date: September 17, 2020Applicant: SAMYANG CORPORATIONInventors: Kyung Moo SHIN, Jin Sik CHOI, Young Do KWON
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Publication number: 20200207929Abstract: The present disclosure relates to a preparation method of super absorbent polymer granules and super absorbent polymer granules prepared according to the same. More specifically, the preparation method of the present disclosure includes the steps of: forming a hydrogel polymer by carrying out a thermal polymerization or a photopolymerization of a monomer composition including a water-soluble ethylene-based unsaturated monomer and a polymerization initiator; drying and pulverizing the hydrogel polymer; classifying the pulverized polymer into a first fine powder having a particle size of 150 ?m or less, and a base resin having a particle size of 150 ?m or more and 850 ?m or less; surface-crosslinking the base resin; classifying the surface crosslinked base resin to separate a second fine powder having a particle size of 150 ?m or less; and forming fine powder granules by mixing the first fine powder, the second fine powder, and silica in a wet state.Type: ApplicationFiled: March 6, 2020Publication date: July 2, 2020Applicant: LG Chem, Ltd.Inventors: Dae Woo Nam, Kyung Moo Lee, Jae Hong Lee, Chang Sun Han
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Patent number: 10696796Abstract: The present invention relates to a polysiloxane-polycarbonate copolymer having improved transparency and flame retardancy, and a method for producing the same. More specifically, the present invention relates to a polysiloxane having a specific structure having a side chain containing a randomly substituted hydroxyphenyl group, a polysiloxane-polycarbonate copolymer having the polysiloxane and a polycarbonate block as repeating units, exhibiting excellent flame retardancy and also excellent transparency, and a method for producing the same.Type: GrantFiled: October 14, 2016Date of Patent: June 30, 2020Assignees: SAMYANG CORPORATION, DAMIPOLYCHEM CO., LTD.Inventors: Kyung Moo Shin, Young Do Kwon
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Patent number: 10662296Abstract: The present disclosure relates to a preparation method of super absorbent polymer granules and super absorbent polymer granules prepared according to the same. More specifically, the preparation method of the present disclosure includes the steps of: forming a hydrogel polymer by carrying out a thermal polymerization or a photopolymerization of a monomer composition including a water-soluble ethylene-based unsaturated monomer and a polymerization initiator; drying and pulverizing the hydrogel polymer; classifying the pulverized polymer into a first fine powder having a particle size of 150 ?m or less, and a base resin having a particle size of 150 ?m or more and 850 ?m or less; surface-crosslinking the base resin; classifying the surface crosslinked base resin to separate a second fine powder having a particle size of 150 ?m or less; and forming fine powder granules by mixing the first fine powder, the second fine powder, and silica in a wet state.Type: GrantFiled: September 27, 2016Date of Patent: May 26, 2020Assignee: LG Chem, Ltd.Inventors: Dae Woo Nam, Kyung Moo Lee, Jae Hong Lee, Chang Sun Han
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Publication number: 20200087509Abstract: The present invention relates to a polycarbonate resin composition having excellent heat resistance and fluidity, and a molded product including the same. More specifically, the present invention relates to a polycarbonate resin composition, and a molded product including the same, wherein the polycarbonate resin composition, by including a polycarbonate copolymer together with a compound having a specific structure and a specific resin, exhibits remarkably excellent heat resistance compared to existing high heat resistance polycarbonate resins, and has an excellent balance of physical properties such as fluidity.Type: ApplicationFiled: November 10, 2017Publication date: March 19, 2020Applicant: SAMYANG CORPORATIONInventors: Seung Pil JUNG, Jung Up PARK, Jin Sik CHOI, Seong Hyen HEO, Kyung Moo SHIN
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Patent number: 10215817Abstract: An RF coil has an improved structure to prevent an excessive heat from being transferred to an object, and a magnetic resonance imaging apparatus includes the same. The MRI apparatus includes an RF coil configured to receive an RF signal, wherein the RF coil may include a first cover configured to allow thermal insulation material to be injected into the inside thereof, a second cover configured to allow thermal insulation material to be injected into the inside thereof and detachably coupled to the first cover to form an inner space with the first cover, and at least one circuit board disposed in the inner space and on which a circuit element configured to receive the RF signal is mounted.Type: GrantFiled: February 12, 2016Date of Patent: February 26, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung Moo Choi, Hae-Gweon Park, Ju Hyung Lee
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Publication number: 20190022701Abstract: An interposer includes: a circuit board stack in which circuit boards are stacked; and an outer board arranged on at least one of outer side surfaces of the circuit board stack. The circuit boards are arranged include first conductive lines having first ends exposed through a first side portion of the circuit boards and second ends exposed through a second side portion opposite the first side portion of the circuit boards. The outer board includes second conductive lines having first ends exposed through a different side from the first side portion of the circuit boards and second ends exposed through a side portion located on a same side as the second side portion of the circuit boards.Type: ApplicationFiled: July 18, 2018Publication date: January 24, 2019Applicants: SAMSUNG ELECTRONICS CO., LTD., Dong Won SHINInventors: Kyung-moo CHOI, Dong Won SHIN
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Publication number: 20190027675Abstract: The method of bonding an interposer and an integrated circuit chip includes preparing an interposer including an insulator and conductive lines each having one end exposed to a first surface of the insulator and another end exposed to a second surface opposite to the first surface; placing a bonding mask on the interposer; forming through-holes on the bonding mask before or after the placing of the bonding mask on the interposer; filling the plurality with a conductive material; and bonding an integrated circuit chip to the bonding mask.Type: ApplicationFiled: July 18, 2018Publication date: January 24, 2019Applicants: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyung-moo Choi, Dong Won Shin