Patents by Inventor Lai Wang

Lai Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090201301
    Abstract: An integrated illumination apparatus includes a light injection portion having a first end for receiving light from a light source. The light injection portion includes material that supports propagation of said light along the length of the light injection portion. Turning microstructure is disposed on a first side of the light injection. The turning microstructure is configured to turn at least a substantial portion of light incident on the first side and to direct the portion of the light out a second opposite side of the light injection portion. A slit is disposed along the length of the light injection portion. The slit forms an optical interface on the second opposite side of the light injection portion that provides total internal reflection for light propagating along the length of the light injection portion to be guided therein. The optical interface further transmits light turned by said turning microstructure.
    Type: Application
    Filed: December 23, 2008
    Publication date: August 13, 2009
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Mark Mienko, Gang Xu, Ion Bita, Lai Wang, Russell W. Gruhlke
  • Publication number: 20090201565
    Abstract: Various embodiments of the present invention relate to enhancing the brightness of displays that employ illumination systems. In some embodiments, the illumination systems include light guides, diffractive microstructure, and light-turning features. The diffractive microstructure may be configured to receive ambient light at a first angle and produce diffracted light at a second angle greater than the first angle and greater than the critical angle for of light guide. The light is thereby guided within the light guide. The light-turning features may be configured to turn the light guided within the light guide out of a light guide and onto, for example, a spatial light modulator at near normal incidence.
    Type: Application
    Filed: February 11, 2009
    Publication date: August 13, 2009
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Ion Bita, Gang Xu, Marek Mienko, Lai Wang, Russell W. Gruhlke
  • Publication number: 20090147332
    Abstract: In various embodiments described herein, a display device includes a front illumination device that comprises a light guide disposed forward of an array of display elements, such as an array of interferometric modulators, to distribute light across the array of display elements. The light guide may include a turning film to deliver uniform illumination from a light source to the array of display elements. For many portable display applications, the light guide comprises the substrate used in fabricating the display elements. The display device may include additional films as well. The light guide, for example, may include a diffuser and/or an optical isolation layer to further enhance the optical characteristics of the display.
    Type: Application
    Filed: December 7, 2007
    Publication date: June 11, 2009
    Applicant: Quanlcomm Incorporated
    Inventors: Ion Bita, Gang Xu, Lai Wang, Marek Mienko, Russell Wayne Gruhlke
  • Publication number: 20090126792
    Abstract: In various embodiments described herein, a device comprising a light guiding layer optically coupled to a photocell is described. A plurality of surface features are formed on one the surface of the light guiding layer. The surface features can comprise facets that are angled with respect to each other. Light incident on the surface of the light guide is redirected by the surface features and guided through the light guide by multiple total internal reflections. The guided light is directed towards a photocell.
    Type: Application
    Filed: November 16, 2007
    Publication date: May 21, 2009
    Applicant: QUALCOMM Incorporated
    Inventors: Russell Wayne Gruhlke, Gang Xu, Marc Maurice Mignard, Ion Bita, Marek Mienko, Lai Wang, Jonathan Charles Griffiths, Manish Kothari, Kasra Khazeni
  • Publication number: 20080268478
    Abstract: The invention disclosed herein relates to the detection or diagnosis of atherosclerosis by measuring the level of the protein eotaxin in an individual's serum. The presence of eotaxin above levels specified herein is indicative that atherosclerosis may be present. Detection of elevated eotaxin levels in serum may provide a means to diagnose atherosclerosis prior to the onset of symptoms.
    Type: Application
    Filed: February 28, 2006
    Publication date: October 30, 2008
    Applicant: CEDARS-SINAI MEDICAL CENTER
    Inventors: Behrooz Sharifi, Prediman K. Shah, Lai Wang
  • Publication number: 20080159212
    Abstract: One embodiment of the communication system includes a switch, at least one base station, and a backhaul connection including at least one wireless link connecting the at least one base station to the switch. The wireless link may include at least one of a WiMax carrier and a WiFi carrier.
    Type: Application
    Filed: June 21, 2007
    Publication date: July 3, 2008
    Inventors: Ji Zheng Zhang, Xi Yin Liu, Kun Shi, Na Sun, Yan Lai Wang
  • Patent number: 7323775
    Abstract: A memory module comprises a base plate and one or more IC embedding seats formed thereon to provide IC memory chip being installed in detachable manner taking the advantage of easy installation, convenient maintenance or replacement of IC memory chip, particularly no longer using SMT, soldering paste, or flux for IC maintenance and replacement; the IC embedding seat comprises a mainbody and a sliding cover formed a cover to the mainbody with sliding movement to open or close the mainbody, and the mainbody has one or more IC mounting compartments has a plurality of conducting pin units arrayed in matrix arrangement to form electric connection with the base plate; during IC maintenance and replacement, the defective IC memory chip shall be freely removed from the memory module without de-soldering to prevent other good IC memory chip from damage due to high temperature.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: January 29, 2008
    Assignee: Lih Duo International Co., Ltd.
    Inventor: Sung-Lai Wang
  • Publication number: 20080015158
    Abstract: It is intended to provide methods for suppressing the huntingtin gene expression by using a double-stranded RNA (dsRNA), huntingtin gene expression inhibitors to suppress the huntingtin gene expression, and preventives and/or remedies of Huntington's disease. Targeting against a specific sequence of mRNA at immediately upstream of CAG repeats in HD genes of Huntington's disease, the huntingtin gene expression is suppressed by using a dsRNA homologous to the sequence. In this invention, a short siRNA (short double-stranded RNA) having bp as short as around 21-23 bp can be effectively used as the dsRNA homologous to a specific RNA sequence in a region at immediately upstream of CAG repeats. The dsRNA of this present invention can be used as a huntingtin gene expression inhibitor, or a preventive and/or a remedy of Huntington's disease by administering or introducing into a living body or a living cell in mammals for the prevention and/or treatment of Huntington's disease.
    Type: Application
    Filed: April 30, 2004
    Publication date: January 17, 2008
    Inventors: Kanazawa Ichiro, Liu Wanzhao, Yu-Lai Wang, Keiji Wada, Jun Goto, Miho Murata
  • Publication number: 20080012589
    Abstract: A wafer test card applicable for testing all the chips on a wafer in one time simultaneously comprising a base board carrying testing circuit thereon and an electric conductive spring-rubber assembly connected to the underside of the base board; the electric conductive spring-rubber assembly has an electric insulating soft rubber layer which has an electric conductive spring matrix formed by a group of electric conductive springs arranged in rows and columns to form an electric connection with the testing circuit of the base board, and the electric conductive spring matrix of the electric conductive spring-rubber assembly is functioned as a wafer test interface to the wafer test card; during wafer test the electric conductive spring matrix of the wafer test card shall keep correctly touching and pressing against the pads of chips on a wafer to obtain more stable and reliable test result.
    Type: Application
    Filed: February 5, 2007
    Publication date: January 17, 2008
    Applicants: Lih Duo International Co., Ltd.
    Inventor: Sung-Lai Wang
  • Publication number: 20080012595
    Abstract: A wafer test card for testing the electric property of the chips on a wafer comprising a base board and a group of electric conductive springs or electric conductive spring pins connected to the base board and functioned as a wafer test interface to the wafer test card, the base board has a testing circuit thereon which forms electric connection with the electric conductive springs or electric conductive spring pins; when carrying out wafer test, even if the elevation of the pad of each individual chip is different from each other, the electric conductive spring or electric conductive spring pin of the wafer test card shall still keep correctly touching the pad of chip to obtain better and more stable electric property test result, and avoid mistake in identifying the chip.
    Type: Application
    Filed: February 5, 2007
    Publication date: January 17, 2008
    Applicants: Lih Duo International Co., Ltd.
    Inventor: Sung-Lai Wang
  • Publication number: 20070181999
    Abstract: A memory module comprises a base plate disposed with a plurality of printed circuit sets and one or more IC embedding frames fixed on the base plate, particularly each IC embedding frame having a rubber spring connector stored inside which comprises an insulating flexible silicone rubber layer embedded with a conductive spring matrix composed of a group of conductive spring modules in longitudinal and latitudinal matrix arrangement and is through its conductive spring modules formed in electrical connection with a corresponding printed circuit set of the base plate; the memory module is to provide IC memory chip being installed in detachable manner taking the advantage of easy installation, convenient maintenance or replacement of IC memory chip without use of SMT, soldering paste or flux.
    Type: Application
    Filed: February 9, 2006
    Publication date: August 9, 2007
    Applicant: Lih Duo International Co., Ltd.
    Inventor: Sung-Lai Wang
  • Publication number: 20070161265
    Abstract: A rubber spring connector with characteristic of extended and repeated use in electrical connection with electric components has an insulating flexible silicone rubber layer which is embedded with a conductive spring matrix composed of a group of conductive spring modules in longitudinal and latitudinal matrix arrangement.
    Type: Application
    Filed: January 9, 2006
    Publication date: July 12, 2007
    Applicant: Lih Duo International Co., Ltd.
    Inventor: Sung-Lai Wang
  • Publication number: 20070159802
    Abstract: A VGA interface card comprises a base plate with a GPU and one or more IC embedding seats formed thereon to have IC memory chip being installed in detachable manner which provides the advantage of easy installation, convenient maintenance or replacement of IC memory chip, particularly no longer using SMT and soldering paste or flux for IC maintenance and replacement; the IC embedding seat used on the VGA interface card comprises a mainbody having one or more IC mounting compartments and a sliding cover formed a cover to the mainbody with sliding movement to open or close the mainbody, and each IC mounting compartment of the mainbody has a plurality of conducting pin units arrayed in matrix arrangement to form electric connection with the base plate; during IC maintenance and replacement, any defective IC memory chip shall be freely removed from the VGA interface card without de-soldering to prevent other good IC memory chip from damage due to high temperature.
    Type: Application
    Filed: January 9, 2006
    Publication date: July 12, 2007
    Applicant: Lih Duo International Co., Ltd.
    Inventor: Sung-Lai Wang
  • Patent number: 7232318
    Abstract: An IC embedding seat comprises a body and a sliding cover to form a sliding mechanism provided for IC with BGA package no longer using SMT, soldering paste, or flux for IC maintenance and replacement, the body has one or more IC containers each of which bottom has a conducting pin array formed by a plurality of conducting pin units with elasticity and conductivity arrayed in matrix arrangement, and the sliding cover is constructed a cover to the body with sliding movement to open or close the body, so that the IC is easily embedded into the IC container of the body to get a well electrical connection with the corresponding conducting pin units of the body after simply sliding the sliding cover to close the body, and without de-soldering process the embedded IC is freely removed from the IC container by sliding the sliding cover to open the body.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: June 19, 2007
    Assignee: Lih Duo International Co., Ltd.
    Inventor: Sung-Lai Wang
  • Publication number: 20070117425
    Abstract: An IC embedding seat comprises a body and a sliding cover to form a sliding mechanism provided for IC with BGA package no longer using SMT, soldering paste, or flux for IC maintenance and replacement, the body has one or more IC containers each of which bottom has a conducting pin array formed by a plurality of conducting pin units with elasticity and conductivity arrayed in matrix arrangement, and the sliding cover is constructed a cover to the body with sliding movement to open or close the body, so that the IC is easily embedded into the IC container of the body to get a well electrical connection with the corresponding conducting pin units of the body after simply sliding the sliding cover to close the body, and without de-soldering process the embedded IC is freely removed from the IC container by sliding the sliding cover to open the body.
    Type: Application
    Filed: November 22, 2005
    Publication date: May 24, 2007
    Applicant: Lih Duo International Co., Ltd.
    Inventor: Sung-Lai Wang
  • Publication number: 20070114660
    Abstract: A memory module comprises a base plate and one or more IC embedding seats formed thereon to provide IC memory chip being installed in detachable manner taking the advantage of easy installation, convenient maintenance or replacement of IC memory chip, particularly no longer using SMT, soldering paste, or flux for IC maintenance and replacement; the IC embedding seat comprises a mainbody and a sliding cover formed a cover to the mainbody with sliding movement to open or close the mainbody, and the mainbody has one or more IC mounting compartments has a plurality of conducting pin units arrayed in matrix arrangement to form electric connection with the base plate; during IC maintenance and replacement, the defective IC memory chip shall be freely removed from the memory module without de-soldering to prevent other good IC memory chip from damage due to high temperature.
    Type: Application
    Filed: November 22, 2005
    Publication date: May 24, 2007
    Applicant: Lih Duo International Co., Ltd.
    Inventor: Sung-Lai Wang
  • Patent number: 7079382
    Abstract: A mounting mechanism includes a computer chassis (90), a bracket (10) defining a pair of slideways (14, 16) in a sidewall (11) thereof for receiving corresponding sliding members (44) of a storage device (40), a power supply (80) rotatably attached in the computer chassis, and a hook (60, 60?) pivotally attached to the sidewall of the bracket. The hook is for retaining the sliding members of the storage device in the slideways of the bracket. The power supply is rotated to engage the bracket and the hook thereby securing the storage device in the bracket.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: July 18, 2006
    Assignee: HON HAI Precision Industry Co., Ltd.
    Inventors: Yun-Lung Chen, Ling-Lai Wang
  • Publication number: 20050185372
    Abstract: A mounting mechanism includes a computer chassis (90), a bracket (10) defining a pair of slideways (14, 16) in a sidewall (11) thereof for receiving corresponding sliding members (44) of a storage device (40), a power supply (80) rotatably attached in the computer chassis, and a hook (60, 60?) pivotally attached to the sidewall of the bracket. The hook is for retaining the sliding members of the storage device in the slideways of the bracket. The power supply is rotated to engage the bracket and the hook thereby securing the storage device in the bracket.
    Type: Application
    Filed: October 29, 2004
    Publication date: August 25, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Yun-Lung Chen, Ling-Lai Wang
  • Publication number: 20040162468
    Abstract: The present invention generally relates to an apparatus and method for obtaining absolute values of concentrations of chromophores of a medium and/or absolute values of their ratios. More particularly, the present invention relates to non-invasive optical systems and methods for determining absolute values of oxygenated and/or deoxygenated hemoglobins and their ratios in a physiological medium. The optical system typically includes (1) a body, (2) a source module supported by the body, optically coupling with the medium, and irradiating into the medium multiple sets of electromagnetic waves with different wave characteristics, (3) a detector module supported by the body, optically coupling with the medium, and detecting such electromagnetic waves, and (4) a processing module operatively coupling with the detector module, and determining the absolute values of the concentrations and the ratios thereof from multiple wave equations applied to the source and detector modules.
    Type: Application
    Filed: September 24, 2003
    Publication date: August 19, 2004
    Applicant: PHOTONIFY TECHNOLOGIES, INC.
    Inventors: Xuefeng Cheng, Xiaorong Xu, Shuoming Zhou, Lai Wang
  • Patent number: 6735458
    Abstract: The present invention generally relates to optical imaging systems and methods for providing images of two-dimensional and/or three-dimensional distribution of properties of chromophores in various physiological media. More particularly, the present invention relates to optical imaging systems, optical probes thereof, and methods therefor utilizing self-calibration of their output signals. A typical self-calibrating optical imaging system includes at least one wave source, at least one wave detector, a signal analyzer, a signal processor, and an image processor. The signal analyzer receives, from the wave detector, an output signal representative of the distribution of the chromophores or their properties in target areas of the medium. The signal analyzer analyzes amplitudes of the output signal and selects multiple points of the output signal having substantially similar amplitudes.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: May 11, 2004
    Assignee: Photonify Technologies, Inc.
    Inventors: Xuefeng Cheng, Xiaorong Xu, Shuoming Zhou, Lai Wang, Ming Wang, Feng Li, Guobao Hu