Abstract: An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis.

Abstract: An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis.

Abstract: Systems and methods for mechanically coupling multiple components using captured threaded connectors are provided. The attachment points between components are aligned along a common central axis about which the channels are aligned. Threaded connectors are provided and contained within a pocket within each component, prior to assembly of the system. As a result, components of the system can be detached without disassembly of other components, or without the use of special thread patterns to allow clearance for the driver for the head of each. Threaded connectors are kept from falling out and are also allowed to float along their axis within the channel so that components can be aligned first, and then anchored together. Drivers used to couple components have a diameter smaller than the channel.