Electronics enclosure

Description

FIG. 1 is a perspective view of our design;

FIG. 2 is a top plan view of the embodiment of FIG. 1;

FIG. 3 is a side elevational view of the embodiment of FIG. 1, the opposite side being a mirror image thereof;

FIG. 4 is a front elevational view of the embodiment of FIG. 1;

FIG. 5 is a back view of the embodiment of FIG. 1;

FIG. 6 is a perspective view of a second embodiment of our design;

FIG. 7 is a top plan view of the embodiment of FIG. 6;

FIG. 8 is a side elevational view of the embodiment of FIG. 6, the opposite side being a mirror image thereof;

FIG. 9 is a front view of the embodiment of FIG. 6;

FIG. 10 is a back view of the embodiment of FIG. 6;

FIG. 11 is a perspective view of a third embodiment of our design;

FIG. 12 is a top plan view of the embodiment of FIG. 11;

FIG. 13 is a side elevational view of the embodiment of FIG. 11, the opposite side being a mirror image thereof;

FIG. 14 is a front view of the embodiment of FIG. 11; and,

FIG. 15 is a back view of the embodiment of FIG. 11.

Broken lines shown in the drawings illustrate portions of the electronics enclosure, and form no part of the claimed design.

Claims

The ornamental design for an electronics enclosure, as shown and described.