Patents by Inventor Lakhi N. Goenka
Lakhi N. Goenka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6843111Abstract: An integrated LCC-based strain gage sensor, in which at least two LCC traces or strands run across a microcavity within the cylinder head gasket. In one aspect of the present invention, a system is provided comprising a signal source and a microcavity through which an input signal from the signal source passes and which alters the input signal as a result of a response of the microcavity to a strain. An LCC connects the microcavity and the signal source and an input signal propagates through the LCC. The microcavity may comprise one or more reflective surfaces which alters the input signal as a result of a change in a dimension of the microcavity. In another aspect of the invention, the microcavity produces an output signal that has an intensity or frequency different from that of the input signal upon undergoing a deformation.Type: GrantFiled: August 9, 2002Date of Patent: January 18, 2005Assignee: Visteon Global Technologies, Inc.Inventors: Bernard A. Meyer, Lakhi N. Goenka, Debojit Barua
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Patent number: 6814273Abstract: A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.Type: GrantFiled: September 12, 2002Date of Patent: November 9, 2004Assignee: Visteon Global Technologies, Inc.Inventors: Anne Marie Sullivan, Xu Song, Lakhi N. Goenka, Yutaka Kawase, Cuong-Van Pham, Bhavani Shankar Tata, Peter Joseph Sinkunas
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Patent number: 6810723Abstract: An integrated engine combustion monitoring system that includes at least one structure comprising a light communication channel (LCC) and a sensor, which are embedded in a cylinder head gasket, for monitoring combustion composition, pressure, or temperature. The sensor and the LCC may be positioned between an air cavity or a material comprising a photorefractive gel or polymer. The sensor includes a sensing component that may have various shapes or configurations. The LCC comprises one or more materials, such as a polymer, which may be formed into a strand or other structural shape and incorporated into the cylinder head gasket. The other end of the LCC may be fabricated as part of one or more engine structures or it may be connected to other structures or components such as optical detectors or associated process control electronics.Type: GrantFiled: August 28, 2002Date of Patent: November 2, 2004Assignee: Visteon Global Technologies, Inc.Inventors: Myron Lemecha, Jay Baker, Achyuta Achari, William D. Hopfe, Lakhi N. Goenka
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Publication number: 20040200878Abstract: A method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process is disclosed. The method comprises applying solder paste to the substrate and placing electronic components to the substrate to form a substrate assembly. The method further includes locating the substrate assembly on a pallet having a heat conductive layer for heat sinking means from the substrate. The method further includes rapid localized heating to a melting temperature sufficient to melt the solder paste using a supplemental heat source. While exposing the deposited solder paste to further rapid localized heating, the method further comprises cooling the pallet at the second surface to diffuse the heat from the substrate defining a temperature gradient across the substrate.Type: ApplicationFiled: April 10, 2003Publication date: October 14, 2004Applicant: Visteon Global Technologies, Inc.Inventor: Lakhi N. Goenka
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Patent number: 6792907Abstract: A continuously variable Helmholtz resonator for a vehicle air intake system having a vibratory input to the resonator wall to dynamically adjust the cancellation frequency for time-varying acoustical signals, and at least one of mean resonator volume control, mean resonator neck length control, and mean resonator neck diameter control whereby control of both the dynamic and the mean properties of the resonator provides a wide-tuning spectrum and facilitates canceling of time-varying acoustical signals.Type: GrantFiled: March 4, 2003Date of Patent: September 21, 2004Assignee: Visteon Global Technologies, Inc.Inventors: John D. Kostun, Lakhi N. Goenka, David J. Moenssen, Christopher E. Shaw
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Publication number: 20040173175Abstract: A continuously variable Helmholtz resonator for a vehicle air intake system having a vibratory input to the resonator wall to dynamically adjust the cancellation frequency for time-varying acoustical signals, and at least one of mean resonator volume control, mean resonator neck length control, and mean resonator neck diameter control whereby control of both the dynamic and the mean properties of the resonator provides a wide tuning spectrum and facilitates canceling of time-varying acoustical signals.Type: ApplicationFiled: March 4, 2003Publication date: September 9, 2004Inventors: John D. Kostun, Lakhi N. Goenka, David J. Moenssen, Christopher E. Shaw
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Publication number: 20040134975Abstract: The present invention involves a composite pallet for a substrate of a printed circuit board for a vector transient reflow process. The composite pallet includes a heat conductive layer for heat sinking means from the substrate and a heat insulative layer adjacent the conductive layer to shield the substrate from heat and to absorb heat from the heat conductive layer. The heat conductive layer has first and second opposite surfaces. The first surface is configured to receive the substrate disposed thereon to diffuse heat from the substrate during the vector transient reflow process. The heat insulative layer is disposed adjacent the second surface.Type: ApplicationFiled: January 10, 2003Publication date: July 15, 2004Applicant: Visteon Global Technologies, Inc.Inventors: Lakhi N. Goenka, Brenda J. Nation, Peter J. Sinkunas, Mark Tor
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Publication number: 20040108131Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.Type: ApplicationFiled: August 28, 2003Publication date: June 10, 2004Inventors: Achyuta Achari, Andrew Zachary Glovatsky, Robert Edward Belke, Brenda Joyce Nation, Delin Li, Lakhi N. Goenka, Mohan R. Paruchuri, Robert Joseph Gordon, Thomas Bernd Krautheim
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Publication number: 20040094607Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14 ) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).Type: ApplicationFiled: August 1, 2003Publication date: May 20, 2004Inventors: Lakhi N. Goenka, Charles Frederick Schweitzer, Lawrence Lernel Bullock, Mark D. Miller, Jay DeAvis Baker, Karen Lee Chiles, Achyuta Achari, Jason Bullock, Shona Bullock
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Patent number: 6729023Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.Type: GrantFiled: March 23, 2001Date of Patent: May 4, 2004Assignee: Visteon Global Technologies, Inc.Inventors: Achyuta Achari, Andrew Zachary Glovatsky, Robert Edward Belke, Brenda Joyce Nation, Delin Li, Lakhi N. Goenka, Mohan R. Paruchuri, Robert Joseph Gordon, Thomas Bernd Krautheim
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Publication number: 20040050910Abstract: A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.Type: ApplicationFiled: September 12, 2002Publication date: March 18, 2004Applicant: Visteon Global Technologies, Inc.Inventors: Anne Marie Sullivan, Lakhi N. Goenka, Xu Song, Yutaka Kawase, Cuong-Van Pham, Bhavani Shankar Tata, Peter Joseph Sinkunas
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Patent number: 6698390Abstract: A variable tuned telescoping resonator which militates against the emission of noise energy caused by intake air in a vehicle wherein the connector length and the volume of the resonator are varied as a function of engine speed simultaneously to provide attenuation of noise energy over a wide frequency range.Type: GrantFiled: January 24, 2003Date of Patent: March 2, 2004Assignee: Visteon Global Technologies, Inc.Inventors: John D. Kostun, David J. Moenssen, Lakhi N. Goenka, Christopher E. Shaw
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Patent number: 6691686Abstract: Intake manifolds for an internal combustion engine and methods of using the same are disclosed. The intake manifolds accommodate the introduction of exhaust gas that has been recirculated from the main exhaust gas stream. The exhaust gas can be introduced into the intake manifold through aerodynamically shaped members that are located inside the manifold. Alternatively, the exhaust gas can be introduced into the manifold at or near the intersection of the primary runners and the plena, or the exhaust gas can be introduced into a mixing chamber located between the primary runners and the plena.Type: GrantFiled: December 28, 2001Date of Patent: February 17, 2004Assignee: Visteon Global Technologies, Inc.Inventors: Jeffrey J. Klas, Lakhi N. Goenka, Mark D. Miller
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Patent number: 6688290Abstract: An integrated control and fuel delivery system having an intake manifold that receives a portion of an airflow and delivers air to an engine and a fuel spacer that receives the air from the intake manifold. The fuel spacer includes a wiring harness. A control module is disposed on the fuel spacer adjacent to the intake manifold of the engine.Type: GrantFiled: January 31, 2002Date of Patent: February 10, 2004Assignee: Visteon Global Technologies, Inc.Inventors: Jim Zehnal, Lakhi N. Goenka, Mark D. Miller, Andrew Z. Glovatsky, David J. Steinert, Harvinder Singh, Jeff J. Klas
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Patent number: 6673723Abstract: A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.Type: GrantFiled: March 22, 2001Date of Patent: January 6, 2004Inventors: Bharat Z. Patel, Jay D. Baker, Lakhi N. Goenka, Michael Allen Howey, Mohan R. Paruchuri, Richard Keith McMillan
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Patent number: 6642485Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder, and a pallet for supporting the substrate, wherein the supplemental heat source creates a stream of hot gas that flows transversely across the substrate.Type: GrantFiled: December 3, 2001Date of Patent: November 4, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Lakhi N. Goenka, Peter Joseph Sinkunas
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Patent number: 6639886Abstract: A apparatus and method for dissipating heat from the disk portion of a multimedia radio. The apparatus and method uses the Von Karman Viscous Pump Principle to strategically introduce holes in the housings and brackets of the multimedia radio to improve the air flow across at least one of the surfaces of an installed and operational disk. The amount, size, and configuration of these holes are a function of the type and size of disk used and the rotational speed of the disk in operation. This reduces the possibility of hot media and reduces the possibility of heat shutdown of disk components.Type: GrantFiled: July 14, 2000Date of Patent: October 28, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Robert D. Cook, George A. Garfinkel, Lakhi N. Goenka
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Patent number: 6620545Abstract: A device for producing an electro-motive force is disclosed. The device includes a cover for creating a liquid seal, an electrolyte contained within the cover for creating an ionic transfer path (medium), and an etched tri-metal board (substrate). The etched tri-metal board has a first conductive layer, a second conductive layer and a third conductive layer. The first, second and third conductive layers are selectively etched to form a cathode and an anode. The cover is sealed against the substrate and filled with an electrolyte to form an electrical device, such as a battery.Type: GrantFiled: January 5, 2001Date of Patent: September 16, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Lakhi N. Goenka, William F. Quilty, Jr., Mohan Paruchuri
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Patent number: 6613239Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.Type: GrantFiled: April 17, 2001Date of Patent: September 2, 2003Assignee: Visteon Global Tech., Inc.Inventors: Andrew Z. Glovatsky, Robert E. Belke, Delin Li, Lakhi N. Goenka, Mohan R. Paruchuri, Marc A. Straub, Richard K. McMillan, Ram S. Raghava, Thomas B. Krautheim, Michael A. Howey, Vivek A. Jairazbhoy
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Patent number: 6612025Abstract: A method for forming connections within a multi-layer electronic circuit board 10. The method includes forming an aperture within the circuit board and selectively coating the interior surface of the aperture with a polar solder mask material that is effective to bond with solder that is selectively inserted into the aperture, thereby retaining the solder within the aperture and improving the electrical connection provided by the solder.Type: GrantFiled: September 6, 2000Date of Patent: September 2, 2003Assignee: Visteon Global Tech., Inc.Inventors: Zhong-You (Joe) Shi, Lakhi N. Goenka, Andrew Z. Glevatsky