Patents by Inventor Lakhi N. Goenka

Lakhi N. Goenka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030140897
    Abstract: An integrated control and fuel delivery system having an intake manifold that receives a portion of an airflow and delivers air to an engine and a fuel spacer that receives the air from the intake manifold. The fuel spacer includes a wiring harness. A control module is disposed on the fuel spacer adjacent to the intake manifold of the engine.
    Type: Application
    Filed: January 31, 2002
    Publication date: July 31, 2003
    Inventors: Jim Zehnal, Lakhi N. Goenka, Mark D. Miller, Andrew Z. Glovatsky, David J. Steinert, Harvinder Singh, Jeff J. Klas
  • Publication number: 20030121508
    Abstract: Intake manifolds for an internal combustion engine and methods of using the same are disclosed. The intake manifolds accommodate the introduction of exhaust gas that has been recirculated from the main exhaust gas stream. The exhaust gas can be introduced into the intake manifold through aerodynamically shaped members that are located inside the manifold. Alternatively, the exhaust gas can be introduced into the manifold at or near the intersection of the primary runners and the plena, or the exhaust gas can be introduced into a mixing chamber located between the primary runners and the plena.
    Type: Application
    Filed: December 28, 2001
    Publication date: July 3, 2003
    Inventors: Jeffrey J. Klas, Lakhi N. Goenka, Mark D. Miller
  • Publication number: 20030102297
    Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder, and a pallet for supporting the substrate, wherein the supplemental heat source creates a stream of hot gas that flows transversely across the substrate.
    Type: Application
    Filed: December 3, 2001
    Publication date: June 5, 2003
    Inventors: Lakhi N. Goenka, Peter Joseph Sinkunas
  • Publication number: 20030095675
    Abstract: A voice-activated control system in which a voice command transmitted to an audio signal receiver such as a microphone is digitized by a voice recognition program that produces an address and a function corresponding to the component to which the voice command is directed. The digitized signal is converted by an IR transceiver or an encoder/decoder to an IR signal, which is transmitted via an LCC bus to one or more devices attached to it. The device that has the appropriate address is actuated to perform the function and/or provide feedback to the system. The invention also includes voice-activated systems that rely on a centralized control approach while a third type of system uses a hybrid system that uses both lcc-based and electrical-based input. The present invention is also directed to various methods of activating and controlling one or more components of a system through a voice-activated system.
    Type: Application
    Filed: October 15, 2002
    Publication date: May 22, 2003
    Inventors: C. Allen Marlow, Bernard A. Meyer, Lakhi N. Goenka, Harvinder Singh
  • Publication number: 20030074972
    Abstract: An integrated LCC-based strain gage sensor, in which at least two LCC traces or strands run across a microcavity within the cylinder head gasket. In one aspect of the present invention, a system is provided comprising a signal source and a microcavity through which an input signal from the signal source passes and which alters the input signal as a result of a response of the microcavity to a strain. An LCC connects the microcavity and the signal source and an input signal propagates through the LCC. The microcavity may comprise one or more reflective surfaces which alters the input signal as a result of a change in a dimension of the microcavity. In another aspect of the invention, the microcavity produces an output signal that has an intensity or frequency different from that of the input signal upon undergoing a deformation.
    Type: Application
    Filed: August 9, 2002
    Publication date: April 24, 2003
    Applicant: VISTEON GLOBAL TECHNOLOGIES, INC.
    Inventors: Bernard A. Meyer, Lakhi N. Goenka, Debojit Barua
  • Publication number: 20030074957
    Abstract: An integrated engine combustion monitoring system that includes at least one structure comprising a light communication channel (LCC) and a sensor, which are embedded in a cylinder head gasket, for monitoring combustion composition, pressure, or temperature. The sensor and the LCC may be positioned between an air cavity or a material comprising a photorefractive gel or polymer. The sensor includes a sensing component that may have various shapes or configurations. The LCC comprises one or more materials, such as a polymer, which may be formed into a strand or other structural shape and incorporated into the cylinder head gasket. The other end of the LCC may be fabricated as part of one or more engine structures or it may be connected to other structures or components such as optical detectors or associated process control electronics.
    Type: Application
    Filed: August 28, 2002
    Publication date: April 24, 2003
    Applicant: Visteon Global Technologies, Inc.
    Inventors: Myron Lemecha, Jay Baker, Achyuta Achari, William D. Hopfe, Lakhi N. Goenka
  • Patent number: 6473963
    Abstract: A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes is disclosed. The method includes forming channels in a first and second pre-circuit assembly and attaching the first pre-circuit assembly to the second pre-circuit assembly such that the channels cooperatively form a heat pipe.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: November 5, 2002
    Assignee: Visteon Global Tech., Inc.
    Inventors: Lakhi N. Goenka, Zhong-You Shi
  • Patent number: 6467161
    Abstract: A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: October 22, 2002
    Assignee: Visteon Global Tech., Inc.
    Inventors: Achyuta Achari, Brenda Joyce Nation, Delin Li, Lakhi N. Goenka, Richard Keith McMillan, Vivek A. Jairazbhoy
  • Publication number: 20020148809
    Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.
    Type: Application
    Filed: April 17, 2001
    Publication date: October 17, 2002
    Inventors: Andrew Z. Glovatsky, Robert E. Belke, Delin Li, Lakhi N. Goenka, Mohan R. Paruchuri, Marc A. Straub, Richard K. McMillan, Ram S. Raghava, Thomas B. Krautheim, Michael A. Howey, Vivek A. Jairazbhoy
  • Publication number: 20020142215
    Abstract: A device for producing an electro-motive force is disclosed. The device includes a cover for creating a liquid seal, an electrolyte contained within the cover for creating an ionic transfer path (medium), and an etched tri-metal board (substrate). The etched tri-metal board has a first conductive layer, a second conductive layer and a third conductive layer. The first, second and third conductive layers are selectively etched to form a cathode and an anode. The cover is sealed against the substrate and filled with an electrolyte to form an electrical device, such as a battery.
    Type: Application
    Filed: January 5, 2001
    Publication date: October 3, 2002
    Inventors: Lakhi N. Goenka, William F. Quilty, Mohan Paruchuri
  • Publication number: 20020137347
    Abstract: A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.
    Type: Application
    Filed: March 22, 2001
    Publication date: September 26, 2002
    Inventors: Bharat Z. Patel, Jay D. Baker, Lakhi N. Goenka, Michael Allen Howey, Mohan R. Paruchuri, Richard Keith McMillan
  • Patent number: 6403893
    Abstract: A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: June 11, 2002
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Achyuta Achari, Andrew Zachary Glovatsky, Robert Edward Belke, Brenda Joyce Nation, Delin Li, Lakhi N. Goenka, Robert Joseph Gordon, Thomas Bernd Krautheim
  • Publication number: 20010052423
    Abstract: A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.
    Type: Application
    Filed: March 20, 2001
    Publication date: December 20, 2001
    Inventors: Achyuta Achari, Andrew Zachary Glovatsky, Robert Edward Belke, Brenda Joyce Nation, Delin Li, Lakhi N. Goenka, Robert Joseph Gordon, Thomas Bernd Krautheim
  • Publication number: 20010040048
    Abstract: A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.
    Type: Application
    Filed: March 20, 2001
    Publication date: November 15, 2001
    Inventors: Achyuta Achari, Brenda Joyce Nation, Delin Li, Lakhi N. Goenka, Richard Keith McMillan, Vivek A. Jairazbhoy, Andrew Zachary Glovatsky, Robert Edward Belke, Robert Joseph Gordon, Thomas Bernd Krautheim
  • Publication number: 20010035299
    Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.
    Type: Application
    Filed: March 23, 2001
    Publication date: November 1, 2001
    Inventors: Achyuta Achari, Andrew Zachary Glovatsky, Robert Edward Belke, Brenda Joyce Nation, Delin Li, Lakhi N. Goenka, Mohan R. Paruchuri, Robert Joseph Gordon, Thomas Bernd Krautheim
  • Patent number: 6307240
    Abstract: A chemical etching manufacturing system is provided for removing material from a workpiece comprising a fluid control device, wherein the fluid control device controls at least one of fluid flow and fluid pressure, a fluid injection device, and a pulsed flow of chemical etchant adapted to pulsedly contact and remove material from a workpiece, wherein the pulse of the pulsed flow of chemical etchant is controlled by the fluid control device, and the pulsed flow of chemical etchant is emitted from the fluid injection device. A method of chemical etching in a manufacturing system is also provided comprising providing a workpiece, introducing the workpiece to a pulsed flow of chemical etchant, wherein the flow of chemical etchant pulsedly contacts and removes material from the workpiece, and removing the workpiece from the pulsed flow of chemical etchant.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: October 23, 2001
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Achyuta Achari, Lakhi N. Goenka
  • Patent number: 5702584
    Abstract: A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: December 30, 1997
    Assignee: Ford Motor Company
    Inventors: Lakhi N. Goenka, Michael G. Todd, Andrew Z. Glovatsky
  • Patent number: 5616067
    Abstract: In an apparatus for cleaning a workpiece with abrasive CO.sub.2 particles, a CO.sub.2 nozzle receives and expels liquid CO.sub.2 through at least one orifice sized for at least partially converting the liquid into CO.sub.2 particles. The CO.sub.2 particles are injected into a converging-diverging nozzle at a location adjacent to the throat section thereof. Pressurized air is directed into the converging section of the nozzle upstream from the throat section. The pressurized air accelerates the CO.sub.2 particles which are focused by the diverging section of the nozzle for impacting the pressure-sensitive surface of the workpiece to be cleaned.
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: April 1, 1997
    Assignee: Ford Motor Company
    Inventor: Lakhi N. Goenka
  • Patent number: 5545073
    Abstract: An apparatus and method for cleaning a workpiece with abrasive CO.sub.2 snow operates with a nozzle for creating and expelling the snow. The nozzle includes an upstream section for receiving CO.sub.2 in a gaseous form, and having a first contour shaped for subsonic flow of the CO.sub.2. The nozzle also includes a downstream section for directing the flow of the CO.sub.2 and the snow toward the workpiece, with the downstream section having a second contour shaped for supersonic flow of the CO.sub.2. The nozzle includes a throat section, interposed between the upstream and downstream sections, for changing the CO.sub.2 from the gaseous phase along a constant entropy line to a gas and snow mixture within the downstream section at a speed of at least Mach 1.0. In this manner, additional kinetic energy is imparted to the snow by delaying the conversion into the solid phase until the gaseous CO.sub.2 reaches supersonic speeds.
    Type: Grant
    Filed: April 5, 1993
    Date of Patent: August 13, 1996
    Assignee: Ford Motor Company
    Inventors: Lawrence L. Kneisel, Jay D. Baker, Lakhi N. Goenka
  • Patent number: 5514024
    Abstract: A CO.sub.2 nozzle expels liquid CO.sub.2 under pressure through an orifice therein for converting the liquid into CO.sub.2 snow. The CO.sub.2 nozzle is contained within an elongated mixing cavity within a body which is coupled to an exhaust nozzle for directing the CO.sub.2 snow toward the workpiece. The CO.sub.2 nozzle includes several wings for creating aerodynamic turbulence within the elongated mixing cavity for enhancing the coagulation of the CO.sub.2 snow into larger CO.sub.2 snow particles or CO.sub.2 snowflakes.
    Type: Grant
    Filed: November 8, 1993
    Date of Patent: May 7, 1996
    Assignee: Ford Motor Company
    Inventor: Lakhi N. Goenka