Abstract: A method of processing biological solids includes blending a sludge with calcium oxide and delivering the blended sludge and calcium oxide to a pressurized container; injecting, into the blended sludge and calcium oxide in the pressurized container, an additive capable of exothermic reactions with the calcium oxide; regulating pH in the pressurized container to produce class A biological solids from the sludge; and pumping the blended sludge, calcium oxide, and additive from the pressurized container to a reactor. A system used for this process include sources of calcium oxide and biological solids, an additive injector, and a pressurized reactor.

Abstract: A method of processing biological solids includes blending a sludge with calcium oxide and delivering the blended sludge and calcium oxide to a pressurized container; injecting, into the blended sludge and calcium oxide in the pressurized container, an additive capable of exothermic reactions with the calcium oxide; regulating pH in the pressurized container to produce class A biological solids from the sludge; and pumping the blended sludge, calcium oxide, and additive from the pressurized container to a reactor. A system used for this process include sources of calcium oxide and biological solids, an additive injector, and a pressurized reactor.

Abstract: A method of processing biological solids includes blending a sludge with calcium oxide and delivering the blended sludge and calcium oxide to a pressurized container; injecting, into the blended sludge and calcium oxide in the pressurized container, an additive capable of exothermic reactions with the calcium oxide; regulating pH in the pressurized container to produce class A biological solids from the sludge; and pumping the blended sludge, calcium oxide, and additive from the pressurized container to a reactor. A system used for this process include sources of calcium oxide and biological solids, an additive injector, and a pressurized reactor.

Abstract: The disclosed method and apparatus separates solid impurities from a fluid containing solid impurities. The method and apparatus allow the introduction of influent comprising a fluid containing solid impurities into a plurality of channels and allowing at least a portion of the solid impurities initially present in the influent to settle on upward-facing surfaces of a plurality of plates forming the channels or slide down the upward-facing surfaces, while permitting fluid, which has been depleted of at least a portion of solid impurities, to flow upward toward the top edges of the plurality of plates. The influent is introduced into the plurality of channels in a manner that inhibits a disrupting or disturbing of the solid impurities, which have separated from the influent.

Abstract: The disclosed method and apparatus separates solid impurities from a fluid containing solid impurities. The method and apparatus allow the introduction of influent comprising a fluid containing solid impurities into a plurality of channels and allowing at least a portion of the solid impurities initially present in the influent to settle on upward-facing surfaces of a plurality of plates forming the channels or slide down the upward-facing surfaces, while permitting fluid, which has been depleted of at least a portion of solid impurities, to flow upward toward the top edges of the plurality of plates. The influent is introduced into the plurality of channels in a manner that inhibits a disrupting or disturbing of the solid impurities, which have separated from the influent.

Abstract: The disclosed method and apparatus separates solid impurities from a fluid containing solid impurities. The method and apparatus allow the introduction of influent comprising a fluid containing solid impurities into a plurality of channels and allowing at least a portion of the solid impurities initially present in the influent to settle on upward-facing surfaces of a plurality of plates forming the channels or slide down the upward-facing surfaces, while permitting fluid, which has been depleted of at least a portion of solid impurities, to flow upward toward the top edges of the plurality of plates. The influent is introduced into the plurality of channels in a manner that inhibits a disrupting or disturbing of the solid impurities, which have separated from the influent.

Abstract: The disclosed method and apparatus separates solid impurities from a fluid containing solid impurities. The method and apparatus allow the introduction of influent comprising a fluid containing solid impurities into a plurality of channels and allowing at least a portion of the solid impurities initially present in the influent to settle on upward-facing surfaces of a plurality of plates forming the channels or slide down the upward-facing surfaces, while permitting fluid, which has been depleted of at least a portion of solid impurities, to flow upward toward the top edges of the plurality of plates. The influent is introduced into the plurality of channels in a manner that inhibits a disrupting or disturbing of the solid impurities, which have separated from the influent.

Abstract: The disclosed method and apparatus separates solid impurities from a fluid containing solid impurities. The method and apparatus allow the introduction of influent comprising a fluid containing solid impurities into a plurality of channels and allowing at least a portion of the solid impurities initially present in the influent to settle on upward-facing surfaces of a plurality of plates forming the channels or slide down the upward-facing surfaces, while permitting fluid, which has been depleted of at least a portion of solid impurities, to flow upward toward the top edges of the plurality of plates. The influent is introduced into the plurality of channels in a manner that inhibits a disrupting or disturbing of the solid impurities, which have separated from the influent.

Abstract: A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of forming a plurality of conductive leads, forming a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of the substrate, each of the side walls having a plurality of lead passages formed therethrough, and simultaneously inserting at least one of the conductive leads into the lead passage of one of the side walls for retention therein and at least one other of the conductive leads into the lead passage of another of the side walls for retention therein.

Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.

Abstract: A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.

Abstract: A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.

Abstract: An electrical connector includes a male connector and a female connector. The female connector includes a female connector housing and a plurality of female contact pins. The female contact pins includes a contact portion, a stabilizer portion, and a tail portion. The contact portion extends from the stabilizer portion at an angle. A lateral distance spanned by the angled contact portion is substantially the same as or less than the width of the stabilizer portion in the same direction. The female contact pins are arranged on the female connector housing in clusters of four. The clusters are arranged in rows such that each pair of rows defines five rows of female contact pins. The male connector includes a male connector housing and a plurality of male contact pins. The male connector housing has a plurality of buttresses extending therefrom. The male contact pins are arranged on the male connector housing to correspond to the arrangement of female contact pins.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.

Abstract: An integrated module includes a connector for detachable connection to a signal source, with the connector having internal electrically conductive pins, and a housing defining a cavity for holding at least one semiconductor die. The housing includes side walls and an end plate joined to the side walls. Electrically conductive leads extend through at least one of the side walls with each of the leads including an internal lead section extending within the cavity and an external lead section extending externally of the cavity through at least one side wall. One of the side walls of the housing includes a portion that is attached to the connector, with the side walls and a bottom part of the connector being formed as one integrally molded part or as two separate parts that are joined together using processes such as ultrasonic welding.

Abstract: A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.