Patents by Inventor Lakshminarasimha Krishnapura
Lakshminarasimha Krishnapura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6334794Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.Type: GrantFiled: March 3, 1999Date of Patent: January 1, 2002Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
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Publication number: 20010040792Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.Type: ApplicationFiled: July 13, 2001Publication date: November 15, 2001Applicant: The Panda ProjectInventors: Stanford W. Crane, Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn
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Publication number: 20010034164Abstract: An electrical connector includes a male connector and a female connector. The female connector includes a female connector housing and a plurality of female contact pins. The female contact pins includes a contact portion, a stabilizer portion, and a tail portion. The contact portion extends from the stabilizer portion at an angle. A lateral distance spanned by the angled contact portion is substantially the same as or less than the width of the stabilizer portion in the same direction. The female contact pins are arranged on the female connector housing in clusters of four. The clusters are arranged in rows such that each pair of rows defines five rows of female contact pins. The male connector includes a male connector housing and a plurality of male contact pins. The male connector housing has a plurality of buttresses extending therefrom. The male contact pins are arranged on the male connector housing to correspond to the arrangement of female contact pins.Type: ApplicationFiled: May 21, 2001Publication date: October 25, 2001Applicant: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
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Patent number: 6305987Abstract: An integrated module includes a connector for detachable connection to a signal source, with the connector having internal electrically conductive pins, and a housing defining a cavity for holding at least one semiconductor die. The housing includes side walls and an end plate joined to the side walls. Electrically conductive leads extend through at least one of the side walls with each of the leads including an internal lead section extending within the cavity and an external lead section extending externally of the cavity through at least one side wall. One of the side walls of the housing includes a portion that is attached to the connector, with the side walls and a bottom part of the connector being formed as one integrally molded part or as two separate parts that are joined together using processes such as ultrasonic welding.Type: GrantFiled: February 12, 1999Date of Patent: October 23, 2001Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Arindum Dutta
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Patent number: 6307258Abstract: A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.Type: GrantFiled: December 22, 1998Date of Patent: October 23, 2001Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li
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Patent number: 6266246Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.Type: GrantFiled: January 18, 2000Date of Patent: July 24, 2001Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn
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Patent number: 6247972Abstract: An electrical connector includes a male connector and a female connector. The female connector includes a female connector housing and a plurality of female contact pins. The female contact pins includes a contact portion, a stabilizer portion, and a tail portion. The contact portion extends from the stabilizer portion at an angle. A lateral distance spanned by the angled contact portion is substantially the same as or less than the width of the stabilizer portion in the same direction. The female contact pins are arranged on the female connector housing in clusters of four. The clusters are arranged in rows such that each pair of rows defines five rows of female contact pins. The male connector includes a male connector housing and a plurality of male contact pins. The male connector housing has a plurality of buttresses extending therefrom. The male contact pins are arranged on the male connector housing to correspond to the arrangement of female contact pins.Type: GrantFiled: August 14, 1997Date of Patent: June 19, 2001Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
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Patent number: 6141869Abstract: A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of forming a plurality of conductive leads, forming a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of said substrate, each of the side walls having a plurality of lead passages formed therethrough, and simultaneously inserting at least one of the conductive leads into the lead passage of one of the side walls for retention therein and at least one other of the conductive leads into the lead passage of another of the side walls for retention therein.Type: GrantFiled: October 26, 1998Date of Patent: November 7, 2000Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Daniel Larcomb, Lakshminarasimha Krishnapura
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Patent number: 6078102Abstract: A semiconductor die package includes a housing and a plurality of leads extending through openings in the housing. The package is designed to be mounted to a printed circuit board in both a horizontal configuration and in an upright configuration. In the horizontal configuration, the face of the die is held parallel to the surface of the printed circuit board. An edge of the die faces the printed circuit board when the package is mounted in an upright configuration. The leads are L-shaped so that either an end surface or an outer side surface of the lead can be surface mounted to the printed circuit board. The leads may extend from only one side wall of the housing. In this case, the housing may include a standoff on a bottom surface adjacent a side wall opposite the leads to balance the housing. Alternatively, stabilizing leads may be provided from the opposite side wall to improve horizontal mounting stability.Type: GrantFiled: March 3, 1998Date of Patent: June 20, 2000Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura
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Patent number: 6050850Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.Type: GrantFiled: August 14, 1997Date of Patent: April 18, 2000Assignee: The Panda ProjectInventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
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Patent number: 6031720Abstract: A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed on an upper surface of the semiconductor die carrier. The cooling duct inlet portion is attached to the cooling fan and the cooling duct outlet portion is disposed in close proximity to the heat exchanger. The cooling fan draws ambient air into the cooling duct and the ambient air exits the cooling duct outlet portion and passes in a heat exchange relationship with the heat exchanger.Type: GrantFiled: November 14, 1997Date of Patent: February 29, 2000Assignee: The Panda ProjectInventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Moises Behar, Arindum Dutta, Kevin J. Link, Bill Ahearn
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Patent number: 6016256Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.Type: GrantFiled: November 14, 1997Date of Patent: January 18, 2000Assignee: The Panda ProjectInventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn
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Patent number: 5951665Abstract: A computer system includes a bus system; a pluggable central processing unit circuit board, coupled to the bus system; a pluggable logic board coupled to the pluggable central processing unit circuit board through the bus system; a pluggable input/output board coupled to the pluggable logic board through the bus system; a first connector unit for directly connecting the pluggable central processing unit circuit board to a first predetermined location on the pluggable logic board; and a second connector unit for directly connecting the pluggable logic board to a predetermined location on the pluggable input/output board.Type: GrantFiled: November 14, 1997Date of Patent: September 14, 1999Assignee: The Panda ProjectInventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Daniel Fuoco, Roy K. Lee, Kevin J. Link, Moises Behar, Arindum Dutta, William Cross