Patents by Inventor Lakshminarayan Viswanathan

Lakshminarayan Viswanathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bond-less electronic component for use with an external circuit and method of manufacture
    Publication number: 20030128080
    Abstract: A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate (110, 410), an electronic device (130) over the support substrate, and a cover (140, 440, 540) located over the electronic device and the support substrate. The cover includes an interconnect structure (141, 441, 541) electrically coupled to the electronic device and adapted to electrically couple together the electronic device and the circuit for providing impedance transformation of an electrical signal between the electronic device and the circuit.
    Type: Application
    Filed: January 4, 2002
    Publication date: July 10, 2003
    Applicant: Motorola, Inc.
    Inventors: Lakshminarayan Viswanathan, Pierre-Marie Piel, Garry D. Funk, Robert Paul Davidson
  • Semiconductor component and method for manufacturing the semiconductor component
    Patent number: 6261868
    Abstract: A method for packaging a semiconductor device (23) to form a semiconductor component (10). A die attach material (17) is disposed on a flange (11). A semiconductor chip (23) is bonded to the die attach material (17). After disposing the die attach material (17) on the flange (11), an insulator material (28) is coupled to the flange (11). A leadframe (32) is coupled to the semiconductor chip (23) via a plurality of wirebonds (36). The wirebonds (36) and the semiconductor chip (23) are protected by a lid (37).
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: July 17, 2001
    Assignee: Motorola, Inc.
    Inventors: Gerald R. Miller, Lakshminarayan Viswanathan
  • Semiconductor package
    Patent number: 6072211
    Abstract: A semiconductor package (10) forms an impedance matching capacitor by utilizing an insulator (12), a conductor (19) on the dielectric, and a substrate (11) as elements of the capacitor. The capacitor is electrically connected, as part of an impedance matching network to shunt the inductance of the bonding wires (21) that connect the semiconductor die (18) an input lead (17).
    Type: Grant
    Filed: August 3, 1998
    Date of Patent: June 6, 2000
    Assignee: Motorola, Inc.
    Inventors: Gerald R. Miller, Lakshminarayan Viswanathan, Alan D. Wood
  • Semiconductor component
    Patent number: 6072238
    Abstract: A semiconductor device (10) suitable for use in RF applications and a method of forming the semiconductor device (10). An RF transistor die (31) is bonded to a heatsink (21). The heatsink (21) having the semiconductor chip (31) mounted thereto is coupled to a printed circuit board (11), wherein the RF transistor die (31) extends through an opening (14) in the printed circuit board (11). Conductors (18, 19) on the printed circuit board (11) are coupled to the semiconductor chip (31) via wirebonds (35, 36).
    Type: Grant
    Filed: April 7, 1999
    Date of Patent: June 6, 2000
    Assignee: Motorola, Inc.
    Inventors: Lakshminarayan Viswanathan, David F. Abdo, Gerald R. Miller