Patents by Inventor Lan Wei

Lan Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210063777
    Abstract: An optical modulator includes a dielectric layer and a waveguide. The waveguide is disposed on the dielectric layer. The waveguide includes an electrical coupling portion, a slab portion, and an optical coupling portion. The slab portion is sandwiched between the electrical coupling portion and the optical coupling portion. The slab portion has at least two sub-portions having different heights. A maximum height of the slab portion is smaller than a height of the electrical coupling portion.
    Type: Application
    Filed: November 11, 2020
    Publication date: March 4, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lan-Chou Cho, Chewn-Pu Jou, Feng-Wei Kuo, Huan-Neng Chen, Min-Hsiang Hsu
  • Publication number: 20210061925
    Abstract: The disclosure provides trispecific and/or trivalent binding proteins comprising four polypeptide chains that form three antigen binding sites that specifically bind one or more target proteins, wherein a first pair of polypeptides forming the binding protein possess dual variable domains having a cross-over orientation and wherein a second pair of polypeptides forming the binding protein possess a single variable domain. The disclosure also provides methods for making trispecific and/or trivalent binding proteins and uses of such binding proteins.
    Type: Application
    Filed: November 16, 2020
    Publication date: March 4, 2021
    Inventors: Zhi-Yong YANG, Gary J. NABEL, Lan WU, Edward SEUNG, Ronnie WEI, Jochen BENINGA, Ercole RAO, Wulf Dirk LEUSCHNER, Christian BEIL, Christian LANGE, Carsten CORVEY
  • Patent number: 10938443
    Abstract: A communication system includes a modulator configured to generate a modulated signal responsive to at least a data signal, and a demodulator configured to demodulate the modulated signal responsive to a first carrier signal. The demodulator includes a filter configured to generate a filtered first signal based on a first signal, and a gain adjusting circuit coupled to the filter. The first signal is based on the first carrier signal and modulated signal. The filter has a gain controlled by a set of control signals. The gain adjusting circuit is configured to adjust the gain of the filter, and to generate the set of control signals based on a voltage of the filtered first signal and a voltage of the first signal. The gain adjusting circuit includes a first peak detector coupled to the filter, and configured to detect a peak value of the voltage of the filtered first signal.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: March 2, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Feng Wei Kuo, William Wu Shen, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho
  • Patent number: 10930603
    Abstract: A semiconductor package includes a first semiconductor device, a second semiconductor device vertically positioned above the first semiconductor device, and a ground shielded transmission path. The ground shielded transmission path couples the first semiconductor device to the second semiconductor device. The ground shielded transmission path includes a first signal path extending longitudinally between a first end and a second end. The first signal path includes a conductive material. A first insulating layer is disposed over the signal path longitudinally between the first end and the second end. The first insulating layer includes an electrically insulating material. A ground shielding layer is disposed over the insulating material longitudinally between the first end and the second end of the signal path. The ground shielding layer includes a conductive material coupled to ground.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: February 23, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng Wei Kuo, Wen-Shiang Liao, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen
  • Patent number: 10921182
    Abstract: A device includes a scattering structure and a collection structure. The scattering structure is arranged to concurrently scatter incident electromagnetic radiation along a first scattering axis and along a second scattering axis. The first scattering axis and the second scattering axis are non-orthogonal. The collection structure includes a first input port aligned with the first scattering axis and a second input port aligned with the second scattering axis. A method includes scattering electromagnetic radiation along a first scattering axis to create first scattered electromagnetic radiation and along a second scattering axis to create second scattered electromagnetic radiation. The first scattering axis and the second scattering axis are non-orthogonal. The first scattered electromagnetic radiation is detected to yield first detected radiation and the second scattered electromagnetic radiation is detected to yield second detected radiation.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: February 16, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Chewn-Pu Jou, Fen Wei Kuo, Huan-Neng Chen, Lan-Chou Cho
  • Patent number: 10899945
    Abstract: Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy and (iii) Ti N and/or TaN, wherein the CMP composition (Q) comprises (E) Inorganic particles (F) at least one organic compound comprising an amino-group and an acid group (Y), wherein said compound comprises n amino groups and at least n+1 acidic protons, wherein n is a integer?1. (G) at least one oxidizer in an amount of from 0.2 to 2.5 wt.-% based on the total weight of the respective CMP composition, (H) an aqueous medium wherein the CMP composition (Q) has a pH of more than 6 and less than 9.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: January 26, 2021
    Assignee: BASF SE
    Inventors: Robert Reichardt, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim, Reza M. Golzarian, Te Yu Wei, Haci Osman Guevenc, Julian Proelss, Leonardus Leunissen
  • Patent number: 10882922
    Abstract: The disclosure provides trispecific and/or trivalent binding proteins comprising four polypeptide chains that form three antigen binding sites that specifically bind one or more target proteins, wherein a first pair of polypeptides forming the binding protein possess dual variable domains having a cross-over orientation and wherein a second pair of polypeptides forming the binding protein possess a single variable domain. The disclosure also provides methods for making trispecific and/or trivalent binding proteins and uses of such binding proteins.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: January 5, 2021
    Assignee: SANOFI
    Inventors: Zhi-Yong Yang, Gary J. Nabel, Lan Wu, Edward Seung, Ronnie Wei, Jochen Beninga, Ercole Rao, Wulf Dirk Leuschner, Christian Beil, Christian Lange, Carsten Corvey
  • Publication number: 20200399369
    Abstract: Provided herein are trispecific and/or trivalent binding proteins comprising four polypeptide chains that form three antigen binding sites that specifically bind one or more target proteins, wherein a first pair of polypeptides forming the binding protein possess dual variable domains having a cross-over orientation, and wherein and a second pair of polypeptides possess a single variable domain forming a single antigen binding site. In some embodiments, the binding proteins comprise a binding site that binds a CD28 polypeptide, a binding site that binds a CD3 polypeptide, and a binding site that binds a third polypeptide, such as a tumor target protein. In some embodiments, the binding proteins comprise four polypeptide chains that form three antigen binding sites that specifically bind one or more HIV target proteins. The disclosure also relates to methods for making trispecific and/or trivalent binding proteins and uses of such binding proteins.
    Type: Application
    Filed: April 8, 2020
    Publication date: December 24, 2020
    Inventors: Mangaiarkarasi ASOKAN, Christian BEIL, Jochen BENINGA, Joerg BIRKENFELD, Mark CONNORS, Richard A. KOUP, Young Do KWON, Peter D. KWONG, Qingbo LIU, Paolo LUSSO, John R. MASCOLA, Gary J. NABEL, Amarendra PEGU, Huawei QIU, Ercole RAO, Joerg REGULA, Edward SEUNG, Ronnie WEI, Lan WU, Zhen XING, Ling XU, Zhi-Yong YANG, BĂ©atrice Cameron, Tarik Dabdoubi, Cendrine Lemoine, Catherine Prades
  • Patent number: 10866440
    Abstract: An optical modulator includes a dielectric layer and a waveguide. The waveguide is disposed on the dielectric layer. The waveguide has a first region, a second region, and an optical coupling region between the first region and the second region. The waveguide located in the first region includes a first electrical coupling portion and a first slab portion connected to each other. The waveguide located in the second region includes a second electrical coupling portion and a second slab portion connected to each other. The waveguide located in the optical coupling region includes a first optical coupling portion and a second optical coupling portion. The first slab portion has at least two sub-portions having different heights. The second slab portion has at least two sub-portions having different heights.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: December 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lan-Chou Cho, Chewn-Pu Jou, Feng-Wei Kuo, Huan-Neng Chen, Min-Hsiang Hsu
  • Patent number: 10862486
    Abstract: An all-digital phase locked loop (ADPLL) receives an analog input supply voltage which is utilized to operate analog circuitry within the ADPLL. The ADPLL of the present disclosure scales this analog input supply voltage to provide a digital input supply voltage which is utilized to operate digital circuitry within the ADPLL. The analog circuitry includes a time-to-digital converter (TDC) to measure phase errors within the ADPLL. The TDC can be characterized as having a resolution of the TDC which is dependent, at least in part, upon the digital input supply voltage. In some situations, process, voltage, and/or temperature (PVT) variations within the ADPLL can cause the digital input supply voltage to fluctuate, which in turn, can cause fluctuations in the resolution of the TDC. These fluctuations in the resolution of the TDC can cause in-band phase noise of the ADPLL to vary across the PVT variations.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: December 8, 2020
    Inventors: Feng Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski, Seyednaser Pourmousavian
  • Publication number: 20200374776
    Abstract: A user equipment (UE) comprises a processor configured to execute executable instructions to receive configuration information associated with at least two uplink carriers from a base station, the at least two uplink carriers including a supplementary uplink carrier and a normal uplink carrier, select one of the at least two uplink carriers of the base station if a power of a first downlink reference signal from the base station and measured by the UE is below a first threshold value, select a contention-free random access (CFRA) resource associated with a second downlink reference signal on the selected uplink carrier of the base station if a power of the second downlink reference signal from the base station and measured by the UE is above a second threshold value, and perform a random access procedure with the base station by using the selected CFRA resource over the selected uplink carrier.
    Type: Application
    Filed: August 7, 2020
    Publication date: November 26, 2020
    Inventors: MEI-JU SHIH, CHIE-MING CHOU, HUNG-CHEN CHEN, CHIA-HUNG WEI, YUNG-LAN TSENG, YU-HSIN CHENG
  • Patent number: 10845670
    Abstract: In an embodiment, a phase shifter includes: a light input end; a light output end; a p-type semiconductor material, and an n-type semiconductor material contacting the p-type semiconductor material along a boundary area, wherein the boundary area is greater than a length from the light input end to the light output end multiplied by a core width of the phase shifter.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: November 24, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Huan-Neng Chen, Chewn-Pu Jou, Lan-Chou Cho, Feng-Wei Kuo
  • Publication number: 20200317555
    Abstract: In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Inventors: Feng Wei KUO, Chewn-Pu JOU, Huan-Neng CHEN, Lan-Chou CHO, Robert Bogdan STASZEWSKI
  • Patent number: 10798632
    Abstract: A user equipment (UE) is configured with at least one uplink carrier of a normal uplink carrier and a supplementary uplink carrier. The UE selects the supplementary uplink carrier if a measured RSRP is below a threshold. The UE performs a random access preamble transmission using a random access resources configured in association to the selected supplementary uplink carrier.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: October 6, 2020
    Assignee: FG Innovation Company Limited
    Inventors: Mei-ju Shih, Chie-Ming Chou, Hung-Chen Chen, Chia-Hung Wei, Yung-Lan Tseng, Yu-Hsin Cheng
  • Publication number: 20200314805
    Abstract: A method by a wireless communication network for handling one or more duplicated packet data convergence protocol (PDCP) packets is described. The method includes sending, by a master node, a request for a configuration for duplication to a secondary node, and providing, by a secondary node, a mapping configuration for duplication in a secondary cell group (SCG) to a user equipment (UE).
    Type: Application
    Filed: June 12, 2020
    Publication date: October 1, 2020
    Inventors: YUNG-LAN TSENG, CHIE-MING CHOU, MEI-JU SHIH, CHIA-HUNG WEI
  • Publication number: 20200299547
    Abstract: The presently claimed subject matter is directed to a chemical mechanical polishing (CMP) composition comprising inorganic particles, at least one organic compound comprising an amino group and/or at least one acid group (Y), potassium persulfate, at least one corrosion inhibitor and an aqueous medium for polishing substrates of the semiconductor industry comprising cobalt and/or a cobalt alloy and TiN and/or TaN.
    Type: Application
    Filed: November 12, 2018
    Publication date: September 24, 2020
    Applicant: BASF SE
    Inventors: Christian DAESCHLEIN, Max SIEBERT, Yongqing LAN, Michael LAUTER, Sheik Ansar USMAN IBRAHIM, Reza M GOLZARIAN, Te Yu WEI, Haci Osman GUEVENC, Julian PROELSS, Leonardus LEUNISSEN
  • Publication number: 20200274566
    Abstract: A circuit includes a transmitter, a transmission channel communicatively coupled with the transmitter, and a receiver communicatively coupled with the transmission channel. The circuit further includes a combiner on a transmitter-side of the transmission channel, a decoupler on a receiver-side of the transmission channel, and a channel loss compensation circuit communicatively coupled between the transmitter and the receiver. The combiner is coupled between the transmitter and the transmission channel. The decoupler is coupled between the receiver and the transmission channel.
    Type: Application
    Filed: May 12, 2020
    Publication date: August 27, 2020
    Inventors: Lan-Chou CHO, Chewn-Pu JOU, Feng Wei KUO, Huan-Neng CHEN, William Wu SHEN
  • Publication number: 20200274685
    Abstract: An integrated circuit includes a first through fourth devices positioned over a substrate, the first device including first through third transceivers, the second device including a fourth transceiver, the third device including a fifth transceiver, and the fourth device including a sixth transceiver. A first radio frequency interconnect (RFI) includes the first transceiver coupled to the fourth transceiver through a first guided transmission medium, a second RFI includes the second transceiver coupled to the fifth transceiver through a second guided transmission medium, and a third RFI includes the third transceiver coupled to the sixth transceiver by the second guided transmission medium.
    Type: Application
    Filed: May 13, 2020
    Publication date: August 27, 2020
    Inventors: Huan-Neng CHEN, William Wu SHEN, Chewn-Pu JOU, Feng Wei KUO, Lan-Chou CHO, Tze-Chiang HUANG, Jack LIU, Yun-Han LEE
  • Publication number: 20200261025
    Abstract: A flexible probe includes a probe body having a distal end and a proximal end, and comprises at least one flexible nanoelectronic thread having a distal end and a proximal end and a length therebetween, the nanoelectronic thread comprising at least one electrode positioned on a top surface of the nanoelectronic thread, and at least one nanoscale wire is partially encapsulated, having a first portion electrically connected to at least one of the electrodes and a second portion surrounded by a dielectric insulator, the probe further including at least one external trace electrically connected to the at least one nanoscale wire at the proximal end of the at least one nanoelectronic thread, the at least one external trace having a width larger than the width of the at least one nanoscale wire, and an interface connector near the proximal end of the probe body, electrically connected to the at least one electrode via the at least one nanoscale wire and the at least one external trace, wherein the at least one nano
    Type: Application
    Filed: September 7, 2018
    Publication date: August 20, 2020
    Inventors: Chong XIE, Lan LUAN, Zhengtuo ZHAO, Xiaoling WEI
  • Patent number: D897829
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: October 6, 2020
    Assignee: WISTRON NEWEB CORP.
    Inventors: Lan-Chun Yang, Chun-Wei Wang, Yi-Chieh Lin, San-Yi Kuo