Patents by Inventor Lan Wu

Lan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240161388
    Abstract: A deep neural network based hair rendering system is presented to model high frequency component of furry objects. Compared with existing approaches, the present method can generate photo-realistic rendering results. An acceleration method is applied in our framework, which can speed up training and rendering processes. In addition, a patch-based training scheme is introduced, which significantly increases the quality of outputs and preserves high frequency details.
    Type: Application
    Filed: April 13, 2021
    Publication date: May 16, 2024
    Applicant: SHANGHAITECH UNIVERSITY
    Inventors: Haimin LUO, Minye WU, Lan XU, Jingyi YU
  • Publication number: 20240152735
    Abstract: Provided is a system for detecting an anomaly in a multivariate time series that includes at least one processor programmed or configured to receive a dataset of a plurality of data instances, wherein each data instance comprises a time series of data points, determine a set of target data instances based on the dataset, determine a set of historical data instances based on the dataset, generate, based on the set of target data instances, a true value matrix, a true frequency matrix, and a true correlation matrix, generate a forecast value matrix, a forecast frequency matrix, and a forecast correlation matrix based on the set of target data instances and the set of historical data instances, determine an amount of forecasting error, and determine whether the amount of forecasting error corresponds to an anomalous event associated with the dataset of data instances. Methods and computer program products are also provided.
    Type: Application
    Filed: June 10, 2022
    Publication date: May 9, 2024
    Applicant: Visa International Service Association
    Inventors: Lan Wang, Yu-San Lin, Yuhang Wu, Huiyuan Chen, Fei Wang, Hao Yang
  • Patent number: 11942557
    Abstract: A semiconductor nanosheet device including semiconductor channel layers vertically aligned and stacked one on top of another, separated by a work function metal, and a second layer between two first layers, the second layer and two first layers between the semiconductor channel layers and a substrate. A semiconductor device including a lower first layer, a second layer, and a source drain region between a first set of semiconductor channel layers vertically aligned and stacked one on top of another, and a second set of semiconductor channel layers. A method including forming a stack sacrificial layer, a stack of nanosheet layers, forming a cavity by removing the stack sacrificial layer, and simultaneously forming a first layer on an upper surface of the stack sacrificial layer, on vertical side surfaces of the set of sacrificial gates, and an upper first layer and a lower first layer in a portion of the cavity.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: March 26, 2024
    Assignee: International Business Machines Corporation
    Inventors: Lan Yu, Andrew M. Greene, Wenyu Xu, Heng Wu
  • Patent number: 11943935
    Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: March 26, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
  • Patent number: 11932704
    Abstract: The disclosure provides trispecific and/or trivalent binding proteins comprising four polypeptide chains that form three antigen binding sites that specifically bind one or more target proteins, wherein a first pair of polypeptides forming the binding protein possess dual variable domains having a cross-over orientation and wherein a second pair of polypeptides forming the binding protein possess a single variable domain. The disclosure also provides methods for making trispecific and/or trivalent binding proteins and uses of such binding proteins.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: March 19, 2024
    Assignee: SANOFI
    Inventors: Zhi-Yong Yang, Gary J. Nabel, Lan Wu, Edward Seung, Ronnie Wei, Jochen Beninga, Ercole Rao, Wulf Dirk Leuschner, Christian Beil, Christian Lange, Carsten Corvey
  • Publication number: 20240059798
    Abstract: Disclosed are antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural features. Also disclosed are polynucleotides and vectors encoding such polypeptide complexes; cells, pharmaceutical compositions, and kits containing such polypeptide complexes; and methods of using such polypeptide complexes.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 22, 2024
    Inventors: LING XU, LAN WU, EDWARD SEUNG, ZHI-YONG YANG, GARY J. NABEL, ELIAS ZERHOUNI, RONNIE R. WEI, HAO CHEN, MARK GRECI, NICHOLAS JONES
  • Publication number: 20230357401
    Abstract: The disclosure provides methods of treating viral infection using trispecific binding proteins comprising four polypeptide chains that form three antigen binding sites that specifically bind a CD38 polypeptide (e.g., human and/or cynomolgus monkey CD38 polypeptides), a CD28 polypeptide, and a CD3 polypeptide.
    Type: Application
    Filed: November 11, 2022
    Publication date: November 9, 2023
    Inventors: Lan WU, Ling XU, Edward SEUNG, Ronnie WEI, Gary NABEL, Zhi-Yong YANG, Tarik DABDOUBI, Béatrice CAMERON, Cendrine LEMOINE, Catherine PRADES
  • Publication number: 20230352497
    Abstract: A display may have one or more bent portions. To increase the magnitude of curvature in a display and/or to allow for compound curvature in the display, a display panel may be partially formed in a planar state. The partial display panel is then bent to have desired curvature. After the partial display panel is bent, additional display components that are susceptible to damage during the bending process may be added to complete the display panel. A flexible printed circuit may be formed directly on the display panel using precise deposition of conductive material. By forming the flexible printed circuit layer-by-layer directly on the display panel, no substantive pressure needs to be applied to the display panel. Electrical connections may therefore be made to the display panel in regions of the display with high levels of curvature and/or with compound curvature without causing front-of-screen artifacts for the display panel.
    Type: Application
    Filed: March 1, 2023
    Publication date: November 2, 2023
    Inventors: Meng-Tse Chen, Anshi Liang, Arnoldus A Barlian, Bayu A Thedjoisworo, Boris A Russ, Chun-Hsien Lee, Chun-Lan Wu, Han-Chieh Chang, Jiming Yu, Marc J DeVincentis, Nathan K Gupta, Paolo Sacchetto, Paul S Drzaic, Zhen Zhang, Ziyang Zhang
  • Publication number: 20230343914
    Abstract: Conductive traces may be conformally wrapped around the side of a display panel that includes an array of display pixels. The conductive traces may electrically connect contacts on an upper surface of the display panel to corresponding contacts on a flexible printed circuit that is attached to a lower surface of the display panel. The side-wrapped conductive traces may be interposed between first and second insulating layers. The flexible printed circuit may have a multi-step interface that is electrically connected to the side-wrapped conductive traces. A system-in-package including a display driver integrated circuit may be mounted to the flexible printed circuit. The system-in-package may include a plurality of redistribution layers that electrically connect contacts on the display driver integrated circuit to contacts on the flexible printed circuit.
    Type: Application
    Filed: March 16, 2023
    Publication date: October 26, 2023
    Inventors: Han-Chieh Chang, Anshi Liang, Arnoldus A Barlian, Bayu A Thedjoisworo, Boris A Russ, Chun-Lan Wu, Ken Hsuan Liao, Marc J DeVincentis, Meng-Tse Chen, Nathan K Gupta, Paolo Sacchetto, Paul S Drzaic, Po-Jui Chen, Ying-Chih Wang, Yong Sun, Zhen Zhang, Ziyang Zhang
  • Publication number: 20230235092
    Abstract: Disclosed are antigen binding polypeptides and antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural features. Also disclosed are polynucleotides and vectors encoding such polypeptides and polypeptide complexes; chimeric antigen receptors (CARs), cells, pharmaceutical compositions and kits containing such polypeptides and polypeptide complexes; and methods of using such polypeptides and polypeptide complexes.
    Type: Application
    Filed: September 28, 2022
    Publication date: July 27, 2023
    Inventors: Ronnie Rong WEI, Ling XU, Zhi-Yong YANG, Edward SEUNG, Gary J. NABEL, Lan WU, Mark GRECI, Hao CHEN
  • Publication number: 20230220079
    Abstract: Provided herein are trispecific and/or trivalent binding proteins comprising four polypeptide chains that form three antigen binding sites that specifically bind one or more target proteins, wherein a first pair of polypeptides forming the binding protein possess dual variable domains having a cross-over orientation, and wherein and a second pair of polypeptides possess a single variable domain forming a single antigen binding site. In some embodiments, the binding proteins comprise a binding site that binds a CD28 polypeptide, a binding site that binds a CD3 polypeptide, and a binding site that binds a third polypeptide, such as a tumor target protein. In some embodiments, the binding proteins comprise four polypeptide chains that form three antigen binding sites that specifically bind one or more HIV target proteins. The disclosure also relates to methods for making trispecific and/or trivalent binding proteins and uses of such binding proteins.
    Type: Application
    Filed: March 13, 2023
    Publication date: July 13, 2023
    Inventors: Christian BEIL, Jochen BENINGA, Joerg BIRKENFELD, Gary J. NABEL, Huawei QIU, Ercole RAO, Joerg REGULA, Edward SEUNG, Ronnie WEI, Lan WU, Zhen XING, Ling XU, Zhi-Yong YANG
  • Publication number: 20230203199
    Abstract: Disclosed are antigen binding polypeptides and antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural features. Also disclosed are polynucleotides and vectors encoding such polypeptides and polypeptide complexes; host cells, chimeric antigen receptors (CARs), immune cells, pharmaceutical compositions and kits containing such polypeptides and polypeptide complexes; and methods of using such polypeptides and polypeptide complexes.
    Type: Application
    Filed: September 28, 2022
    Publication date: June 29, 2023
    Inventors: Ronnie Rong WEI, Ling XU, Zhi-Yong YANG, Edward SEUNG, Gary J. NABEL, Lan WU, Mark GRECI, Hao CHEN
  • Patent number: 11613576
    Abstract: Provided herein are trispecific and/or trivalent binding proteins comprising four polypeptide chains that form three antigen binding sites that specifically bind one or more target proteins, wherein a first pair of polypeptides forming the binding protein possess dual variable domains having a cross-over orientation, and wherein and a second pair of polypeptides possess a single variable domain forming a single antigen binding site. In some embodiments, the binding proteins comprise a binding site that binds a CD28 polypeptide, a binding site that binds a CD3 polypeptide, and a binding site that binds a third polypeptide, such as a tumor target protein. In some embodiments, the binding proteins comprise four polypeptide chains that form three antigen binding sites that specifically bind one or more HIV target proteins. The disclosure also relates to methods for making trispecific and/or trivalent binding proteins and uses of such binding proteins.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: March 28, 2023
    Assignee: SANOFI
    Inventors: Christian Beil, Jochen Beninga, Joerg Birkenfeld, Gary J. Nabel, Huawei Qiu, Ercole Rao, Joerg Regula, Edward Seung, Ronnie Wei, Lan Wu, Zhen Xing, Ling Xu, Zhi-Yong Yang, Béatrice Cameron, Tarik Dabdoubi, Cendrine Lemoine, Catherine Prades
  • Patent number: 11530268
    Abstract: The disclosure provides methods of treating viral infection using trispecific binding proteins comprising four polypeptide chains that form three antigen binding sites that specifically bind a CD38 polypeptide (e.g., human and/or cynomolgus monkey CD38 polypeptides), a CD28 polypeptide, and a CD3 polypeptide.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: December 20, 2022
    Assignee: Sanofi
    Inventors: Lan Wu, Ling Xu, Edward Seung, Ronnie Wei, Gary Nabel, Zhi-Yong Yang, Tarik Dabdoubi, Béatrice Cameron, Cendrine Lemoine, Catherine Prades
  • Patent number: 11518400
    Abstract: A method for detecting, a roadside object including, a three-dimensional object in the vicinity of a vehicle on a road surface includes recording at least one data set including a plurality of data points associated with a region in a lateral vicinity of the vehicle, the region at least partially including at least one wheel of the vehicle and the road surface, where each data point includes according, to whether it corresponds to the at least one wheel to the road surface or to the roadside object, determining a distance between a data point classified as corresponding to the at least one wheel and a data point classified as corresponding to the roadside object and generating a signal if the distance is below at least one threshold value.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: December 6, 2022
    Assignee: Motherson Innovations Company Limited
    Inventors: Reinhold Langbein, Lan Wu
  • Publication number: 20220119553
    Abstract: The disclosure provides trispecific and/or trivalent binding proteins comprising four polypeptide chains that form three antigen binding sites that specifically bind one or more target proteins, wherein a first pair of polypeptides forming the binding protein possess dual variable domains having a cross-over orientation and wherein a second pair of polypeptides forming the binding protein possess a single variable domain. The disclosure also provides methods for making trispecific and/or trivalent binding proteins and uses of such binding proteins.
    Type: Application
    Filed: October 29, 2021
    Publication date: April 21, 2022
    Inventors: Zhi-Yong YANG, Gary J. NABEL, Lan WU, Edward SEUNG, Ronnie WEI, Jochen BENINGA, Ercole RAO, Wulf Dirk LEUSCHNER, Christian BEIL, Christian LANGE, Carsten CORVEY
  • Patent number: 11240973
    Abstract: An artificially intelligent harvest and reuse system for planting vegetables has a first mechanic arm moving a plurality of planting plates around a first conveyor, a second conveyor, a first shelf and a second shelf. The planting plates are sent to a connecting conveyor for the grown vegetables thereon to be picked up by a second mechanic arm and further sent to a root cutting apparatus then to a packaging apparatus, while the empty planting plates are further sent to an exit end of the first conveyor and a third mechanic arm places nursery foams with sprouts from a storage area onto the empty planting plates. Then the refilled planting plates are sent back to the corresponding shelf via the second conveyor and placed back into the corresponding layers neatly by the first mechanic arm on a first distributing apparatus.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: February 8, 2022
    Assignee: Sunpower Grand Holdings Pte. Ltd.
    Inventors: Yu-Chien Wu, Li-Jen Wu, Hsin-Lan Wu
  • Patent number: 11192960
    Abstract: The disclosure provides trispecific and/or trivalent binding proteins comprising four polypeptide chains that form three antigen binding sites that specifically bind one or more target proteins, wherein a first pair of polypeptides forming the binding protein possess dual variable domains having a cross-over orientation and wherein a second pair of polypeptides forming the binding protein possess a single variable domain. The disclosure also provides methods for making trispecific and/or trivalent binding proteins and uses of such binding proteins.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: December 7, 2021
    Assignee: Sanofi
    Inventors: Zhi-Yong Yang, Gary J. Nabel, Lan Wu, Edward Seung, Ronnie Wei, Jochen Beninga, Ercole Rao, Wulf Dirk Leuschner, Christian Beil, Christian Lange, Carsten Corvey
  • Patent number: D990693
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: June 27, 2023
    Assignee: AZUNI INTERNATIONAL CO., LTD.
    Inventor: Li-Lan Wu
  • Patent number: D990694
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: June 27, 2023
    Assignee: AZUNI INTERNATIONAL CO., LTD.
    Inventor: Li-Lan Wu