Patents by Inventor Lanping Bai

Lanping Bai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protective packaging for integrated circuit device
    Patent number: 9196557
    Abstract: A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: November 24, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jianshe Bi, Lanping Bai, Quan Chen, Liping Guo, Yanbo Xu
  • PROTECTIVE PACKAGING FOR INTEGRATED CIRCUIT DEVICE
    Publication number: 20150332985
    Abstract: A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.
    Type: Application
    Filed: November 26, 2014
    Publication date: November 19, 2015
    Inventors: Jianshe Bi, Lanping Bai, Quan Chen, Liping Guo, Yanbo Xu