Abstract: An electronic device includes a leadframe including a die pad and contacts, where a die attached is to the die pad. Wire bonds are attached from the die to the contacts and a mold compound overlies the leadframe and encapsulates the die and the wire bonds. The mold compound has angled side surfaces that extend from a top of the mold compound to a bonding surface of the contacts. The contacts extend from the angled side surfaces in a range of approximately 100 to 300 um.

Abstract: A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.

Abstract: An electronic device includes a substrate, a semiconductor die, and a molded package structure that encloses a portion of the semiconductor die and extends to a portion of the substrate. A sensor surface extends along a side of the semiconductor die, and conductive terminals extend outward from the side and have ends soldered to conductive features of the substrate. The side of the semiconductor die is spaced apart from the substrate and the conductive terminals forming a cage structure that laterally surrounds the sensor surface. The molded package structure has a cavity that extends between the sensor surface and the substrate, and the cavity extends in an interior of a cage structure formed by the conductive terminals.

Abstract: A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.

Abstract: A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.

Abstract: A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.

Abstract: A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.

Abstract: A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.

Abstract: Disclosed herein are system, method, and computer program product embodiments for automatically transitioning a user from a call to action (CTA) to an enrollment interface. An embodiment operates by receiving a request from a user's device to display web content. The requested web content is displayed along with a CTA. When the CTA is selected by the user, an e-mail client associated with the user's device automatically opens, generates an electronic message based on the selected CTA, and populates a recipient address and a code associated with the CTA within the electronic message. Upon its receipt, the electronic message is processed by enrolling the user in a campaign associated with the CTA based on the code and the user's e-mail address. An electronic message is generated and sent to the user's e-mail address that contains a first hyperlink to the campaign associated with the CTA and a second hyperlink to an associated privacy policy.

Abstract: Disclosed herein are system, method, and computer program product embodiments for automatically transitioning a user from a call to action (CTA) to an enrollment interface. An embodiment operates by receiving a request from a user's device to display web content. The requested web content is displayed along with a CTA. When the CTA is selected by the user, an e-mail client associated with the user's device automatically opens, generates an electronic message based on the selected CTA, and populates a recipient address and a code associated with the CTA within the electronic message. Upon its receipt, the electronic message is processed by enrolling the user in a campaign associated with the CTA based on the code and the user's e-mail address. An electronic message is generated and sent to the user's e-mail address that contains a first hyperlink to the campaign associated with the CTA and a second hyperlink to an associated privacy policy.