Patents by Inventor Laurent A. Dellmann

Laurent A. Dellmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7336864
    Abstract: An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: February 26, 2008
    Assignee: International Business Machines Corporation
    Inventors: Laurent A. Dellmann, Michel Despont, Bert J. Offrein, David J. Webb
  • Publication number: 20070205479
    Abstract: Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.
    Type: Application
    Filed: August 31, 2006
    Publication date: September 6, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Roger Dangel, Laurent Dellmann, Michel Despont, Bert Offrein, Stefano Oggioni
  • Publication number: 20070147729
    Abstract: An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.
    Type: Application
    Filed: December 22, 2006
    Publication date: June 28, 2007
    Inventors: Laurent Dellmann, Michel Despont, Bert Offrein, David Webb