Abstract: Substrates are connected by demountable coupling by connecting an electronic module to a substrate. An electronic module and a substrate carrying electrical and/or optical circuits are provided. A connector electrical circuit is connected between the substrate and the electronic module. The connector electrical circuit is electrically demountable dry connected to the electronic module.

Abstract: Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.

Abstract: In one general embodiment, a method is provided for fabricating magnetic structures using post-deposition tilting. A thin film magnetic transducer structure is formed on a substantially planar portion of a substrate such that a plane of deposition of the thin film transducer structure is substantially parallel to a plane of the substrate. Additionally, the thin film transducer structure is caused to tilt at an angle relative to the plane of the substrate. The thin film transducer is fixed at the angle after being tilted.

Abstract: Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.

Abstract: An article for producing an integrated device includes a deformable layer and one or more components releasably attached on one surface of the deformable layer.

Abstract: In one general embodiment, a method for fabricating magnetic structures using post-deposition tilting includes forming a thin film magnetic transducer structure on a substantially planar portion of a substrate such that a plane of deposition of the thin film transducer structure is substantially parallel to a plane of the substrate. Additionally, the thin film transducer structure is caused to tilt at an angle relative to the plane of the substrate. The thin film transducer is fixed at the angle after being tilted.

Abstract: A method for producing an integrated device. A source substrate is provided, the source substrate carrying one or more components to be attached to a receiver surface having a uneven topography. The source substrate includes a deformable layer on a surface on which the one or more components are carried. The source substrate is aligned such that said one or more components carried thereon are associated with contact areas of the receiver surface. The source substrate and the receiver surface are moved towards each other such that the one or more components are brought into contact with the contact areas wherein the deformable layer is at least partially deformed. The source substrate is removed such that the one or more of the components remain located on the contact areas of the receiver surface.

Abstract: Substrates are connected by demountable coupling by connecting an electronic module to a substrate. An electronic module and a substrate carrying electrical and/or optical circuits are provided. A connector electrical circuit is connected between the substrate and the electronic module. The connector electrical circuit is electrically demountable dry connected to the electronic module.

Abstract: A servo pattern, including stripes arranged in servo bursts for use in position error signal (PES) generation, is provided in which a stripe width is narrower than 1.7 ?m and in which the stripes are oriented at an azimuth angle which in absolute value is equal to or larger than 6 degrees.

Abstract: An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.

Abstract: A servo pattern, including stripes arranged in servo bursts for use in position error signal (PES) generation, is provided in which a stripe width is narrower than 1.7 ?m and in which the stripes are oriented at an azimuth angle which in absolute value is equal to or larger than 6 degrees.

Abstract: A three-dimensional stacked optical device includes a transparent substrate, and an optical device having a main body mounted to the transparent substrate. The optical device includes a plurality of vias that extend into the main body and do not extend into the transparent substrate. A conductive member is provided in each of the plurality of vias to form backside contacts. An electronic chip including a plurality of vias is mounted to the backside contacts on the optical device. Another conductive member is deposited in each of the plurality of vias formed in the electronic chip. The another conductive member forms additional backside contacts on the electronic chip.

Abstract: A three-dimensional stacked optical device includes a transparent substrate having at least one interconnect member, and an optical device mounted to the at least one interconnect member on the transparent substrate. The optical device includes a first surface coupled to the at least one interconnect member that extends to a second surface through an intermediate portion. An insulating layer encapsulates the optical device. The insulating layer includes a first surface that extends to a second surface. The first surface abuts the transparent substrate. A communication path extends between the first surface of the optical device and the second surface of the insulating layer. An electronic chip is mounted to the second surface of the insulating layer. The electronic chip includes a first surface and a second surface. The first surface is coupled to the communication path so as to form the three-dimensional stacked optical device.

Abstract: Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.

Abstract: A method for producing an integrated device. A source substrate is provided, the source substrate carrying one or more components to be attached to a receiver surface having a uneven topography. The source substrate includes a deformable layer on a surface on which the one or more components are carried. The source substrate is aligned such that said one or more components carried thereon are associated with contact areas of the receiver surface. The source substrate and the receiver surface are moved towards each other such that the one or more components are brought into contact with the contact areas wherein the deformable layer is at least partially deformed. The source substrate is removed such that the one or more of the components remain located on the contact areas of the receiver surface.

Abstract: Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.

Abstract: Considerable manufacturing efficiency and flexibility is provided by configuring the lower surface of a chip carrier to include multiple holes specifically designed to receive coupling fibers. By appropriately positioning these holes, the coupling fibers can be aligned with necessary optical elements of optoelectronic chips carried by the chip carrier. Similarly, the opposite end of the fibers can be appropriately configured and positioned for coupling to waveguide structures or fiber optic structures which may be embedded in printed circuit boards. By utilizing an appropriately configured chip carrier, and related fibers, a signal transmission structure is achieved which effectively bridges the gap between a chip carrier and a related printed circuit board.

Abstract: A method of forming a three-dimensional stacked optical device includes mounting at least one optical device to a transparent substrate, fabricating a plurality of vias though the at least one optical device, and filling the plurality of vias with a conductive material member that forms a plurality of backside contacts on the at least one optical device. The method further requires mounting an electronic chip to the plurality of backside contacts on the at least one optical device, fabricating a plurality of vias in the electronic chip, filling each of the plurality of vias in the electronic chip with a another conductive material member, and depositing a backside contact at each of the plurality of vias formed in the electronic chip. Each backside contact is electrically connected to corresponding ones of the another conductive material member positioned in respective ones of the plurality of vias formed in the electronic chip.

Abstract: A method of forming a three-dimensional stacked optical device includes forming a communication path on a transparent substrate and mounting at least one optical device to the communication path. The optical device includes a first surface, coupled to the transparent substrate that extends to a second surface. The method further includes embedding the at least one optical device in an insulating layer including a first surface, abutting the transparent substrate, extending to a second surface, and forming a communication path between the first surface of the optical device and the second surface of the insulating layer. The method also includes mounting an electronic chip to the second surface of the insulating layer. The electronic chip is coupled to the communication path so as to form a three-dimensional stacked optical device.

Abstract: A structure for electronics package for module packaging and a method of manufacturing a single chip module (SCM) or multi-chip module (MCM) for an opto-electronic package having an improved structure for heat dissipation and testing is disclosed. The optical transceivers are ideally located on a surface opposite to the electrical portion of the package. Variations on the module package include pluggable or socketed optical transceivers and card pacers that allow for the installation of multiple optical transceivers.