Abstract: In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.

Abstract: A modular datacenter includes a server rack, a main beam, and an attachment member. The server rack is configured to hold a plurality of servers. The main beam is configured to hold the server rack in a specific location within the modular datacenter. The attachment member is coupled to the main beam and connected to the server rack. The attachment member is configured to apply a force to the server rack to put the server rack under compression or tension, and to change the natural frequency of the server rack based on the compression or the tension and on the location of the attachment member with respect to the server rack.

Abstract: An information handling system includes a server rack chassis, an adaptor assembly, and second and third servers. The server rack chassis includes a bay adapted to receive a first server that has a height that is substantially equal to a height of the bay. The adaptor assembly is inserted within the bay and includes first, second, third, and fourth slots to receive servers. The adaptor assembly is substantially the same size and dimension as the first server. The second server is inserted within the first slot of the adaptor assembly, and includes a first communication fabric. The height of the second server is substantially equal to a quarter of the height of the bay. The third server is inserted within the second slot of the adaptor assembly, and includes a second communication fabric. The height of the third server is substantially equal to a quarter of the height of the bay.

Abstract: A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.

Abstract: A modular datacenter includes a server rack, a main beam, and an attachment member. The server rack is configured to hold a plurality of servers. The main beam is configured to hold the server rack in a specific location within the modular datacenter. The attachment member is coupled to the main beam and connected to the server rack. The attachment member is configured to apply a force to the server rack to put the server rack under compression or tension, and to change the natural frequency of the server rack based on the compression or the tension and on the location of the attachment member with respect to the server rack.

Abstract: In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.

Abstract: In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.

Abstract: The present disclosure relates, in some embodiments, to modular information handling systems configured to automatically adjust coolant flow upon insertion and/or removal of heat-releasing elements (e.g., blades). A system may comprise, for example, a chassis at least partially defining a cavity, at least one fan in fluid communication with the cavity and operable to move coolant through at least a portion of the cavity, and one or more bays. Each of the one or more bays (a) may be at least partially defined by a bay wall, (b) may be configured to receive a heat-releasing element, and/or (c) may comprise an obturator configured to conditionally block fluid communication between the bay and the chassis cavity, the fan, and/or a coolant, wherein the obturator allows fluid communication when a blade is present in the bay and blocks fluid communication when a blade is absent from the bay. A system may further comprise at least one heat-releasing element positioned in at least one of the one or more bays.

Abstract: In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.

Abstract: A rack assembly is disclosed including a frame and a housing for receiving a plurality of information handling system (IHS) components, the housing coupled to a slide assembly attachable to the frame, wherein the frame is operable to receive the housing. The assembly further includes an extendable member electrically coupling the housing to a power source disposed within the frame when the housing is in an extended position from the frame.

Abstract: A component loading system includes a board having a socket, wherein the board includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board adjacent the socket. A base member defines two base member securing holes, wherein the base member is secured to the board using the pair of first heat dissipater coupling posts such that a first heat dissipater coupling post extends through each base member securing hole. A loading member includes a pair of second heat dissipater coupling posts extending from the loading member, wherein the loading member is operable to be secured to the board by coupling the loading member to the base member and securing the loading member to the board using the first mounting member, and wherein a heat dissipater is operable to be coupled to the base member and the loading member using the pair of first heat dissipater coupling posts and the pair of second heat dissipater coupling posts.

Abstract: A component loading system includes a board having a socket, wherein the board includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board adjacent the socket. A base member defines two base member securing holes, wherein the base member is secured to the board using the pair of first heat dissipater coupling posts such that a first heat dissipater coupling post extends through each base member securing hole. A loading member includes a pair of second heat dissipater coupling posts extending from the loading member, wherein the loading member is operable to be secured to the board by coupling the loading member to the base member and securing the loading member to the board using the first mounting member, and wherein a heat dissipater is operable to be coupled to the base member and the loading member using the pair of first heat dissipater coupling posts and the pair of second heat dissipater coupling posts.

Abstract: A system includes a plurality of modular information handling systems, a chassis configured to house the plurality of modular information handling systems, a chassis support structure coupled to the chassis, and a modular system support structure coupled to a particular modular information handling system. The modular system support structure is configured to interact with the chassis support structure to support the particular modular information handling system in the chassis in a suspended manner.

Abstract: A modular datacenter includes a server rack, a main beam, and an attachment member. The server rack is configured to hold a plurality of servers. The main beam is configured to hold the server rack in a specific location within the modular datacenter. The attachment member is coupled to the main beam and connected to the server rack. The attachment member is configured to apply a force to the server rack to put the server rack under compression or tension, and to change the natural frequency of the server rack based on the compression or the tension and on the location of the attachment member with respect to the server rack.

Abstract: An electrical coupler mating system includes a chassis having a plurality of walls, wherein a chassis housing is defined between the plurality of walls. At least one of the plurality of walls defines a first guide channel and houses a cam member that is located adjacent the first guide channel. A first electrical coupler is located in the chassis housing. An enclosure includes a second electrical coupler and a cam follower that is moveably coupled to the enclosure, wherein with the cam follower located in the first guide channel, the second electrical coupler is aligned with the first electrical coupler and the movement of the cam follower mates the first electrical coupler and the second electrical coupler.

Abstract: The present disclosure relates, in some embodiments, to modular information handling systems configured to automatically adjust coolant flow upon insertion and/or removal of heat-releasing elements (e.g., blades). A system may comprise, for example, a chassis at least partially defining a cavity, at least one fan in fluid communication with the cavity and operable to move coolant through at least a portion of the cavity, and one or more bays. Each of the one or more bays (a) may be at least partially defined by a bay wall, (b) may be configured to receive a heat-releasing element, and/or (c) may comprise an obturator configured to conditionally block fluid communication between the bay and the chassis cavity, the fan, and/or a coolant, wherein the obturator allows fluid communication when a blade is present in the bay and blocks fluid communication when a blade is absent from the bay. A system may further comprise at least one heat-releasing element positioned in at least one of the one or more bays.

Abstract: A system includes a plurality of modular information handling systems, a chassis configured to house the plurality of modular information handling systems, a chassis support structure coupled to the chassis, and a modular system support structure coupled to a particular modular information handling system. The modular system support structure is configured to interact with the chassis support structure to support the particular modular information handling system in the chassis in a suspended manner.

Abstract: An electrical coupler mating system includes a chassis having a plurality of walls, wherein a chassis housing is defined between the plurality of walls. At least one of the plurality of walls defines a first guide channel and houses a cam member that is located adjacent the first guide channel. A first electrical coupler is located in the chassis housing. An enclosure includes a second electrical coupler and a cam follower that is moveably coupled to the enclosure, wherein with the cam follower located in the first guide channel, the second electrical coupler is aligned with the first electrical coupler and the movement of the cam follower mates the first electrical coupler and the second electrical coupler.

Abstract: An information handling system cooling system operates according to a thermal profile selected by a thermal profile manager based upon venting detected as available through a chassis wall. Venting through the chassis is provided, in part, by vent openings formed in a blank coupled to the chassis. A first thermal profile is selected if the blank is detected coupled to the chassis. A second thermal profile is selected if the blank is replaced with a component. The thermal profile is selected based upon detection of the component by the information handling system or, alternatively, by detection of the blank coupled to the chassis.

Abstract: Disclosed are systems and methods for receiving and manipulating the travel of a sheet material, such as paper, from a device such as an imaging device. One embodiment of a system can be implemented as a system for handling a sheet material including a flipper device that has a shaft for accelerating a sheet material, such as paper. The flipper device also has a drive system for causing the shaft to rotate. A drive system is also provided that has a direct current motor configured to drive the shaft.