Abstract: A non-invasive electrodynamic radiative electroporation system and method for safe in vivo delivery of specific radiant energy to physiologically inaccessible sites for selective destruction of biomolecular function of virions, particularly Covid-19 and its variants. The system and method applies a computer or like controller to generate, modulate, direct and deliver applied external electric fields from plural antennas to target tissues in the full respiratory tract, including lung microstructures, cardiovascular tissues and neuron networks. Electric fields exceeding a critical threshold-value interact with the virus lipid bilayer membranes, intra-membrane organelles, mRNA, and biomolecular scaffold assemblies, to destroy virion function through irreversible electroporation and electropermeabilization.

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.

Abstract: A method and system for enhanced demolding of injection molded optical devices are disclosed. In one embodiment the system includes a metal moldplate without a coat of release layer and a curing device that generates high intensity pulses of UV light. The method includes: providing a moldplate made of a predetermined moldplate material; directly injecting optical material into cavities of a moldplate without a release layer; rapidly curing the injected optical material with high intensity pulses of UV light such that a predetermined optical device is formed; and separating the thus formed optical device from the cavities of the moldplate due to a differential thermal expansion between the optical device material and the moldplate material.

Abstract: A method and system for enhanced demolding of injection molded optical devices are disclosed. In one embodiment the system includes a metal moldplate without a coat of release layer and a curing device that generates high intensity pulses of UV light. The method includes: providing a moldplate made of a predetermined moldplate material; directly injecting optical material into cavities of a moldplate without a release layer; rapidly curing the injected optical material with high intensity pulses of UV light such that a predetermined optical device is formed; and separating the thus formed optical device from the cavities of the moldplate due to a differential thermal expansion between the optical device material and the moldplate material.

Abstract: A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.

Abstract: A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits.

Abstract: A windshield wiper having a unitary structure including: a blade with a spine; at least one drain including a plurality of inlets, integrated with the blade such that the at least one drain is aligned with a flow path of precipitation guided up the blade sidewall. A coupler for connects the at least one drain via tubing to a pump. A system incorporating the windshield wiper and vehicles having the system installed are disclosed.

Abstract: A windshield wiper having a unitary structure including: a blade with a spine; at least one drain including a plurality of inlets, integrated with the blade such that the at least one drain is aligned with a flow path of precipitation guided up the blade sidewall. A coupler for connects the at least one drain via tubing to a pump. A system incorporating the windshield wiper and vehicles having the system installed are disclosed.

Abstract: A method for encryption key management including accepting authenticated unencrypted data into a processor of a server computing device that is configured as a private key secure processor vault, the operation of which is isolated from other components of the server computing device thereby preventing unauthorized access to the processor and the data contents therein; encrypting the authenticated unencrypted data based on an existing private key stored in the processor thereby converting it to encrypted data; and transmitting the encrypted data out of the processor. A system and computer program product is also provided.

Abstract: A windshield wiper including: a housing including a blade mounted therein; at least one drain tube including a plurality of inlets; and a coupler for coupling the at least one drain tube to a pump. A system incorporating the windshield wiper and vehicles having the system installed are disclosed.

Abstract: A windshield wiper having a unitary structure including: a blade with a spine; at least one drain including a plurality of inlets, integrated with the blade such that the at least one drain is aligned with a flow path of precipitation guided up the blade sidewall. A coupler for connects the at least one drain via tubing to a pump. A system incorporating the windshield wiper and vehicles having the system installed are disclosed.

Abstract: A method for data security policy enforcement including inspecting incoming and outgoing data packets from a server computing device for attributes in accordance with a data security policy, processing the data packets in accordance with the security policy based on the inspected attributes, and routing the data packets in accordance with the security policy based on the inspected attributes, wherein incoming and outgoing data from the server computing device composed of the data packets is processed and routed in accordance with the security policy on a per-packet basis. A system and computer program product is also provided.

Abstract: Methods and systems for fabrication of injection molded optical components. In one embodiment, a moldplate with cavities receives injected optical material within walls of the cavities. The cavities are designed with a geometric profile approximately corresponding to a optical profile of an optical element to be formed therein. When molten optical material is injected into the cavities of the moldplate, the injected optical material forms a meniscus due to surface tension between the optical material and the wall of the cavities. The meniscus thus provides a shape corresponding to the predetermined optical profile. The optical material is then rapidly cured with actinic radiation, and a desired optical element with high-precision dimensions is formed within the cavities of the moldplate. In some embodiments, the moldplate is spun such that the meniscus is adjusted to match the predetermined optical profile within a certain tolerance.

Abstract: Methods and systems for fabrication of injection molded optical components. In one embodiment, a moldplate with cavities receives injected optical material within walls of the cavities. The cavities are designed with a geometric profile approximately corresponding to a optical profile of an optical element to be formed therein. When molten optical material is injected into the cavities of the moldplate, the injected optical material forms a meniscus due to surface tension between the optical material and the wall of the cavities. The meniscus thus provides a shape corresponding to the predetermined optical profile. The optical material is then rapidly cured with actinic radiation, and a desired optical element with high-precision dimensions is formed within the cavities of the moldplate. In some embodiments, the moldplate is spun such that the meniscus is adjusted to match the predetermined optical profile within a certain tolerance.

Abstract: Methods and systems for fabrication of injection molded optical components are disclosed. In one embodiment, a moldplate having one or more cavities is configured to receive injected optical material within walls of the cavities. The cavities are designed with a predetermined geometric profile approximately corresponding to a predetermined optical profile of an optical element to be formed therein. When molten optical material is injected into the cavities of the moldplate, the injected optical material forms a meniscus due to surface tension between the optical material and the wall of the cavities. The meniscus thus provides a shape corresponding to the predetermined optical profile. The optical material is then rapidly cured with actinic radiation, and a desired optical element with high-precision dimensions is formed within the cavities of the moldplate.

Abstract: A method and system for enhanced demolding of injection molded optical devices are disclosed. In one embodiment the system includes a metal moldplate without a coat of release layer and a curing device that generates high intensity pulses of UV light. The method includes: providing a moldplate made of a predetermined moldplate material; directly injecting optical material into cavities of a moldplate without a release layer; rapidly curing the injected optical material with high intensity pulses of UV light such that a predetermined optical device is formed; and separating the thus formed optical device from the cavities of the moldplate due to a differential thermal expansion between the optical device material and the moldplate material.

Abstract: Disclosed are a microlens array, and a method of positioning and aligning the microlens array on another device. Generally, the microlens array comprises an array of injection molded microlens elements, and a supporting flange. Each of the microlens elements has a generally spheroid or spherical shape, and the supporting flange connects together the array of microlens elements to facilitate positioning that array of lenses on a printed circuit board, semiconductor package or wafer. This array is well suited for use with vertical cavity surface emitting lasers (VCSELs); and, in particular, the preferred embodiment of the invention addresses the problem of VCSEL laser array alignment by using arrays of microlenses elements fabricated by injection molding.