Abstract: Implantable medical device having a feedthrough, a feedthrough and method for making such feedthrough. The feedthrough has a ferrule, an electrically conductive pin, a preform having a preform liquidus temperature, a capacitor, positioned within the ferrule abutting the preform, having a coating having a coating liquidus temperature and being configured to electrically couple with the preform, and an insulative assembly configured, at least in part, to seal against passage of a liquid through the ferrule, and having an insulative assembly liquidus temperature. The coating liquidus temperature is greater than the preform liquidus temperature and the coating liquidus temperature being greater than the insulative assembly liquidus temperature.

Abstract: A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.

Abstract: An implantable medical electrode includes a substrate and an iridium oxide surface, which is formed by an iridium oxide film applied over a roughened surface of the substrate. The film is preferably applied via direct current magnetron sputtering in a sputtering atmosphere comprising argon and oxygen. A sputtering target power may be between approximately 80 watts and approximately 300 watts, and a total sputtering pressure may be between approximately 9 millitorr and approximately 20 millitorr. The iridium oxide film may have a thickness greater than or equal to approximately 15,000 angstroms and have a microstructure exhibiting a columnar growth pattern.

Abstract: An implantable medical electrode includes a substrate and an iridium oxide surface, which is formed by an iridium oxide film applied over a roughened surface of the substrate. The film is preferably applied via direct current magnetron sputtering in a sputtering atmosphere comprising argon and oxygen. A sputtering target power may be between approximately 80 watts and approximately 300 watts, and a total sputtering pressure may be between approximately 9 millitorr and approximately 20 millitorr. The iridium oxide film may have a thickness greater than or equal to approximately 15,000 angstroms and have a microstructure exhibiting a columnar growth pattern.

Abstract: An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA includes conductive strips connected to a non-conductive block. The non-conductive block possesses, a top side, a bottom side, a front side and a back side. A seamless non-conductive barrier extends from the bottom side and between the front side and the back side. The barrier prevents a pin from contacting another pin and eliminates welding of the ground pin to the side of the ferrule.

Abstract: A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees.

Abstract: An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA comprises a non-conductive block having a top side, a bottom side, a front side and a back side. A plurality of conductive strips are coupled to the non-conductive block. Each conductive strip possesses a front side and a back side. The back side of each conductive strip extends from the front side across the top side and over to back side of the non-conductive block.

Abstract: Implantable medical device having a feedthrough, a feedthrough and method for making such feedthrough. The feedthrough has a ferrule, an electrically conductive pin, a preform having a preform liquidus temperature, a capacitor, positioned within the ferrule abutting the preform, having a coating having a coating liquidus temperature and being configured to electrically couple with the preform, and an insulative assembly configured, at least in part, to seal against passage of a liquid through the ferrule, and having an insulative assembly liquidus temperature. The coating liquidus temperature is greater than the preform liquidus temperature and the coating liquidus temperature being greater than the insulative assembly liquidus temperature.

Abstract: Feedthrough and method for making a feedthrough. The feedthrough has a ferrule forming a ferrule lumen, an electrically conductive pin extending longitudinally through at least a portion of the ferrule lumen, a filter capacitor surrounding the electrically conductive pin within the ferrule lumen, the filter capacitor having a bonding surface, and a ceramic seal positioned within the ferrule lumen directly abutting the filter capacitor sealing a space between the electrically conductive pin and the ferrule. The ceramic seal adheres to and creates an adhesive bond with the bonding surface of the capacitor and substantially inhibits fluid flow through the ferrule lumen.

Abstract: A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees.

Abstract: An implantable medical electrode comprising an electrode substrate having an exterior surface, and a zirconium nitride coating disposed over the exterior surface.

Abstract: A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.

Abstract: A feedthrough assembly, as well as a method of forming a feedthrough assembly, including a metallic ferrule, and a biocompatible, non-conductive, high-temperature, co-fired insulator engaged with the metallic ferrule at an interface between the ferrule and the insulator. The insulator includes a first surface at the interface and a second surface internal to the insulator. At least one conductive member may be disposed at the second surface, wherein at least the first surface of the insulator is devoid of surface cracks greater than 30 ?m. The first surface of the insulator may also be devoid of a surface roughness greater than 0.5 ?m.

Abstract: An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA includes conductive strips connected to a non-conductive block. The non-conductive block possesses, a top side, a bottom side, a front side and a back side. A seamless non-conductive barrier extends from the bottom side and between the front side and the back side. The barrier prevents a pin from contacting another pin and eliminates welding of the ground pin to the side of the ferrule.

Abstract: An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA comprises a non-conductive block having a top side, a bottom side, a front side and a back side. A plurality of conductive strips are coupled to the non-conductive block. Each conductive strip possesses a front side and a back side. The back side of each conductive strip extends from the front side across the top side and over to back side of the non-conductive block.

Abstract: A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.

Abstract: An implantable medical electrode includes a substrate and an iridium oxide surface, which is formed by an iridium oxide film applied over a roughened surface of the substrate. The film is preferably applied via direct current magnetron sputtering in a sputtering atmosphere comprising argon and oxygen. A sputtering target power may be between approximately 80 watts and approximately 300 watts, and a total sputtering pressure may be between approximately 9 millitorr and approximately 20 millitorr. The iridium oxide film may have a thickness greater than or equal to approximately 15,000 angstroms and have a microstructure exhibiting a columnar growth pattern.

Abstract: A hermetic interconnect for implantable medical devices is presented. In one embodiment, the hermetic interconnect includes a conductive material introduced to a via in a single layer. The conductive material includes a first end and a second end. A first bonding pad is coupled to the first end of the conductive material. A second bonding pad is coupled to the second end of the conductive material. The single layer and the conductive material undergo a co-firing process.

Abstract: An implantable medical electrode comprising an electrode substrate having an exterior surface, and a zirconium nitride coating disposed over the exterior surface.

Abstract: The invention includes a family of miniaturized, hermetic electrical feedthrough assemblies adapted for implantation within a biological system. An electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device such as an implantable pulse generator, cardioverter-defibrillator, physiologic sensor, drug-delivery system and the like. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. Such an assembly is fabricated by interconnected electrical pathways, or vias, of a conductive metallic paste disposed between ceramic green-state material. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one embedded metallization pathway extending through the structure. The metallization pathway reliably conducts electrical signals even when exposed to body fluids and tissue and providing reliable electrical communication.