Abstract: A surface area of an IMD electrode is increased by forming a conductive layer over an external portion of a sidewall of an IMD connector header and electrically coupling the conductive layer of the connector header to a conductive mounting surface of a hermetically sealed IMD housing; wherein the conductive mounting surface is an extension of an external conductive surface of the IMD, which external conductive surface forms the IMD electrode that is increased in surface area by the conductive layer formed over the connector header.

Abstract: A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.

Abstract: A surface area of an IMD electrode is increased by forming a conductive layer over an external portion of a sidewall of an IMD connector header and electrically coupling the conductive layer of the connector header to a conductive mounting surface of a hermetically sealed IMD housing; wherein the conductive mounting surface is an extension of an external conductive surface of the IMD, which external conductive surface forms the IMD electrode that is increased in surface area by the conductive layer formed over the connector header.

Abstract: A feed-through assembly for an IMD and a method for fabricating the same are provided. The feed-through assembly has a ferrule having a first aperture disposed therethrough. An insulating member is disposed at least partially within the first aperture. The insulating member has a second aperture, an inside surface and an outside surface. A metallization region overlies at least a portion of the inside surface and at least a portion of the outside surface of the insulating member. The metallization region is formed of a first layer of titanium and a second layer of niobium. A portion of a terminal pin of platinum is disposed through the second aperture. A first brazing seal is disposed between the insulating member and the ferrule and a second brazing seal is disposed between the insulating member and the terminal pin. The first and second brazing seals are formed of gold.

Abstract: A feed-through assembly for an IMD and a method for fabricating the same are provided. The feed-through assembly has a ferrule having a first aperture disposed therethrough. An insulating member is disposed at least partially within the first aperture. The insulating member has a second aperture, an inside surface and an outside surface. A metallization region overlies at least a portion of the inside surface and at least a portion of the outside surface of the insulating member. The metallization region is formed of a first layer of titanium and a second layer of niobium. A portion of a terminal pin of platinum is disposed through the second aperture. A first brazing seal is disposed between the insulating member and the ferrule and a second brazing seal is disposed between the insulating member and the terminal pin. The first and second brazing seals are formed of gold.