Abstract: A structure for receiving electrical signals near a central portion of the structure and distributing the electrical signals to a peripheral portion of the structure. The structure has a first set of contacts arranged in an array near the central portion of the structure. Electrically conductive traces connect the first set of contacts to a second set of contacts, where each of the electrically conductive traces has at least a first segment, a second segment, and a third segment. The first segment of each of the electrically conductive traces has relatively narrow width and spacing. The first segment of each of the electrically conductive traces is connected on a first end of the first segment to one of the first set of contacts and on a second end of the first segment to the second segment of each of the electrically conductive traces. The second segment of each of the electrically conductive traces has relatively intermediate width and spacing.

Abstract: A method for assigning signal traces to one of a plurality of power planes on a power layer of an integrated circuit package. The integrated circuit package has an integrated circuit signal contact region, a top routing layer, and a bottom routing layer. The power layer underlies both the top routing layer and the bottom routing layer. First signal traces on the bottom routing layer are routed from contacts disposed in a core portion of the integrated circuit signal contact region to first ball contacts disposed within a first perimeter of the integrated circuit package. The first perimeter has dimension corresponding to a first distance from the integrated circuit signal contact region. Second signal traces on the top routing layer are routed from contacts disposed in a peripheral portion of the integrated circuit signal contact region to second ball contacts.