Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.

Abstract: This application relates to an enclosure for a portable electronic device. The enclosure includes a protruding trim structure having walls that define a cavity, where the protruding trim structure is capable of carrying an electronic component within the cavity. The enclosure further includes a support plate that is coupled to the enclosure and the protruding trim structure, and a brace structure that secures and supports the protruding trim structure such that when the protruding trim structure is exposed to an external load during a drop event, the protruding trim structure is capable of redirecting an amount of the load away from the protruding trim structure and the electronic component.

Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.

Abstract: An electronic device has an electrically adjustable shutter. The shutter may be placed in a transparent state or a nontransparent state. The shutter may overlap a portion of a display, may overlap a liquid contact indictor or a structure with text in a device, or may overlap an optical component such as an optical proximity sensor, ambient light sensor, visible light-emitting diode or laser, infrared light-emitting diode or laser, visible light image sensor, or infrared light image sensor. Control circuitry in the electronic device may place the shutter in an opaque state to hide an overlapped component from view or may place the shutter in a transparent state to allow the overlapped component to transmit or receive light. The adjustable shutter may exhibit changes in its transmission spectrum in different modes of operation and may be used as a camera filter or neutral density filter.

Abstract: An electronic device can include a camera and a cover glass arrangement disposed over the camera. The cover glass arrangement includes a thinner region or cover glass that is positioned over a light-receiving region of the camera. Additionally, the thinner region or cover glass can be disposed over the light-receiving region and at least parts of one or more non-light receiving regions of the camera.

Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.

Abstract: An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.

Abstract: An electronic device has an exterior housing with a piezoelectric speaker disposed in an opening formed within the housing. The piezoelectric speaker includes a speaker diaphragm that is secured within the opening with a vibration isolator. The vibration isolator allows the diaphragm to vibrate independently from the housing.

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.

Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

Abstract: An electronic device has an exterior housing with a piezoelectric speaker disposed in an opening formed within the housing. The piezoelectric speaker includes a speaker diaphragm that is secured within the opening with a vibration isolator. The vibration isolator allows the diaphragm to vibrate independently from the housing.

Abstract: An electronic device has an exterior housing with a piezoelectric speaker disposed in an opening formed within the housing. The piezoelectric speaker includes a speaker diaphragm that is secured within the opening with a vibration isolator. The vibration isolator allows the diaphragm to vibrate independently from the housing.

Abstract: Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly may include a first conductive contact pad coupled to a first board of a switch, a second conductive contact pad coupled to a second board of the switch, and a layer of conductive adhesive between the first conductive pad and the second conductive pad, where the layer is operative to provide a seal for the switch.

Abstract: Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly includes a switch, a button positioned over the switch, where the button is operative to close at least one circuit of the switch when the button is depressed towards the switch, an actuator positioned underneath the button to at least partially enclose at least one switch element, where the actuator is operative to deform when the button is depressed, and a weld plate welded to an underside surface of the button with at least one sonic weld joint to create a seal around the actuator and the at least one switch element, where a portion of the actuator is secured between the underside surface of the button and the weld plate.

Abstract: Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly may include a contact area coupled to a circuit board for a switch, a conductive covering for enclosing the circuit board, and a dome positioned over the conductive covering, where the dome is operative to close at least one circuit of the switch when the dome is depressed towards the conductive covering.

Abstract: An electronic device can include a camera and a cover glass arrangement disposed over the camera. The cover glass arrangement includes a thinner region or cover glass that is positioned over a light-receiving region of the camera. Additionally, the thinner region or cover glass can be disposed over the light-receiving region and at least parts of one or more non-light receiving regions of the camera.

Abstract: An electronic device may be provided with electrical components mounted in an electronic device housing. A display module may be attached to a display cover layer with a layer of adhesive to form a display module assembly. The display module assembly and a backlight unit assembly may together form a display that is mounted within an electronic device housing. A support structure that supports the display cover layer may be integrated with the backlight unit assembly. The support structure may have an upper surface to which the display cover layer is attached and a lower portion that is molded to a metal chassis that supports the backlight unit. The lower portion of the support structure may form a plastic chassis that surrounds the backlight unit. In this way, an integrated support structure may be used to support both the display module and the backlight unit.