Abstract: An electronic device can include a camera and a cover glass arrangement disposed over the camera. The cover glass arrangement includes a thinner region or cover glass that is positioned over a light-receiving region of the camera. Additionally, the thinner region or cover glass can be disposed over the light-receiving region and at least parts of one or more non-light receiving regions of the camera.

Abstract: An electronic device has a display mounted in a housing using a plastic display frame. The display has an active area and an inactive area. A display cover layer may have polymer coating layers in the inactive area. The display frame may lie under the inactive area. A patterned metal coating layer may be formed on the display frame. The patterned metal coating layer may have portions that form adhesion promotion structures for promoting adhesion between the frame and the adhesive. The patterned metal coating layer may also have portions that form antenna structures. The antenna structures may be used to transmit and receive radio-frequency signals and may be used as adhesion promotion structures. Adhesive may be interposed between the polymer coating layers and the metal coating layer on the display frame to attach the display cover layer and the display to the display frame.

Abstract: This application relates to a portable electronic device includes at least a device housing having walls that define a cavity, the walls having edges that define an opening that leads into the cavity. Component assembly features used to secure components received through the opening to each other and/or to the walls during an assembly operation, and a protective cover formed of transparent material and disposed within the opening and secured to the housing.

Abstract: An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.

Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.

Abstract: An electronic device may contain a camera, a camera flash, and a display in a housing. The camera flash or the display may provide illumination while capturing images with camera. The camera flash may be formed from light guiding structures that receive camera flash light from a light source. The camera flash may be located under a speaker port mesh. A speaker port may contain a camera and a camera flash. Light guiding structures may have a ring shape with an opening. A speaker port, camera, or button may be located within the opening. A button may have an opaque portion in which a transparent light guiding structure for a camera flash is embedded. Camera flash structures may produce camera flash light to capture images and can serve as a status indicator to indicate when a message is received or other state change is detected during operation.

Abstract: An electronic device may be provided with electrical components mounted in an electronic device housing. A display module may be attached to a display cover layer with a layer of adhesive to form a display module assembly. The display module assembly and a backlight unit assembly may together form a display that is mounted within an electronic device housing. A support structure that supports the display cover layer may be integrated with the backlight unit assembly. The support structure may have an upper surface to which the display cover layer is attached and a lower portion that is molded to a metal chassis that supports the backlight unit. The lower portion of the support structure may form a plastic chassis that surrounds the backlight unit. In this way, an integrated support structure may be used to support both the display module and the backlight unit.

Abstract: An electronic device has a display mounted in a housing using a plastic display frame. The display has an active area and an inactive area. A display cover layer may have polymer coating layers in the inactive area. The display frame may lie under the inactive area. A patterned metal coating layer may be formed on the display frame. The patterned metal coating layer may have portions that form adhesion promotion structures for promoting adhesion between the frame and the adhesive. The patterned metal coating layer may also have portions that form antenna structures. The antenna structures may be used to transmit and receive radio-frequency signals and may be used as adhesion promotion structures. Adhesive may be interposed between the polymer coating layers and the metal coating layer on the display frame to attach the display cover layer and the display to the display frame.

Abstract: An electronic device has a display mounted in a housing using a plastic display frame. The display has an active area and an inactive area. A display cover layer may have polymer coating layers in the inactive area. The display frame may lie under the inactive area. A patterned metal coating layer may be formed on the display frame. The patterned metal coating layer may have portions that form adhesion promotion structures for promoting adhesion between the frame and the adhesive. The patterned metal coating layer may also have portions that form antenna structures. The antenna structures may be used to transmit and receive radio-frequency signals and may be used as adhesion promotion structures. Adhesive may be interposed between the polymer coating layers and the metal coating layer on the display frame to attach the display cover layer and the display to the display frame.

Abstract: An electronic device can include a camera and a cover glass arrangement disposed over the camera. The cover glass arrangement includes a thinner region or cover glass that is positioned over a light-receiving region of the camera. Additionally, the thinner region or cover glass can be disposed over the light-receiving region and at least parts of one or more non-light receiving regions of the camera.

Abstract: A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate.

Abstract: This application relates primarily to various apparatus and method for securing and protecting a camera module within a device housing. The securing and protecting elements are configured to take up minimal space within the device housing so that available space for the camera module is maximized. In some embodiments the securing elements can also include grounding features.

Abstract: An electronic device can include a camera and a cover glass arrangement disposed over the camera. The cover glass arrangement includes a thinner region or cover glass that is positioned over a light-receiving region of the camera. Additionally, the thinner region or cover glass can be disposed over the light-receiving region and at least parts of one or more non-light receiving regions of the camera.

Abstract: An electronic device has a display mounted in a housing using a plastic display frame. The display has an active area and an inactive area. A display cover layer may have polymer coating layers in the inactive area. The display frame may lie under the inactive area. A patterned metal coating layer may be formed on the display frame. The patterned metal coating layer may have portions that form adhesion promotion structures for promoting adhesion between the frame and the adhesive. The patterned metal coating layer may also have portions that form antenna structures. The antenna structures may be used to transmit and receive radio-frequency signals and may be used as adhesion promotion structures. Adhesive may be interposed between the polymer coating layers and the metal coating layer on the display frame to attach the display cover layer and the display to the display frame.

Abstract: An electronic device can include a camera and a cover glass arrangement disposed over the camera. The cover glass arrangement includes a thinner region or cover glass that is positioned over a light-receiving region of the camera. Additionally, the thinner region or cover glass can be disposed over the light-receiving region and at least parts of one or more non-light receiving regions of the camera.

Abstract: A method of using ultrasonic energy to secure a first and a second component is described, and an apparatus formed therefrom. A first layer is bonded to a second layer by converting ultrasonic energy into thermal energy. The energy conversions means is an energy director. A thermally sensitive layer receives the thermal energy and at least a portion of the thermally sensitive layer melts. The resultant melting bonds the first layer with the second layer. A different energy director may also be included and used to convert thermal energy in order to de-bond the first layer from the second layer in order to perform, for example, a rework.

Abstract: This application relates primarily to various apparatus and method for securing and protecting a camera module within a device housing. The securing and protecting elements are configured to take up minimal space within the device housing so that available space for the camera module is maximized. In some embodiments the securing elements can also include grounding features.

Abstract: Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly may include a contact area coupled to a circuit board for a switch, a conductive covering for enclosing the circuit board, and a dome positioned over the conductive covering, where the dome is operative to close at least one circuit of the switch when the dome is depressed towards the conductive covering.

Abstract: Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly may include a first conductive contact pad coupled to a first board of a switch, a second conductive contact pad coupled to a second board of the switch, and a layer of conductive adhesive between the first conductive pad and the second conductive pad, where the layer is operative to provide a seal for the switch.

Abstract: Systems and methods for providing input component assemblies for dome switches are provided. In some embodiments, an input component assembly includes a switch, a button positioned over the switch, where the button is operative to close at least one circuit of the switch when the button is depressed towards the switch, an actuator positioned underneath the button to at least partially enclose at least one switch element, where the actuator is operative to deform when the button is depressed, and a weld plate welded to an underside surface of the button with at least one sonic weld joint to create a seal around the actuator and the at least one switch element, where a portion of the actuator is secured between the underside surface of the button and the weld plate.